Sung H Chang

US Patent:

6837153, Jan 4, 2005

Filed:

Dec 29, 2003

Appl. No.:

10/745545

Inventors:

Sung Shan Chang Chien - Walnut Creek CA, US

International Classification:

A23L 100
A23N 100
A47J 4306
A47J 4307
B02C 1912

US Classification:

99510, 99348, 99492, 99509, 24119912, 2412822, 366205, 366314

Abstract:

An improved structure of a fruit and vegetable processor is disclosed. The bottom section of one side of the circumferential edge of the cup body of the processor has a protruded passage which is in communication with the interior of the cup body. The passage is mounted with a filtering tube with filter so that the juice from the crushing of fruit and vegetable will be centrifuged to the cavity at the circumferential wall of the cup body when the blade rotates and the juice is filtered.

US Patent:

7263926, Sep 4, 2007

Filed:

Jan 12, 2005

Appl. No.:

11/033294

Inventors:

Sung Shan Chang Chien - Walnut Creek CA, US

International Classification:

A23L 1/00

US Classification:

99510, 99348, 99495

Abstract:

An improved structure of a fruit and vegetable processor is disclosed. The processor comprises a base seat, a power unit located within the base seat, a cup body, a blade mounted within the cup body and rotated by the power unit, a cap, at least a passage which passed through the cup body to the outside thereof, characterized in that the inner wall at the side of the passage is mounted with a filtering means extended upward from the bottom section of the cup body, and a distance is formed between the filtering means and the inner wall of the cup body.

US Patent:

61689742, Jan 2, 2001

Filed:

Feb 8, 2000

Appl. No.:

9/499963

Inventors:

Sung Chul Chang - Riverbank CA
Igor Y. Khandros - Orinda CA
William D. Smith - Pleasanton CA

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438109

Abstract:

A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se.

US Patent:

60231033, Feb 8, 2000

Filed:

Jun 30, 1998

Appl. No.:

9/106943

Inventors:

Sung Chul Chang - Riverbank CA
Igor Y. Khandros - Orinda CA
William D. Smith - Pleasanton CA

Assignee:

FormFactor, Inc. - Livermore CA

International Classification:

H01L 29417

US Classification:

257781

Abstract:

A plurality of free-standing resilient contact structures (spring elements) are mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se. The carrier substrate is pre-fabricated, by mounting the spring elements thereto prior to mounting the carrier substrate to the semiconductor device(s), or vice-versa.