Sean M Andrews

US Patent:

20220411261, Dec 29, 2022

Filed:

Feb 19, 2021

Appl. No.:

17/801230

Inventors:

- San Diego CA, US
Tallis CHANG - San Diego CA, US
Sean ANDREWS - San Diego CA, US
Jan BOS - Hsinchu City, TW
Jia-Wei MA - Taipei City, TW

Assignee:

Obsidian Sensors, Inc. - San Diego CA

International Classification:

B81C 1/00
B81B 7/00

Abstract:

In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.

US Patent:

20230061174, Mar 2, 2023

Filed:

Aug 26, 2022

Appl. No.:

17/896978

Inventors:

- San Diego CA, US
Tallis CHANG - San Diego CA, US
Bing WEN - San Diego CA, US
Edward CHAN - San Diego CA, US
Sean ANDREWS - San Diego CA, US
Heesun SHIN - San Diego CA, US

Assignee:

Obsidian Sensors, Inc. - San Diego CA

International Classification:

B81B 7/02
B81C 1/00

Abstract:

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

US Patent:

20210294093, Sep 23, 2021

Filed:

Mar 19, 2021

Appl. No.:

17/207433

Inventors:

- San Diego CA, US
Tallis CHANG - San Diego CA, US
Bing WEN - San Diego CA, US
Edward CHAN - San Diego CA, US
Sean ANDREWS - San Diego CA, US
Heesun SHIN - San Diego CA, US

Assignee:

Obsidian Sensors, Inc. - San Diego CA

International Classification:

G02B 26/08
B81B 7/02
B81C 1/00

Abstract:

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.

US Patent:

20210164839, Jun 3, 2021

Filed:

Aug 9, 2019

Appl. No.:

17/267789

Inventors:

- San Diego CA, US
Bing WEN - San Diego CA, US
Edward CHAN - San Diego CA, US
Tallis CHANG - San Diego CA, US
Sean ANDREWS - San Diego CA, US

Assignee:

Obsidian Sensors, Inc. - San Diego CA

International Classification:

G01J 5/02
G01J 5/20
B81B 3/00

Abstract:

Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.

US Patent:

20200407219, Dec 31, 2020

Filed:

Mar 14, 2019

Appl. No.:

16/980792

Inventors:

- San Diego CA, US
Tallis CHANG - La Jolla CA, US
Edward CHAN - La Jolla CA, US
Bing WEN - La Jolla CA, US
Yaoling PAN - La Jolla CA, US
Sean ANDREWS - San Diego CA, US

Assignee:

Obsidian Sensors, Inc. - San Diego CA

International Classification:

B81C 1/00
B81B 3/00
G01J 5/20

Abstract:

A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.