Ortho Northeast 5050 N Clinton St, Fort Wayne, IN 46825 (260)4848551 (phone), (260)4825060 (fax)
Ortho NortheastOrthopaedics Northeast 7920 W Jefferson Blvd STE 100, Fort Wayne, IN 46804 (260)4590917 (phone), (260)4825060 (fax)
Ortho NortheastOrthopedics Northeast 11136 Parkview Cir Dr, Fort Wayne, IN 46845 (260)4829273 (phone), (260)4825060 (fax)
Education:
Medical School University of Michigan Medical School Graduated: 1981
Procedures:
Hallux Valgus Repair Joint Arthroscopy Lower Leg/Ankle Fractures and Dislocations Spinal Surgery Arthrocentesis Lower Arm/Elbow/Wrist Fractures and Dislocations Lower Leg Amputation Occupational Therapy Evaluation Shoulder Surgery Spinal Cord Surgery Wound Care
Conditions:
Fractures, Dislocations, Derangement, and Sprains Hallux Valgus Internal Derangement of Knee Internal Derangement of Knee Cartilage Internal Derangement of Knee Ligaments
Languages:
English Spanish
Description:
Dr. Karr graduated from the University of Michigan Medical School in 1981. He works in Fort Wayne, IN and 2 other locations and specializes in Orthopaedic Surgery. Dr. Karr is affiliated with duPont Hospital, Lutheran Hospital Of Indiana, Parkview Hospital Randallia and Parkview Orthopedic Hospital.
David B. Harris - Columbia MD Scott P. Karr - Columbia MD Stephen J. Reinhart - Annapolis MD
Assignee:
The United States of America as represented by the Secretary of the Air Force - Washington DC
International Classification:
H05K 720
US Classification:
361386
Abstract:
The difficulty with integrating packaged devices into a dual composite module design for wafer scale devices is the height difference between the WSI and packaged devices a typical wafer scale device is 0. 025 (in) high while typical packaged VLSI components are 0. 080 (in) or more. This leaves little room for the other 5 layers of interconnect boards and PCI layers required for the dual composite module. The solution is that the PWB on the side of the composite heat sink has been shortened to support only the wafer scale device on the heat sink. This eliminated PWB thickness and PCI interfaces from the side with the VLSI components. Also 3-P connectors are made with a pressure contact interconnecting (PCI) board.
Method And Apparatus Of Producing Cavities In Ltcc Substrates
A method and apparatus which replaces the silicone molds heretofore utilized for protecting the integrity of the cavities formed during the lamination lay-up stage of a low temperature cofired ceramic substrate fabrication. Now a single sheet of compliant latex rubber is now applied over a polyimide template placed on top of the laminations following their stack-up on a tooling plate. Upon the application of pressure in an isostatic lamination procedure, the sheet of latex rubber acts to safely transfer laminating pressure to the cavities formed in the composite substrate structure without rounding the corners or edges thereof.
Tucson, AZSr IA Tech/Alt IAM at Raytheon Missile Systems Past: Senior IA Analyst at Northrop Grumman IT, Senior Security Analyst at General Dynamics... A highly qualified technical professional with extensive experience in the Information Assurance (IA), technical security/investigations, and... A highly qualified technical professional with extensive experience in the Information Assurance (IA), technical security/investigations, and Intelligence/Counterintelligence disciplines. A "self-starter" who learns quickly and excels in fast-paced environments.
Specialties
Information...
Scott Karr 1998 graduate of Knoxville High School in Knoxville, IA is on Memory Lane. Get caught up with Scott and other high school alumni from Knoxville High
Scott Karr (1985-1989), Eddie Park (1985-1989), Daniel Corbett (1994-1998), Bobbi Sensabaugh (1980-1984), Tanya Hewitt (1996-2000), Deeanna Gilkey (2003-2006)