Scott Arthur Young

Address:

12023 Snow White Dr, Dallas, TX 75244

VIN:

16HCB10187K011596

Make:

HUMMER

Model:

H1 4-Passenger Open Top

Year:

2007

US Patent:

7047101, May 16, 2006

Filed:

Feb 7, 2003

Appl. No.:

10/359858

Inventors:

Scott Young - Soquel CA, US
Dominic Gerald David - Campbell CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G06F 19/00

US Classification:

700121, 716 4, 382145, 702 81

Abstract:

A semiconductor measurement recipe architecture organized to include reusable sub-recipes, each defining at least one parameter associated with either a semiconductor wafer and/or a semiconductor disposed thereon, is disclosed. This recipe architecture will include a set of parameter dependencies, one or more which having a respective relationship with of the sub-recipes to permit safe and reliable sub-recipe reuse. Also disclosed is a recipe generation method including: determining an appropriate baseline existing recipe that's organized to include a set of parameter dependencies and dependency related sub-recipes; perceiving a dependency change; determining which, if any, of the sub-recipes of the existing recipe remain unaffected after the dependency change(s); and generating a new recipe using at least one of the sub-recipes found to be unaffected.

US Patent:

7873133, Jan 18, 2011

Filed:

Jun 26, 2006

Appl. No.:

11/426481

Inventors:

Scott A. Young - Scotts Valley CA, US

Assignee:

Infinera Corporation - Sunnyvale CA

International Classification:

H03D 3/24

US Classification:

375376, 375354, 327141, 327147, 327156

Abstract:

The present invention provides a system, apparatus and method for recovering a client signal clock. The present invention is able to more effectively remove jitter within a clock signal by providing a phase shifting element in the feedback of a PLL system to compensate for sudden changes in an input reference clock. The PLL system provides flexible clock recovery so that it can accommodate various payload types because it extracts a client clock signal independent of a corresponding justification count number.

US Patent:

8604447, Dec 10, 2013

Filed:

Jul 24, 2012

Appl. No.:

13/557047

Inventors:

Scott Young - Soquel CA, US
Guoheng Zhao - Palo Alto CA, US
Ady Levy - Sunnyvale CA, US
Marco Guevremont - San Francisco CA, US
Neeraj Khanna - Santa Clara CA, US

Assignee:

KLA-Tencor Corporation - Milpitas CA

International Classification:

G01N 21/64

US Classification:

2504591

Abstract:

Methods and apparatus are presented to measure the photoluminescence of incoming wafers and extract parameters such as minority carrier life time, diffusion length, and defect density that may be used to predict final solar cell efficiency. In some examples, illumination light is supplied to a side of an as-cut silicon wafer and the induced luminescence measured from the same side and the opposite side of the wafer is used to determine an indication of the minority carrier lifetime. In another example, the luminescence induced by two instances of illumination light of different wavelength is used to determine an indication of the minority carrier lifetime. In another example, the spatial distribution of luminescence intensity over an area surrounding a focused illumination spot is used to determine an indication of the minority carrier lifetime. Other apparatus useful to passivate the surface of a wafer for inspection are also presented.

US Patent:

8643835, Feb 4, 2014

Filed:

Jul 9, 2010

Appl. No.:

12/833093

Inventors:

Scott A. Young - Soquel CA, US
Daniel L. Cavan - Woodside CA, US
Yale Zhang - Sunnyvale CA, US
Aviv Balan - Mountain View CA, US

Assignee:

KLA-Tencor Corporation - Milpitas CA

International Classification:

G01N 21/00
G01B 11/14
G06K 9/00

US Classification:

3562375, 3562371, 3562372, 3562373, 3562374, 356614, 356615, 356620, 356624, 356625, 382145, 382148, 382189

Abstract:

A system for inspecting a depth relative to a layer using a sensor with a fixed focal plane. A focus sensor senses the surface of the substrate and outputs focus data. In setup mode the controller scans a first portion of the substrate, receives the focus data and XY data, and stores correlated XYZ data for the substrate. In inspection mode the controller scans a second portion of the substrate, receives the focus data and XY data, and subtracts the stored Z data from the focus data to produce virtual data. The controller feeds the virtual data plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance.

US Patent:

20020075385, Jun 20, 2002

Filed:

Jan 31, 2002

Appl. No.:

10/066161

Inventors:

Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US

Assignee:

KLA INSTRUMENTS CORPORATION

International Classification:

H04N007/18

US Classification:

348/087000, 348/086000, 348/095000, 382/141000, 382/151000

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

US Patent:

20030063190, Apr 3, 2003

Filed:

Dec 9, 2002

Appl. No.:

10/314546

Inventors:

Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US

Assignee:

KLA INSTRUMENTS CORPORATION

International Classification:

G06K009/00

US Classification:

348/126000, 382/151000, 348/129000

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

US Patent:

20050254698, Nov 17, 2005

Filed:

Jul 13, 2005

Appl. No.:

11/180348

Inventors:

Scott Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent Douglas - San Martin CA, US
Fred Babian - Boulder Creek CA, US

International Classification:

G06K009/00
H04N007/18

US Classification:

382145000, 348087000

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.

US Patent:

20080304734, Dec 11, 2008

Filed:

Aug 7, 2008

Appl. No.:

12/221806

Inventors:

Scott A. Young - Soquel CA, US
Roger Kroeze - Tracy CA, US
Curt H. Chadwick - Los Gatos CA, US
Nicholas Szabo - Cupertino CA, US
Kent E. Douglas - San Martin CA, US
Fred E. Babian - Boulder Creek CA, US

International Classification:

G06K 9/00

US Classification:

382141

Abstract:

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.