Steven L Oliver

US Patent:

7169248, Jan 30, 2007

Filed:

Jul 19, 2005

Appl. No.:

11/185045

Inventors:

Kyle K. Kirby - Boise ID, US
Steven D. Oliver - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B29C 65/44
B32B 38/10
H01L 21/301
H01L 21/302

US Classification:

156250, 156230, 1562722, 1562757, 438113, 438118, 438458, 438460, 438464

Abstract:

Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece. The separation process removes at least approximately all the adhesive material from the non-active portion of the workpiece.

US Patent:

7190039, Mar 13, 2007

Filed:

Feb 18, 2005

Appl. No.:

11/061034

Inventors:

Ulrich C. Boettiger - Boise ID, US
Jin Li - Boise ID, US
Steven D. Oliver - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 31/0232

US Classification:

257432, 257E31097

Abstract:

Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

US Patent:

7300857, Nov 27, 2007

Filed:

Sep 2, 2004

Appl. No.:

10/932296

Inventors:

Salman Akram - Boise ID, US
Charles Watkins - Eagle ID, US
Mark Hiatt - Eagle ID, US
David Hembree - Boise ID, US
James Wark - Boise ID, US
Warren Farnworth - Nampa ID, US
Mark Tuttle - Boise ID, US
Sidney Rigg - Meridian ID, US
Steven Oliver - Boise ID, US
Kyle Kirby - Boise ID, US
Alan Wood - Boise ID, US
Lu Velicky - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/441

US Classification:

438459, 438612, 438667, 257621, 257E21597

Abstract:

A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e. g. , L and R) are reduced due to the reduced signal path lengths.

US Patent:

7390687, Jun 24, 2008

Filed:

Oct 31, 2006

Appl. No.:

11/589929

Inventors:

Ulrich C. Boettiger - Boise ID, US
Jin Li - Boise ID, US
Steven D. Oliver - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/00

US Classification:

438 64, 438116, 438126, 257E2713, 257E27133

Abstract:

Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

US Patent:

7397066, Jul 8, 2008

Filed:

Aug 19, 2004

Appl. No.:

10/922177

Inventors:

Steven D. Oliver - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 27/15
H01L 29/267
H01L 31/12
H01L 33/00

US Classification:

257 81, 257 21, 257 53, 257 80, 257 82, 257 83, 257 84, 257 85, 257 95, 257113, 257114, 257115, 257116, 257117, 257118, 257179, 257181, 257184, 257185, 257186, 257187, 257188, 257189, 257222, 257225, 257258, 257291, 257444, 257448, 257465, 257466, 257688, 257689

Abstract:

Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

US Patent:

7425499, Sep 16, 2008

Filed:

Aug 24, 2004

Appl. No.:

10/925501

Inventors:

Steven D. Oliver - Boise ID, US
Kyle K. Kirby - Boise ID, US
William M. Hiatt - Eagle ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/44

US Classification:

438597, 438106, 438120, 438242, 438584, 257E27001, 257E27091

Abstract:

Methods for forming interconnects in blind vias or other types of holes, and microelectronic workpieces having such interconnects. The blind vias can be formed by first removing the bulk of the material from portions of the back side of the workpiece without thinning the entire workpiece. The bulk removal process, for example, can form a first opening that extends to an intermediate depth within the workpiece, but does not extend to the contact surface of the electrically conductive element. After forming the first opening, a second opening is formed from the intermediate depth in the first opening to the contact surface of the conductive element. The second opening has a second width less than the first width of the first opening. This method further includes filling the blind vias with a conductive material and subsequently thinning the workpiece from the exterior side until the cavity is eliminated.

US Patent:

7452743, Nov 18, 2008

Filed:

Sep 1, 2005

Appl. No.:

11/217877

Inventors:

Steven D. Oliver - Boise ID, US
Lu Velicky - Boise ID, US
William Mark Hiatt - Eagle ID, US
David R. Hembree - Boise ID, US
Mark E. Tuttle - Boise ID, US
Sidney B. Rigg - Meridian ID, US
James M. Wark - Boise ID, US
Warren M. Farnworth - Nampa ID, US
Kyle K. Kirby - Boise ID, US

Assignee:

Aptina Imaging Corporation - Grand Cayman

International Classification:

H01L 21/00

US Classification:

438 57, 438 68, 438 69, 438 73

Abstract:

Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

US Patent:

7560371, Jul 14, 2009

Filed:

Aug 29, 2006

Appl. No.:

11/511619

Inventors:

Ross S. Dando - Nampa ID, US
Steven Oliver - Boise ID, US
Swarnal Borthakur - Boise ID, US
Kevin Hutto - Kuna ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/20

US Classification:

438612, 438613, 438614, 438108, 438113, 257E23075, 257E23067, 257E23174

Abstract:

Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the aperture with a vacuum. The wave may be formed by flowing the liquid material out from an outlet in a direction generally against the gravitational field. The liquid material may be solidified to form an electrically conductive structure. A plurality of apertures may be selectively filled with the liquid material one at a time, and liquids having different compositions may be used to provide conductive vias having different compositions in the same substrate. Systems for forming conductive vias include a substrate fixture, a vacuum device having a vacuum fixture, and a solder-dispensing device configured to provide a wave of molten solder material. Relative lateral and vertical movement is provided between the wave of molten solder and a substrate supported by the substrate fixture.