Steve Oh

US Patent:

7002180, Feb 21, 2006

Filed:

Jun 28, 2002

Appl. No.:

10/187468

Inventors:

Steve Tchang-Hun Oh - Sharon MA, US
Hong K. Choi - Sharon MA, US
John C. C. Fan - Brookline MA, US

Assignee:

Kopin Corporation - Taunton MA

International Classification:

H01L 27/15

US Classification:

257 79, 257 81, 257 94, 257 99

Abstract:

A bonding pad for an electrode is in contact with p-type gallium nitride-based semiconductor material that includes aluminum. The bonding pad may also includes one or more metals selected from the group consisting of palladium, platinum, nickel and gold. The bonding pad can be used to attach a bonding wire to the p-electrode in a semiconductor device, such as a light-emitting diode or a laser diode without causing degradation of the light-transmission and ohmic properties of the electrode. The bonding pad may be formed of substantially the same material as an electrode in making an ohmic contact with n-type gallium nitride-based semiconductor material (n-electrode). This allows the bonding pad and the n-electrode to be formed simultaneously when manufacturing a gallium nitride-based light-emitting device which substantially reduces the cost to manufacture the device.

US Patent:

7548828, Jun 16, 2009

Filed:

Aug 30, 2007

Appl. No.:

11/847481

Inventors:

Yun Jae Gil - Brookline MA, US
Sung Jae Ghil - Kyunggi-Do, KR
Steve Sooyoon Oh - Northridge CA, US

Assignee:

Testiary, Inc. - Kyunggido

International Classification:

G06F 19/00
G06F 11/00
G01R 31/00

US Classification:

702121, 702118, 714733, 714742, 324763, 324765

Abstract:

The present invention provides a system of testing semiconductor devices. The system comprises a central host computer, an array of user computers (the array), and a HU (Host-User) network as the mean of communication between them. Two user computers are dedicated to one test instrument via UI connections in the instrument test head, a first user computer can be assigned to perform the tasks of generating and delivering data to the test instrument, while a second user computer can be assigned to perform the tasks of receiving and processing information from the same test instrument.

US Patent:

20040000672, Jan 1, 2004

Filed:

Jun 28, 2002

Appl. No.:

10/187466

Inventors:

John Fan - Brookline MA, US
Hong Choi - Sharon MA, US
Steve Oh - Sharon MA, US

Assignee:

Kopin Corporation - Taunton MA

International Classification:

H01L027/15
H01L031/12
H01L033/00

US Classification:

257/079000

Abstract:

High-efficiency light-emitting diode structures are disclosed which reduce the current flow directly underneath the thick p-bonding pad. The devices can further include a light-reflecting layer at the back of the substrate.