Simon R Lu

age ~68

from Cupertino, CA

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Also known as:

Simon Rong Hua Lu
Simon Bessie Lu
Simon H Lu
Rong Lu
Rong Hua Lu
Rong Hua Lu Simon
Ron Hua Lu
Simon Hlu

Phone and address:: 7846 Festival Dr, Cupertino, CA 95014

Connected to:

Simon Lu Phones & Addresses

7846 Festival Dr, Cupertino, CA 95014
10938 Northshore Sq, Cupertino, CA 95014
San Francisco, CA
San Jose, CA
Seattle, WA
Lewiston, ID
Campbell, CA

Work

Company:

Lynbrook
Address:

20370 Town Center Lane #153, Cupertino, CA 95014
Phones:

(408)8926598

Specialities

Buyer's Agent • Listing Agent

Real Estate Brokers

Simon Lu, Cupertino CA

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Specialties:

Buyer's Agent
Listing Agent

Work:

Lynbrook
20370 Town Center Lane #153, Cupertino, CA 95014
(408)8926598 (Office)

Name / Title

Company / Classification

Phones & Addresses

Simon Lu
Manager

Devry Institute of Technology
Book Stores

6600 Dumbarton Cir, Fremont, CA 94555

Simon Lu
Manager

Devry University, Inc
College/University Junior College · Undergraduate & Graduate Business & Technology School · College/University · College/University Professional School · Book Stores · Hardware Stores · Colleges, Universities, and Professional Schools

6600 Dumbarton Cir, Fremont, CA 94555
(510)5741250, (510)5741100, (888)4291851, (510)5741101

Lawyers & Attorneys

Simon Lu - Lawyer

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Specialties:

Patent/ Trademark/ Copyright

ISLN:

914782573

Admitted:

1999

University:

California State Polytechnical University, B.S., 1992

Law School:

Whittier Law School, J.D., 1997

Us Patents

Bump Structure
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US Patent:

7187078, Mar 6, 2007
Filed:

Sep 13, 2004
Appl. No.:

10/938594
Inventors:

Tzu-Han Lin - Hsinchu, TW
Huei-Mei Yu - Hsinchu, TW
Chia-Jen Cheng - Taoyuan, TW
Chun-Yen Lo - Taichung, TW
Li-Hsin Tseng - Taichung, TW
Boe Su - Chiayi, TW
Simon Lu - Belmont CA, US
Assignee:

Taiwan Semiconductor Manufacturing Co. Ltd. - Hsin-Chu
International Classification:

H01L 29/40
US Classification:

257748, 438614, 438615
Abstract:

Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the substrate has at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad. At least one patterned and etched polymer layer is formed on a portion of the contact pad. At least one patterned and etched conductive metal layer is formed above the polymer layer and is aligned therewith. And at least one layer of solder material having a solder height is provided above the conductive metal layer, the layer of solder is aligned with the conductive metal layer, the layer of solder is thereafter reflown thereby creating a solder ball.