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Steven L Oliver

age ~50

from Elbe, WA

Also known as:
  • Steven Lee Oliver
  • Steven C Oliver
  • Steven Olives
  • Steven Coliver

Steven Oliver Phones & Addresses

  • Elbe, WA
  • Grangeville, ID
  • 2615 Sand Hollow Rd, Caldwell, ID 83607
  • Nampa, ID

Medicine Doctors

Steven Oliver Photo 1

Steven A. Oliver

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Specialties:
Urgent Care Medicine, Family Medicine
Work:
Granger Medical ClinicGranger Medical Urgent Care
3725 W 4100 S, Salt Lake City, UT 84120
(801)9653608 (phone), (801)9653526 (fax)
Education:
Medical School
Indiana University School of Medicine
Graduated: 1979
Procedures:
Arthrocentesis
Destruction of Benign/Premalignant Skin Lesions
Electrocardiogram (EKG or ECG)
Inner Ear Tests
Pulmonary Function Tests
Vaccine Administration
Wound Care
Conditions:
Abdominal Hernia
Abnormal Vaginal Bleeding
Acne
Acute Bronchitis
Acute Conjunctivitis
Languages:
English
Spanish
Description:
Dr. Oliver graduated from the Indiana University School of Medicine in 1979. He works in West Valley City, UT and specializes in Urgent Care Medicine and Family Medicine. Dr. Oliver is affiliated with Alta View Hospital, Intermountain Medical Center, Jordan Valley Medical Center and Jordan Valley Medical Center-West Valley Campus.

Us Patents

  • Methods For Releasably Attaching Support Members To Microfeature Workpieces And Microfeature Assemblies Formed Using Such Methods

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  • US Patent:
    7169248, Jan 30, 2007
  • Filed:
    Jul 19, 2005
  • Appl. No.:
    11/185045
  • Inventors:
    Kyle K. Kirby - Boise ID, US
    Steven D. Oliver - Boise ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    B29C 65/44
    B32B 38/10
    H01L 21/301
    H01L 21/302
  • US Classification:
    156250, 156230, 1562722, 1562757, 438113, 438118, 438458, 438460, 438464
  • Abstract:
    Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece. The separation process removes at least approximately all the adhesive material from the non-active portion of the workpiece.
  • Microelectronic Imagers With Shaped Image Sensors And Methods For Manufacturing Microelectronic Imagers

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  • US Patent:
    7190039, Mar 13, 2007
  • Filed:
    Feb 18, 2005
  • Appl. No.:
    11/061034
  • Inventors:
    Ulrich C. Boettiger - Boise ID, US
    Jin Li - Boise ID, US
    Steven D. Oliver - Boise ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H01L 31/0232
  • US Classification:
    257432, 257E31097
  • Abstract:
    Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
  • Through-Wafer Interconnects For Photoimager And Memory Wafers

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  • US Patent:
    7300857, Nov 27, 2007
  • Filed:
    Sep 2, 2004
  • Appl. No.:
    10/932296
  • Inventors:
    Salman Akram - Boise ID, US
    Charles Watkins - Eagle ID, US
    Mark Hiatt - Eagle ID, US
    David Hembree - Boise ID, US
    James Wark - Boise ID, US
    Warren Farnworth - Nampa ID, US
    Mark Tuttle - Boise ID, US
    Sidney Rigg - Meridian ID, US
    Steven Oliver - Boise ID, US
    Kyle Kirby - Boise ID, US
    Alan Wood - Boise ID, US
    Lu Velicky - Boise ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H01L 21/441
  • US Classification:
    438459, 438612, 438667, 257621, 257E21597
  • Abstract:
    A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e. g. , L and R) are reduced due to the reduced signal path lengths.
  • Microelectronic Imagers With Shaped Image Sensors And Methods For Manufacturing Microelectronic Imagers

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  • US Patent:
    7390687, Jun 24, 2008
  • Filed:
    Oct 31, 2006
  • Appl. No.:
    11/589929
  • Inventors:
    Ulrich C. Boettiger - Boise ID, US
    Jin Li - Boise ID, US
    Steven D. Oliver - Boise ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H01L 21/00
  • US Classification:
    438 64, 438116, 438126, 257E2713, 257E27133
  • Abstract:
    Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
  • Microelectronic Imagers With Curved Image Sensors And Methods For Manufacturing Microelectronic Imagers

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  • US Patent:
    7397066, Jul 8, 2008
  • Filed:
    Aug 19, 2004
  • Appl. No.:
    10/922177
  • Inventors:
    Steven D. Oliver - Boise ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H01L 27/15
    H01L 29/267
    H01L 31/12
    H01L 33/00
  • US Classification:
    257 81, 257 21, 257 53, 257 80, 257 82, 257 83, 257 84, 257 85, 257 95, 257113, 257114, 257115, 257116, 257117, 257118, 257179, 257181, 257184, 257185, 257186, 257187, 257188, 257189, 257222, 257225, 257258, 257291, 257444, 257448, 257465, 257466, 257688, 257689
  • Abstract:
    Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
  • Methods For Forming Interconnects In Vias And Microelectronic Workpieces Including Such Interconnects

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  • US Patent:
    7425499, Sep 16, 2008
  • Filed:
    Aug 24, 2004
  • Appl. No.:
    10/925501
  • Inventors:
    Steven D. Oliver - Boise ID, US
    Kyle K. Kirby - Boise ID, US
    William M. Hiatt - Eagle ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H01L 21/44
  • US Classification:
    438597, 438106, 438120, 438242, 438584, 257E27001, 257E27091
  • Abstract:
    Methods for forming interconnects in blind vias or other types of holes, and microelectronic workpieces having such interconnects. The blind vias can be formed by first removing the bulk of the material from portions of the back side of the workpiece without thinning the entire workpiece. The bulk removal process, for example, can form a first opening that extends to an intermediate depth within the workpiece, but does not extend to the contact surface of the electrically conductive element. After forming the first opening, a second opening is formed from the intermediate depth in the first opening to the contact surface of the conductive element. The second opening has a second width less than the first width of the first opening. This method further includes filling the blind vias with a conductive material and subsequently thinning the workpiece from the exterior side until the cavity is eliminated.
  • Microelectronic Imaging Units And Methods Of Manufacturing Microelectronic Imaging Units At The Wafer Level

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  • US Patent:
    7452743, Nov 18, 2008
  • Filed:
    Sep 1, 2005
  • Appl. No.:
    11/217877
  • Inventors:
    Steven D. Oliver - Boise ID, US
    Lu Velicky - Boise ID, US
    William Mark Hiatt - Eagle ID, US
    David R. Hembree - Boise ID, US
    Mark E. Tuttle - Boise ID, US
    Sidney B. Rigg - Meridian ID, US
    James M. Wark - Boise ID, US
    Warren M. Farnworth - Nampa ID, US
    Kyle K. Kirby - Boise ID, US
  • Assignee:
    Aptina Imaging Corporation - Grand Cayman
  • International Classification:
    H01L 21/00
  • US Classification:
    438 57, 438 68, 438 69, 438 73
  • Abstract:
    Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.
  • Methods For Selectively Filling Apertures In A Substrate To Form Conductive Vias With A Liquid Using A Vacuum

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  • US Patent:
    7560371, Jul 14, 2009
  • Filed:
    Aug 29, 2006
  • Appl. No.:
    11/511619
  • Inventors:
    Ross S. Dando - Nampa ID, US
    Steven Oliver - Boise ID, US
    Swarnal Borthakur - Boise ID, US
    Kevin Hutto - Kuna ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H01L 21/20
  • US Classification:
    438612, 438613, 438614, 438108, 438113, 257E23075, 257E23067, 257E23174
  • Abstract:
    Methods of forming a conductive via in a substrate include contacting the substrate with a wave of conductive liquid material, such as molten solder, and drawing the liquid material into the aperture with a vacuum. The wave may be formed by flowing the liquid material out from an outlet in a direction generally against the gravitational field. The liquid material may be solidified to form an electrically conductive structure. A plurality of apertures may be selectively filled with the liquid material one at a time, and liquids having different compositions may be used to provide conductive vias having different compositions in the same substrate. Systems for forming conductive vias include a substrate fixture, a vacuum device having a vacuum fixture, and a solder-dispensing device configured to provide a wave of molten solder material. Relative lateral and vertical movement is provided between the wave of molten solder and a substrate supported by the substrate fixture.
Name / Title
Company / Classification
Phones & Addresses
Steven Oliver
Director
Save Gas Corp
SGC
Auto Service - Specialty Parts
116-50 Tenth Street, P.O. Box 550064, Nanaimo, BC V9R 6L1
(888)6646668
Steven Oliver
Director
Save Gas Corp
Auto Service - Specialty Parts
(888)6646668
Steven Oliver
Principal
6th Mp Group
General Auto Repair
14609 24 Ave E, Tacoma, WA 98445
PO Box 331300, Tacoma, WA 98433
Steven Oliver
Director Information Technology
California Dept of Transportation
Maintenance · Public Finance/Taxation/Monetary Policy · Planning Office · Policy & Administration · General Government · Transportation · Regulation/Administrative Transportation · Constructs Operates and Maintains Highways and Freeways
(916)6545849, (916)6543986, (916)6545368, (916)6545539
Steven R. Oliver
DOLLAR SPREE, INC
Steven R. Oliver
FCLB, INC
Steven D. Oliver
SOUTHWESTERN INSULATION COMPANY, INC

License Records

Steven R Oliver

License #:
11332 - Active
Issued Date:
Apr 27, 1988
Renew Date:
Dec 1, 2015
Expiration Date:
Nov 30, 2017
Type:
Certified Public Accountant

Steven Joe Oliver

License #:
VET003301 - Expired
Category:
Veterinary Medicine
Issued Date:
Jul 22, 1981
Renew Date:
Dec 22, 1992
Expiration Date:
Dec 31, 1994
Type:
Veterinarian

Resumes

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Steven Oliver

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Location:
United States
Steven Oliver Photo 3

Steven Oliver

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Location:
United States
Steven Oliver Photo 4

Steven Oliver

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Location:
United States

Googleplus

Steven Oliver Photo 5

Steven Oliver

Lived:
Spanaway WA
Education:
Bethel high school
Steven Oliver Photo 6

Steven Oliver

Work:
Los Alamos National Security - Researcher (2005-2008)
Steven Oliver Photo 7

Steven Oliver

Education:
University of Wisconsin-Madison - Construction Administration
Tagline:
I am rat
Steven Oliver Photo 8

Steven Oliver

About:
Socializer, Restauranteur, Oenophilia, Spirit Merchant, Writer, Political Views, Lover of Paris, Connoisseur of Good Things in Life...
Steven Oliver Photo 9

Steven Oliver

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Steven Oliver

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Steven Oliver

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Steven Oliver

Myspace

Steven Oliver Photo 13

Steven Oliver

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Locality:
District Heights, Maryland
Gender:
Male
Birthday:
1945
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Steven Oliver

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Locality:
Hp, MICHIGAN
Gender:
Male
Birthday:
1947
Steven Oliver Photo 15

Steven Oliver

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Locality:
Cameron Park, California
Gender:
Male
Birthday:
1943
Steven Oliver Photo 16

Steven Oliver

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Locality:
Florida
Gender:
Male
Birthday:
1947
Steven Oliver Photo 17

Steven Oliver

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Locality:
cleona, Pennsylvania
Gender:
Male
Birthday:
1947
Steven Oliver Photo 18

Steven Oliver

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Locality:
Lake Arthur, Alabama
Gender:
Male
Birthday:
1945

Facebook

Steven Oliver Photo 19

Steven Oliver Young

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Steven Oliver Photo 20

Steven James Oliver

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Steven Oliver Photo 21

Steven Oliver Reddin

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Steven Oliver Photo 22

Steven Oliver

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Steven Oliver Photo 23

Steven Glocker Oliver

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Steven Oliver Photo 24

Steven Oliver Jr.

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Steven Oliver Photo 25

Steven Cole Oliver

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Steven Oliver Photo 26

Steven Oliver Wilkie

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Classmates

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Steven Oliver

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Schools:
Northumberland Regional High School Westville Swaziland 2001-2005
Community:
Ken Macpherson, Paul Maccarthy
Steven Oliver Photo 28

Steven Oliver

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Schools:
Holy Trinity High School Torbay Peru 1990-1994
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Steven Oliver

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Schools:
Saint Lawrence O'Toole School Oakland CA 1975-1979
Community:
Therese Maker, Joanne Desrosiers, Rodney Simmons
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Steven Oliver

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Schools:
Alden High School Alden IA 1965-1969
Community:
Robert Hoffman, Cecilia Glagovich, Ric Anikanov, Lori Shukers
Steven Oliver Photo 31

Steven Oliver

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Schools:
Alden High School Alden IA 1965-1969
Community:
Robert Hoffman, Cecilia Glagovich, Ric Anikanov, Lori Shukers
Steven Oliver Photo 32

Steven Oliver

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Schools:
Woodland Way Junior High School Hagerstown MD 1998-2002
Community:
Jim Sleasman, Tiffany Brown, Eric Mckinney, Roquia Turnipseed, Lee Burket
Steven Oliver Photo 33

Steven Oliver

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Schools:
Graham High School Bluefield VA 1998-2002
Community:
Lisa Kirby
Steven Oliver Photo 34

Steven Oliver

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Schools:
Grand Gorge Central School Grand Gorge NY 1966-1978, SUC Cortland State Cortland NY 1978-1982
Community:
Linda Hunton

Youtube

Steven Oliver - An Acknowledgement Of | Live ...

This episode was broadcast on Thursday December 1, 2022. For more from...

  • Duration:
    3m 53s

STEPHEN OLIVER NAIDOC AWARDS 2015 NITV

Comedian Stephen Oliver delivers a powerful, rapid fire routine at the...

  • Duration:
    4m 40s

Steven Oliver shines his way through Quickfir...

Prouder, louder and united. It's the party you've been waiting for wit...

  • Duration:
    3m 28s

"Hate He Said" by Steven Oliver

"Hate He Said" a poem by Steven Oliver. An aboriginal man who wrote in...

  • Duration:
    3m 23s

Steven Oliver: A looky at Cooky

Comedian Steven Oliver Official talks about his upcoming documentary '...

  • Duration:
    6m 11s

Steven Oliver performs 'Faboriginal' at the S...

Sydney Opera House is an Australian icon and one of the busiest perfor...

  • Duration:
    2m 11s

Flickr

Plaxo

Steven Oliver Photo 43

Steven Oliver

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Columbus, GA
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Steven Oliver

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Steven Oliver Photo 45

Steven Oliver

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Framework 404 Marketing

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