Christopher T. Snively - McKinney TX, US Steven E. Lau - Harbor City CA, US William J. Wolfgong - Little Elm TX, US Cindy W. Ma - Union City CA, US Stephen L. Schrader - Murphy TX, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
C08G 59/06 C08K 3/08 C08K 3/10 C08L 63/02
US Classification:
523458, 523457, 523459, 523460, 525523, 528102
Abstract:
The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodephenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at last one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to- a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.
Thomas K. Dougherty - Playa Del Rey CA, US Christopher T. Snively - McKinney TX, US Steven E. Lau - Harbor City CA, US William J. Wolfgong - Little Elm TX, US Cindy W. Ma - Union City CA, US Stephen L. Schrader - Murphy TX, US
The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.