Steve C Canale

age ~56

from Simi Valley, CA

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Debonders And Related Devices And Methods For Semiconductor Fabrication
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US Patent:

20110297329, Dec 8, 2011
Filed:

Oct 5, 2010
Appl. No.:

12/898623
Inventors:

Steve Canale - Simi Valley CA, US
David J. Zapp - Simi Valley CA, US
Daniel E. Sanchez - Camarillo CA, US
Hung V. Phan - Simi Valley CA, US
Hyong Y. Lee - Thousand Oaks CA, US
Assignee:

SKYWORKS SOLUTIONS, INC. - Woburn MA
International Classification:

H01L 21/687
US Classification:

156756, 156761
Abstract:

Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

Devices For Methodologies For Handling Wafers
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US Patent:

20120080052, Apr 5, 2012
Filed:

Oct 5, 2010
Appl. No.:

12/898627
Inventors:

Steve Canale - Simi Valley CA, US
David J. Zapp - Simi Valley CA, US
Assignee:

SKYWORKS SOLUTIONS, INC. - Woburn MA
International Classification:

B08B 7/00
B08B 3/00
B32B 3/02
B23Q 3/18
US Classification:

134 11, 269289 R, 269319, 134 32, 428 641
Abstract:

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed.

Securing Mechanism And Method For Wafer Bonder
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US Patent:

20120080132, Apr 5, 2012
Filed:

Oct 5, 2010
Appl. No.:

12/898643
Inventors:

Steve Canale - Simi Valley CA, US
David J. Zapp - Simi Valley CA, US
Assignee:

SKYWORKS SOLUTIONS, INC. - Woburn MA
International Classification:

B32B 37/10
E05C 19/00
B32B 37/12
US Classification:

156 60, 156580, 156381, 156382, 292305
Abstract:

Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.

Fixtures And Methods For Unbonding Wafers By Shear Force
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US Patent:

20120080150, Apr 5, 2012
Filed:

Oct 5, 2010
Appl. No.:

12/898648
Inventors:

Jens A. Riege - Ojai CA, US
Steve Canale - Simi Valley CA, US
David J. Zapp - Simi Valley CA, US
Assignee:

SKYWORKS SOLUTIONS, INC. - Woburn MA
International Classification:

B32B 38/10
US Classification:

156752, 156761
Abstract:

Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.

Devices For Methodologies Related To Wafer Carriers
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US Patent:

20120080832, Apr 5, 2012
Filed:

Jun 6, 2011
Appl. No.:

13/153954
Inventors:

Elena B. Woodard - Fillmore CA, US
Daniel K. Berkoh - Woodland Hills CA, US
David J. Zapp - Simi Valley CA, US
Steve Canale - Simi Valley CA, US
Assignee:

Skyworks Solutions, Inc. - Woburn MA
International Classification:

B23Q 3/18
B32B 17/00
B32B 3/02
F24J 3/00
US Classification:

269289 R, 432 1, 428 641, 428 667
Abstract:

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

Devices For Methodologies Related To Wafer Carriers
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US Patent:

20170125275, May 4, 2017
Filed:

Jan 9, 2017
Appl. No.:

15/401344
Inventors:

- Woburn MA, US
Daniel Kwadwo Amponsah Berkoh - West Hills CA, US
David James Zapp - Deceased, US
Steve Canale - Simi Valley CA, US
Hyong Yong Lee - Thousand Oaks CA, US
Daniel Eduardo Sanchez - Camarillo CA, US
Hung V. Phan - Simi Valley CA, US
International Classification:

H01L 21/683
B32B 43/00
Abstract:

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

Devices For Methodologies Related To Wafer Carriers
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US Patent:

20160005637, Jan 7, 2016
Filed:

Sep 16, 2015
Appl. No.:

14/856183
Inventors:

- Woburn MA, US
Daniel Kwadwo Amponsah Berkoh - West Hills CA, US
David James Zapp - Simi Valley CA, US
Steve Canale - Simi Valley CA, US
International Classification:

H01L 21/683
H01L 21/67
Abstract:

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.