Steven W Winn

US Patent:

7564674, Jul 21, 2009

Filed:

Dec 12, 2006

Appl. No.:

11/609486

Inventors:

Christine A. Frysz - Orchard Park NY, US
Steven Winn - Lancaster NY, US

Assignee:

Greatbatch Ltd. - Clarence NY

International Classification:

H01G 4/35

US Classification:

361302, 361303, 361305, 3613061, 3613012, 3613081

Abstract:

Terminal pins comprising an outer coating of palladium coating a core material other than of palladium for incorporated into feedthrough filter capacitor assemblies are described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

US Patent:

8442644, May 14, 2013

Filed:

Nov 16, 2009

Appl. No.:

12/619551

Inventors:

Robert A. Stevenson - Canyon Country CA, US
Christine A. Frysz - Orchard Park NY, US
Barry C. Muffoletto - Alden NY, US
Robert W. Siegler - Williamsville NY, US
Steven W. Winn - Lancaster NY, US
Thomas A. Skwara - Orchard Park NY, US
Dominick J. Frustaci - Williamsville NY, US

Assignee:

Greatbatch Ltd. - Clarence NY

International Classification:

A61N 1/05

US Classification:

607 60, 607 1, 607 2, 607 45, 607115, 607116, 607118, 607139

Abstract:

Deep brain electrodes are remotely sensed and activated by means of a remote active implantable medical device (AIMD). In a preferred form, a pulse generator is implanted in the pectoral region and includes a hermetic seal through which protrudes a conductive leadwire which provides an external antenna for transmission and reception of radio frequency (RF) pulses. One or more deep brain electrode modules are constructed and placed which can transmit and receive RF energy from the pulse generator. An RF telemetry link is established between the implanted pulse generator and the deep brain electrode assemblies. The satellite modules are configured for generating pacing pulses for a variety of disease conditions, including epileptic seizures, Turrets Syndrome, Parkinson's Tremor, and a variety of other neurological or brain disorders.

US Patent:

20030073565, Apr 17, 2003

Filed:

May 31, 2002

Appl. No.:

10/161483

Inventors:

Marion Ellis - Elkridge MD, US
Steven Winn - Ellicott City MD, US
Luna Chiu - Abingdon MD, US

International Classification:

C03C014/00
C04B035/468
C04B035/465
C04B035/472

US Classification:

501/032000, 501/134000, 501/135000, 501/136000, 501/137000

Abstract:

Tunable dielectric materials including an electronically tunable dielectric ceramic and a low loss glass additive are disclosed. The tunable dielectric may comprise a ferroelectric perskovite material such as barium strontium titanate. The glass additive may comprise boron, barium, calcium, lithium, manganese, silicon, zinc and/or aluminum-containing glasses having dielectric losses of less than 0.003 at 2 GHz. The materials may further include other additives such as non-tunable metal oxides and silicates. The low loss glass additive enables the materials to be sintered at relatively low temperatures while providing improved properties such as low microwave losses and high breakdown strengths.

US Patent:

20130184796, Jul 18, 2013

Filed:

Jan 16, 2013

Appl. No.:

13/742781

Inventors:

Keith W. Seitz - Clarence Center NY, US
Robert A. Stevenson - Canyon Country CA, US
Xiaohong Tang - Williamsville NY, US
William C. Thiebolt - Tonawanda NY, US
Christine A. Frysz - Orchard Park NY, US
Richard L. Brendel - Carson City NV, US
Jason Woods - Carson City NV, US
Steven W. Winn - Lancaster NY, US
Dominick J. Frustaci - Williamsville NY, US
Buehl E. Truex - Glendora CA, US
Donald Hickel, Jr. - Scottsville NY, US

Assignee:

GREATBATCH LTD. - Clarence NY

International Classification:

A61N 1/05

US Classification:

607116

Abstract:

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

US Patent:

20130184797, Jul 18, 2013

Filed:

Jan 16, 2013

Appl. No.:

13/743254

Inventors:

William C. Thiebolt - Tonawanda NY, US
Christine A. Frysz - Orchard Park NY, US
Keith W. Seitz - Clarence Center NY, US
Robert A. Stevenson - Canyon Country CA, US
Richard L. Brendel - Carson City NV, US
Thomas Marzano - East Amherst NY, US
Jason Woods - Carson City NV, US
Dominick J. Frustaci - Williamsville NY, US
Steven W. Winn - Lancaster NY, US

Assignee:

Greatbatch Ltd. - Clarence NY

International Classification:

A61N 1/05

US Classification:

607116, 427 21, 156250

Abstract:

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

US Patent:

20130226262, Aug 29, 2013

Filed:

Apr 8, 2013

Appl. No.:

13/858268

Inventors:

Christine A. Frysz - Orchard Park NY, US
Barry C. Muffoletto - Alden NY, US
Robert W. Siegler - Williamsville NY, US
Steven W. Winn - Lancaster NY, US
Thomas A. Skwara - Orchard Park NY, US
Dominick J. Frustaci - Williamsville NY, US

Assignee:

Greatbatch Ltd. - Clarence NY

International Classification:

A61N 1/36

US Classification:

607 45

Abstract:

Deep brain electrodes are remotely sensed and activated by means of a remote active implantable medical device (AIMD). In a preferred form, a pulse generator is implanted in the pectoral region and includes a hermetic seal through which protrudes a conductive leadwire which provides an external antenna for transmission and reception of radio frequency (RF) pulses. One or more deep brain electrode modules are constructed and placed which can transmit and receive RF energy from the pulse generator. An RF telemetry link is established between the implanted pulse generator and the deep brain electrode assemblies. The satellite modules are configured for generating pacing pulses for a variety of disease conditions, including epileptic seizures, Turrets Syndrome, Parkinson's Tremor, and a variety of other neurological or brain disorders.

US Patent:

20140036409, Feb 6, 2014

Filed:

Jan 16, 2013

Appl. No.:

13/743276

Inventors:

Thomas Marzano - East Amherst NY, US
Keith W. Seitz - Clarence Center NY, US
Steven W. Winn - Lancaster NY, US
Christine A. Frysz - Orchard Park NY, US
Richard L. Brendel - Carson City NV, US
Jason Woods - Carson City NV, US
Dominick J. Frustaci - Williamsville NY, US
Xiaohong Tang - Williamsville NY, US
William C. Thiebolt - Tonawanda NY, US

Assignee:

GREATBATCH LTD. - Clarence NY

International Classification:

H01G 4/35

US Classification:

361302

Abstract:

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

US Patent:

20200121935, Apr 23, 2020

Filed:

Dec 10, 2019

Appl. No.:

16/708881

Inventors:

- Clarence NY, US
Xiaohong Tang - Williamsville NY, US
William C. Thiebolt - Tonawanda NY, US
Christine A. Frysz - Orchard Park NY, US
Keith W. Seitz - Clarence Center NY, US
Richard L. Brendel - Carson City NV, US
Thomas Marzano - East Amherst NY, US
Jason Woods - Carson City NV, US
Dominick J. Frustaci - Williamsville NY, US
Steven W. Winn - Horseheads NY, US

International Classification:

A61N 1/375
A61N 1/05
H01G 4/35
H01G 2/10
H01R 43/00

Abstract:

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400 C. to about 700 C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400 C. to about 1,900 C. for up to 6 hours; and a cool down portion at a rate of up to 5/minute from a maximum sintering temperature down to about 1,000 C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.