Sean P Fleming

US Patent:

20120287582, Nov 15, 2012

Filed:

May 11, 2011

Appl. No.:

13/105696

Inventors:

Patrizio Vinciarelli - Boston MA, US
Michael B. Lafleur - East Hampstead NH, US
Andrew T. D'Amico - Marina Del Rey CA, US
Rudolph Mutter - North Andover MA, US
Sean Timothy Fleming - Worcester MA, US

International Classification:

H05K 7/00
H05K 5/00
B29C 33/20
H01R 43/00

US Classification:

361728, 29825, 361752, 361783, 249 83

Abstract:

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

US Patent:

20200253060, Aug 6, 2020

Filed:

Apr 22, 2020

Appl. No.:

16/854984

Inventors:

- Andover MA, US
Michael B. LaFleur - East Hampstead NH, US
Sean Timothy Fleming - Worcester MA, US
Rudolph F. Mutter - North Andover MA, US
Andrew T. D`Amico - Beverly Hills CA, US

International Classification:

H05K 3/28
H05K 5/06
H05K 3/00
H01R 27/02
H05K 7/20
H01R 43/24
H01R 43/20
B29C 45/14
B29C 45/00
H05K 1/11
H05K 1/18

Abstract:

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

US Patent:

20160302312, Oct 13, 2016

Filed:

Jun 17, 2016

Appl. No.:

15/186189

Inventors:

- Andover MA, US
Michael B. LaFleur - East Hampstead NH, US
Sean Timothy Fleming - Worcester MA, US
Rudolph F. Mutter - North Andover MA, US
Andrew T. D'Amico - Beverly Hills CA, US

International Classification:

H05K 3/28
H01R 27/02
H05K 1/11
H05K 3/00
H05K 5/06

Abstract:

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

US Patent:

20150181719, Jun 25, 2015

Filed:

Mar 2, 2015

Appl. No.:

14/635420

Inventors:

- Sunnyvale CA, US
Michael B. LaFleur - East Hampstead NH, US
Sean Timothy Fleming - Worcester MA, US
Rudolph F. Mutter - North Andover MA, US
Andrew T. D'Amico - Beverly Hills CA, US

International Classification:

H05K 3/28
H05K 5/06
H05K 7/20

Abstract:

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

US Patent:

20150181727, Jun 25, 2015

Filed:

Mar 2, 2015

Appl. No.:

14/635467

Inventors:

- Sunnyvale CA, US
Michael B. LaFleur - East Hampstead NH, US
Sean Timothy Fleming - Worcester MA, US
Rudolph F. Mutter - North Andover MA, US
Andrew T. D'Amico - Beverly Hills CA, US

International Classification:

H05K 5/00
H05K 5/02
H05K 5/04
B23P 15/00
H01F 27/28
H05K 1/11
H05K 1/02
H05K 1/18
H01F 27/24
B29C 45/16
H05K 7/14

Abstract:

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

US Patent:

20140355218, Dec 4, 2014

Filed:

May 11, 2012

Appl. No.:

14/116642

Inventors:

Patrizio Vinciarelli - Boston MA, US
Michael B. LaFleur - East Hampstead NH, US
Sean Timothy Fleming - Worcester MA, US
Rudolph F. Mutter - North Andover MA, US
Andrew T. D'Amico - Marina Del Rey CA, US

Assignee:

VLT, INC. - Sunnyvale CA

International Classification:

H05K 3/28
B29C 45/14
B29C 45/00
H05K 1/18
H05K 1/11

US Classification:

361728, 264139

Abstract:

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.