Scott A Goodman

US Patent:

6363792, Apr 2, 2002

Filed:

Apr 9, 1999

Appl. No.:

09/288905

Inventors:

Anthony D. Kurtz - Teaneck NJ
Scott J. Goodman - Wayne NJ
Robert Gardner - Westwood NJ

Assignee:

Kulite Semiconductor Products, Inc.

International Classification:

G01L 900

US Classification:

73753, 73708

Abstract:

A hermetically sealed high temperature pressure transducer assembly including: a sensor wafer that includes a plurality of sensor structures and contact areas selectively interconnected and formed on a surface thereof is provided. A first header assembly coupled to the sensor wafer includes a plurality of pins, each of which are electrically coupled to an associated contact area. A second header assembly is coupled to the first assembly and to a sleeve, and includes a plurality of tubes into each of which one of the plurality of pins is positioned. A temperature insulated cable is partially positioned within the sleeve and includes a plurality of wires coupled to the pins. A third header apparatus is coupled to the sleeve and includes a plurality of closed-ended tubes for serving as leads, where each one of the plurality of wires is partially positioned in and coupled to a respective closed-end tube.

US Patent:

6530282, Mar 11, 2003

Filed:

Jan 31, 2002

Appl. No.:

10/066086

Inventors:

Anthony D. Kurtz - Teaneck NJ
Scott J. Goodman - Wayne NJ
Robert Gardner - Westwood NJ

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L 700

US Classification:

73756, 73708

Abstract:

A hermetically sealed high temperature pressure transducer assembly including: a sensor wafer that includes a plurality of sensor structures and contact areas selectively interconnected and formed on a surface thereof is provided. A first header assembly coupled to the sensor wafer includes a plurality of pins, each of which are electrically coupled to an associated contact area. A second header assembly is coupled to the first assembly and to a sleeve, and includes a plurality of tubes into each of which one of the plurality of pins is positioned. A temperature insulated cable is partially positioned within the sleeve and includes a plurality of wires coupled to the pins. A third header apparatus is coupled to the sleeve and includes a plurality of closed-ended tubes for serving as leads, where each one of the plurality of wires is partially positioned in and coupled to a respective closed-end tube.

US Patent:

6895822, May 24, 2005

Filed:

Jun 30, 2003

Appl. No.:

10/609786

Inventors:

Anthony D. Kurtz - Ridgewood NJ, US
Scott J. Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L019/04

US Classification:

73708, 73746, 338306, 338308

Abstract:

A novel method for interconnecting leads in a high pressure transducer without the use of solder employs a ceramic disc containing a number of through holes. Each hole has a tube inserted therein, which tubes are connected to the disc by brazing or a high temperature attachment. Each tube protrudes from both sides of the ceramic. The ceramic is coated in appropriate areas with molymanganese film, which is over plated with gold. This overcoat forms a brazed compound surface attached to the tubes of the ceramic. A semiconductor pressure transducer has output leads which are inserted through the ceramic into each tube. The other side end of the tube receives high temperature wires from a suitable connecting device. Each tube is then crimped and spot-welded to hold both the lead from the transducer and the high temperature leads to produce a strong bond without the use of solder. The header itself it typically welded to a pressure point.

US Patent:

8631709, Jan 21, 2014

Filed:

Nov 8, 2011

Appl. No.:

13/291578

Inventors:

Scott J. Goodman - Wayne NJ, US
Alexander A. Ned - Kinnelon NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L 9/06

US Classification:

73727, 73715, 3612834

Abstract:

A novel flexible transducer structure is suitable for attaching to curved surface such as the leading edge of an aircraft wing. The structure comprises a thin flexible sheet of an insulating material with a leadless transducer secured to the sheet. The sheet is then placed over the curved surface and assumes the curvature of the surface. The transducer secured to the sheet provides an output of pressure according the pressure exerted on the sheet. The sheet basically is fabricated from a thin material such as Kapton and is flexible so as to assume the curvature of the surface with the transducer being exposed to pressure applied to the curved surface. The sensor in conjunction with the flexible sheet allows pressure to be measured without disturbing the air flow patterns of the measuring surfaces and because of its construction, is moisture resistant over a large variety of atmospheric conditions.

US Patent:

D643024, Aug 9, 2011

Filed:

Feb 18, 2011

Appl. No.:

29/385715

Inventors:

Scott Goodman - Muttontown NY, US
Min Yang - Hicksville NY, US
Douglas Bryant - Centerport NY, US
David Waterman - Hong Kong, CN

Assignee:

Samson Technologies Corp. - Hauppauge NY

International Classification:

1401

US Classification:

D14227

US Patent:

62109898, Apr 3, 2001

Filed:

Sep 17, 1999

Appl. No.:

9/398969

Inventors:

Anthony D. Kurtz - Ridgewood NJ
Alexander Ned - Wayne NJ
Scott J. Goodman - Wayne NJ

Assignee:

Kulite Semiconductor Products Inc. - Leonia NJ

International Classification:

H01L 2720

US Classification:

438 51

Abstract:

There is disclosed a semiconductor sensor device comprising a semiconductor diaphragm member having a top surface coated with an oxide layer; P+ sensor elements fusion bonded to the oxide layer at a relatively central area of the diaphragm; P+ finger elements fusion bonded to the oxide layer extending from the sensors to an outer contact location of the diaphragm for each finger; and an external rim of P+ material fusion bonded to the oxide layer and surrounding the sensors and fingers. A first glass wafer member is electrostatically bonded at a bottom surface to the fingers and rim to hermetically seal the sensors and fingers of the diaphragm member. The first glass wafer includes a depression above the sensors and has a plurality of apertures, where each aperture is associated with a separate finger at the contact location and each aperture being smaller than the associated finger lining up with the contact location wherein each contact location can be accessed via the associated aperture in the first glass wafer member. A second glass wafer member is sealingly coupled to a top surface of the first glass wafer and has a plurality of apertures aligned with the plurality of apertures of the first glass wafer member and containing a group of hermetically sealed pins for coupling to the contact locations.

US Patent:

50867857, Feb 11, 1992

Filed:

Aug 10, 1989

Appl. No.:

7/392127

Inventors:

Christopher T. Gentile - New York NY
Michael Wallace - Beaverton OR
Timothy D. Avalon - Portland OR
Scott Goodman - Hermosa Beach CA
Richard Fuller - Sherman Oaks CA
Tracy Hall - Cupertino CA

Assignee:

Abrams/Gentille Entertainment Inc. - New York NY

International Classification:

A61B 511

US Classification:

128782

Abstract:

A sensor for detecting angular displacement of an object. The sensor comprises a substrate for attachment to the object whose angular displacement is to be sensed and a sensing means attached to the substrate and connectable into an electric circuit. The electric circuit measures the resistance of the sensing means, which changes as a function of the angular displacement. Several embodiments are disclosed, including a conductive elastomer sensor, a conductive ink sensor, a sliding resistor sensor, a force sensitive resistor sensor and a conductive fluid sensor.

US Patent:

59735902, Oct 26, 1999

Filed:

Mar 12, 1998

Appl. No.:

9/041228

Inventors:

Anthony D. Kurtz - Ridgewood NJ
Alexander Ned - Wayne NJ
Scott J. Goodman - Wayne NJ

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

H01C 1010

US Classification:

338 42

Abstract:

A semiconductor sensor device including a semiconductor diaphragm member having a top surface coated with an oxide layer; P+ sensor elements fusion bonded to the oxide layer at a relatively central area of the diaphragm; P+ finger elements fusion bonded to the oxide layer extending from the sensors to an outer contact location of the diaphragm for each finger; and an external rim of P+ material fusion bonded to the oxide layer and surrounding the sensors and fingers. A first glass wafer member is electrostatically bonded at a bottom surface to the fingers and rim to hermetically seal the sensors and fingers of the diaphragm member. The first glass wafer includes a depression above the sensors and has a plurality of apertures, where each aperture is associated with a separate finger at the contact location and each aperture being smaller than the associated finger lining up with the contact location wherein each contact location can be accessed via the associated aperture in the first glass wafer member. A second glass wafer member is sealingly coupled to a top surface of the first glass wafer and has a plurality of apertures aligned with the plurality of apertures of the first glass wafer member and containing a group of hermetically sealed pins for coupling to the contact locations.