Steven B Roach

US Patent:

8308047, Nov 13, 2012

Filed:

Dec 19, 2006

Appl. No.:

11/612652

Inventors:

Joel Williams - Chandler AZ, US
Sonny J. Randall - Maricopa AZ, US
Steven B. Roach - Chandler AZ, US
Sabina J. Houle - Phoenix AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23K 1/20
B05C 5/02
B05C 17/06

US Classification:

228 33, 228 39, 228 41, 118504, 118505, 118301

Abstract:

A flux spray head, a mask, and an integrated circuit substrate are arranged in a flux spray station to reduce flux overspray during a spraying operation. A support element within the spray station is used to align the substrate with the mask and spray head. A portion of the mask contacts the substrate along a boundary between a region to be sprayed and a region to be masked. The flux spray head sprays the substrate while a portion of the mask is in contact with the boundary of the region to be masked. In an embodiment, the mask may comprise one or more replaceable non-stick stencil elements and associated springs to press the stencil elements against the substrate. Each stencil element may have a wall to contact the substrate along a portion of the boundary.

US Patent:

20130299133, Nov 14, 2013

Filed:

Dec 20, 2011

Appl. No.:

13/992439

Inventors:

Zhihua Li - Chandler AZ, US
Hemanth K. Dhavaleswarapu - Chandler AZ, US
Joseph B. Petrini - Gilbert AZ, US
Steven B. Roach - Chandler AZ, US
Ioan Sauciuc - Phoenix AZ, US
Pranav K. Desai - Chandler AZ, US
George S. Kostiew - Chandler AZ, US
Sanjoy K. Saha - Chandler AZ, US

International Classification:

B23K 37/00
H05K 3/34

US Classification:

165 803, 16510434

Abstract:

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

US Patent:

61292567, Oct 10, 2000

Filed:

Sep 21, 1999

Appl. No.:

9/400788

Inventors:

Jeffrey R. Watson - Phoenix AZ
Kiet M. Van - Chandler AZ
Steven B. Roach - Gilbert AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23K 3706
F27B 940
F27D 312
F27D 500

US Classification:

228 22

Abstract:

The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.

US Patent:

20170014957, Jan 19, 2017

Filed:

Jul 27, 2016

Appl. No.:

15/221102

Inventors:

- Santa Clara CA, US
Hemanth K. Dhavaleswarapu - Chandler AZ, US
Joseph B. Petrini - Gilbert AZ, US
Shankar Devasenathipathy - Tempe AZ, US
Steven B. Roach - Gilbert AZ, US
Ioan Sauciuc - Phoenix AZ, US
Pranav K. Desai - Chandler AZ, US
George S. Kostiew - Queen Creek AZ, US
Sanjoy K. Saha - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23K 37/00
H05K 3/34
B23K 20/02
H01L 23/00
F25B 21/02
B23K 3/08

Abstract:

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

US Patent:

20160238352, Aug 18, 2016

Filed:

Jan 12, 2016

Appl. No.:

14/994086

Inventors:

- Tempe AZ, US
Alexander Ray - Tempe AZ, US
Bradley Whaley - Gilbert AZ, US
Darin Wagner - Chandler AZ, US
Neil O. Shotton - Tempe AZ, US
Richard A. Blanchard - Los Altos CA, US
Shelby Jueden - Chandler AZ, US
Steven Roach - Gilbert AZ, US
Larry Todd Biggs - Queen Creek AZ, US
Eric Kahrs - Phoenix AZ, US

International Classification:

F41J 5/14

Abstract:

An active target has a target face that is backlit by LEDs, where a detection layer behind the target face detects a new projectile hole in the target, such as from a gun or an arrow. The detection layer may be formed of one or more resistive layers, and the detected increase in resistance due to a new projectile hole being created is sensed and correlated to an XY position of the hole. The location of the new hole is transmitted via an RF signal to the shooter's portable device, such as a smartphone, and the shooter sees the location of the hit relative to the target face in real time. The LEDs may be dynamically controlled. The target is disposable and is supported by a support base containing the control electronics and transmitter.

US Patent:

20160211238, Jul 21, 2016

Filed:

Mar 7, 2016

Appl. No.:

15/062298

Inventors:

- Santa Clara CA, US
Zhihua Li - Chandler AZ, US
Joseph Petrini - Gilbert AZ, US
Steven B. Roach - Chandler AZ, US
Shankar Devasenathipathy - Tempe AZ, US
George S. Kostiew - Scottsdale AZ, US
Amram Eitan - Scottsdale AZ, US

International Classification:

H01L 23/00
B23K 20/00
B23K 35/02
B23K 20/02
B23K 20/26

Abstract:

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

US Patent:

20150173209, Jun 18, 2015

Filed:

Dec 18, 2013

Appl. No.:

14/132883

Inventors:

Hemanth Dhavaleswarapu - Chandler AZ, US
Zhihua Li - Chandler AZ, US
Joseph Petrini - Gilbert AZ, US
Steven B. Roach - Chandler AZ, US
Shankar Devasenathipathy - Tempe AZ, US
George Kostiew - Chandler AZ, US
Amram Eitan - Scottsdale AZ, US

International Classification:

H05K 3/34
H01L 23/00
B23K 37/00
B23K 1/00
B23K 3/04

Abstract:

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.