- Wilmington DE, US DMITRY POPLAVSKYY - SAN JOSE CA, US DANIEL ANEURIN INNS - PALO ALTO CA, US KARIM LOTFI BENDIMERAD - SAN FRANCISCO CA, US SHANNON DUGAN - SUNNYVALE CA, US
International Classification:
H01L 31/0224 H01L 31/02
Abstract:
A method for manufacturing an interdigitated back contact solar cell, comprising steps of: (a) providing a doped silicon substrate; (b) doping the rear surface of the substrate homogeneously with boron in a blanket pattern, thereby forming a p+ region on the rear surface of the silicon substrate; (c) forming a silicon dioxide layer on the front and rear surface; (d) depositing a phosphorus-containing doping paste on the rear surface in a second pattern; (e) heating the silicon substrate to locally diffuse phosphorus into the rear surface of the silicon substrate, thereby forming an n+ region on the rear surface of the silicon substrate through the second pattern, wherein the p+ region and the n+ region on the rear surface collectively form an interdigitated pattern; and (f) removing the second silicon dioxide layer from the silicon substrate.
Method For Manufacturing An Interdigitated Back Contact Solar Cell
- Wilmington DE, US Dmitry Poplavskyy - San Jose CA, US Daniel Aneurin Inns - Palo Alto CA, US Karim Lotfi Bendimerad - San Francisco CA, US Shannon Dugan - Sunnyvale CA, US
Assignee:
E I DU PONT DE NEMOURS AND COMPANY - Wilmington DE
International Classification:
H01L 31/18 H01L 31/0224
US Classification:
438 98, 438 57
Abstract:
A method for manufacturing an interdigitated back contact solar cell, comprising steps of: (a) providing a doped silicon substrate; (b) forming a first silicon dioxide layer on the front surface and the rear surface; (c) depositing a boron-containing doping paste on the first silicon dioxide layer of the rear surface in a first pattern; (d) heating the silicon substrate; (e) removing the first silicon dioxide layer; (f) forming a second silicon dioxide layer on the front surface and the rear surface; (g) depositing a phosphorus-containing doping paste on the second dioxide layer of the rear surface in a second pattern; (h) heating the silicon substrate; and (i) removing the second silicon dioxide layer from the silicon substrate, wherein the first pattern and the second pattern collectively form an interdigitated pattern.