Steve K Mccandless

US Patent:

20200051235, Feb 13, 2020

Filed:

Aug 10, 2018

Appl. No.:

16/100729

Inventors:

- Boise ID, US
Qianlan Liu - Boise ID, US
Pradeep Ramachandran - Lehi UT, US
Shawn D. Lyonsmith - Boise ID, US
Steve K. McCandless - Nampa ID, US
Ted L. Taylor - Boise ID, US
Ahmed N. Noemaun - Boise ID, US
Gordon A. Haller - Boise ID, US

International Classification:

G06T 7/00
G06N 99/00
G06F 17/50
G01N 21/47
G01N 21/21
G01B 11/00

Abstract:

A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.