Scott W Goodman

US Patent:

6895822, May 24, 2005

Filed:

Jun 30, 2003

Appl. No.:

10/609786

Inventors:

Anthony D. Kurtz - Ridgewood NJ, US
Scott J. Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L019/04

US Classification:

73708, 73746, 338306, 338308

Abstract:

A novel method for interconnecting leads in a high pressure transducer without the use of solder employs a ceramic disc containing a number of through holes. Each hole has a tube inserted therein, which tubes are connected to the disc by brazing or a high temperature attachment. Each tube protrudes from both sides of the ceramic. The ceramic is coated in appropriate areas with molymanganese film, which is over plated with gold. This overcoat forms a brazed compound surface attached to the tubes of the ceramic. A semiconductor pressure transducer has output leads which are inserted through the ceramic into each tube. The other side end of the tube receives high temperature wires from a suitable connecting device. Each tube is then crimped and spot-welded to hold both the lead from the transducer and the high temperature leads to produce a strong bond without the use of solder. The header itself it typically welded to a pressure point.

US Patent:

7275444, Oct 2, 2007

Filed:

Jul 13, 2006

Appl. No.:

11/486351

Inventors:

Anthony D. Kurtz - Saddle River NJ, US
Scott Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L 13/02

US Classification:

73716, 73717, 73753

Abstract:

A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header. Suitable leads from the dual die pressure header assembly are directed to a terminal board which is mounted within a pressure transducer housing shell, which terminal board coacts with an outboard contact cap assembly forming the transducer. The pressure header assembly portion also contains extending tabs which have apertures for external mounting.

US Patent:

7307325, Dec 11, 2007

Filed:

Jan 20, 2005

Appl. No.:

11/039587

Inventors:

Anthony D. Kurtz - Saddle River NJ, US
Alexander A. Ned - Wayne NJ, US
Scott J. Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

H01L 29/84
H01L 31/058

US Classification:

257417, 257414, 257467

Abstract:

A silicon wafer is fabricated utilizing two or more semiconductor wafers. The wafers are processed using conventional wafer processing techniques and the wafer contains a plurality of output terminals which essentially are platinum titanium metallization or high temperature contacts. A glass cover member is provided which has a plurality of through holes. Each through hole is associated with a contact on the semiconductor wafer. A high temperature lead is directed through the through hole or aperture in the glass cover and is bonded directly to the appropriate contact. The lead is of a sufficient length to extend into a second non through aperture in the contact glass. The non through aperture is located on the side of the contact glass not in contact with the silicon sensor. The non through aperture is then filled with a high temperature conductive glass frit. A plurality of slots are provided.

US Patent:

7331241, Feb 19, 2008

Filed:

Aug 22, 2006

Appl. No.:

11/508089

Inventors:

Anthony D. Kurtz - Saddle River NJ, US
Scott Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L 9/00

US Classification:

73753, 73754, 73756

Abstract:

A low cost sensor assembly for measuring oxygen pressures contains a transistor header. The transistor header has terminal pins extending therefrom. The transistor header co-acts with a first circuit insulator board. The first circuit board has deposited thereon four hand mirror shaped contact areas each one associated with one of the terminal pins of the transistor header. The top portion of each contact areas has an aperture with the extending arm of the area directed towards the center of the board. The board is epoxied to the transistor header with the terminal pins of the header extending into the apertures of the contact board. A second contact board is then epoxied to the first contact board. The second contact board has a series of four apertures located at the center. Each of the apertures of the second board contacts the handle portion of the mirror patterns of the first board.

US Patent:

7540196, Jun 2, 2009

Filed:

Oct 9, 2007

Appl. No.:

11/973507

Inventors:

Anthony D. Kurtz - Saddle River NJ, US
Scott Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L 7/00

US Classification:

73714, 73753

Abstract:

A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header. Suitable leads from the dual die pressure header assembly are directed to a terminal board which is mounted within a pressure transducer housing shell, which terminal board coacts with an outboard contact cap assembly forming the transducer. The pressure header assembly portion also contains extending tabs which have apertures for external mounting.

US Patent:

7624637, Dec 1, 2009

Filed:

Sep 14, 2007

Appl. No.:

11/901021

Inventors:

Anthony D. Kurtz - Saddle River NJ, US
Scott Goodman - Wayne NJ, US
Adam Kane - Morristown NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01P 15/10
G01P 15/12

US Classification:

7351429, 7351433

Abstract:

An accelerometer includes a cantilever mass with a thin beam element between the mass and the fixed end of the accelerometer. The end of the mass is tapered. A limiting member has an aperture that is tapered corresponding to the taper at the end of the mass and positioned to surround the tapered end of the seismic mass. The beam accelerometer as well as the limiting member is placed in a cylindrical housing whereby the limiting member is moved along the taper of the seismic mass to adjust the spacing between the limiting member and the inner wall of the housing to thereby adjust the amount of movement of the seismic mass. In one embodiment the aperture of the tapered limited member also surrounds the seismic mass but the gap between the inner wall of the tapered limiting member and the outer wall of the seismic mass is adjusted to determine the amount of movement of the beam. In this manner, one can utilize a beam accelerometer arrangement of a cylindrical configuration within a housing and whereby the seismic mass has a taper and the taper coacts with a limiting member which has a corresponding taper to adjust the distance that the beam can move upon application of a force thereto.

US Patent:

7762139, Jul 27, 2010

Filed:

Nov 24, 2008

Appl. No.:

12/313761

Inventors:

Anthony D. Kurtz - Saddle River NJ, US
Scott Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L 7/00

US Classification:

73714, 73756

Abstract:

A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header. Suitable leads from the dual die pressure header assembly are directed to a terminal board which is mounted within a pressure transducer housing shell, which terminal board coacts with an outboard contact cap assembly forming the transducer. The pressure header assembly portion also contains extending tabs which have apertures for external mounting.

US Patent:

7874216, Jan 25, 2011

Filed:

Oct 20, 2008

Appl. No.:

12/288363

Inventors:

Anthony D. Kurtz - Saddle River NJ, US
Alexander Ned - Kinnelon NJ, US
Scott Goodman - Wayne NJ, US

Assignee:

Kulite Semiconductor Products, Inc. - Leonia NJ

International Classification:

G01L 13/02

US Classification:

73716, 257414

Abstract:

There is disclosed a method and apparatus for mounting a leadless semiconductor chip on a header. The semiconductor chip has contacts on a surface and the chip is of a specified geometric shape. The header has a contact surface for receiving the chip with the contact surface of the header containing header contact pins, which pins have to contact the contacts on the semiconductor chip. The header has a guide pin extending from the contact surface and there is a guide plate which has an aperture adapted to be placed over the guide pin, the guide plate further has a chip accommodating aperture of the same geometric shape as the chip. The guide plate, when placed over the guide pin enables the chip to be placed in the chip accommodating aperture so that the contacts of the header pin are properly and accurately aligned with respect to the contacts on the semiconductor chip.