Shuji E Rokutanda from Fremont, CA, age 70

Non-Random Array Anisotropic Conductive Film (Acf) And Manufacturing Processes
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US Patent:

20100101700, Apr 29, 2010
Filed:

Oct 29, 2009
Appl. No.:

12/608955
Inventors:

Jerry Chung - Mountain View CA, US
Chinjen Tseng - Fremont CA, US
Shuji Rokutanda - Fremont CA, US
Yuhao Sun - Newark CA, US
Assignee:

Trillion Science Inc. - Fremont CA
International Classification:

B32B 38/00
B32B 37/00
B32B 38/04
US Classification:

156 731, 156293, 156 736, 156281, 1562722, 1562726, 1562728
Abstract:

Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.

Fixed-Array Anisotropic Conductive Film Using Surface Modified Conductive Particles
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US Patent:

20120295098, Nov 22, 2012
Filed:

May 19, 2011
Appl. No.:

13/111300
Inventors:

Jiunn-Jye Hwang - New Taipei City, TW
Shuji Rokutanda - Fremont CA, US
Chin-Jen Tseng - Fremont CA, US
Assignee:

TRILLION SCIENCE, INC. - Fremont CA
International Classification:

B32B 5/16
B32B 5/00
B32B 7/12
US Classification:

428328, 428221, 428335, 428323
Abstract:

Structures and manufacturing processes of an ACF array and more particularly a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a coupling agent onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film, the conductive particles are transferred to the adhesive film such that they are only partially embedded in the film.

Microcavity Carrier Belt And Method Of Manufacture
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US Patent:

20130071636, Mar 21, 2013
Filed:

Sep 15, 2011
Appl. No.:

13/233360
Inventors:

Yuhao Sun - Fremont CA, US
Maung Kyaw Aung - Union City CA, US
Chin-Jen Tseng - Fremont CA, US
Chiapu Chang - Saratoga CA, US
Shuji Rokutanda - Fremont CA, US
Assignee:

TRILLION SCIENCE, INC. - Fremont CA
International Classification:

B32B 5/16
B32B 3/10
B65G 17/36
B32B 38/10
B32B 37/14
US Classification:

428206, 156247, 156258, 198701, 428221
Abstract:

A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.

Non-Random Array Anisotropic Conductive Film (Acf) And Manufacturing Processes
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US Patent:

20140312501, Oct 23, 2014
Filed:

May 20, 2014
Appl. No.:

14/282590
Inventors:

Rong-Chang Liang - Cupertino CA, US
Jerry Chung - Los Altos CA, US
Chin-Jen Tseng - Fremont CA, US
Shuji Rokutanda - Fremont CA, US
Yuhao Sun - Fremont CA, US
Assignee:

TRILLION SCIENCE INC. - Fremont CA
International Classification:

H05K 1/02
H05K 3/00
H01L 23/48
US Classification:

257773, 174250, 174254, 264104
Abstract:

Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.

Shuji E Rokutanda