Sung Y Kang

US Patent:

6337522, Jan 8, 2002

Filed:

Jun 30, 1998

Appl. No.:

09/106780

Inventors:

Sung Kwon Kang - Chappaqua NY
Sampath Purushothaman - Yorktown Heights NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23532

US Classification:

257784, 257777, 257778, 257764, 257762, 257772, 257737, 257738, 257789, 257788, 257795, 257673

Abstract:

A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

US Patent:

6551931, Apr 22, 2003

Filed:

Nov 7, 2000

Appl. No.:

09/706820

Inventors:

Daniel C. Edelstein - White Plains NY
Sung Kwon Kang - Chappaqua NY
Maurice McGlashan-Powell - Yorktown Heights NY
Eugene J. OSullivan - Nyack NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

438687, 438678, 438679

Abstract:

A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed.

US Patent:

6646355, Nov 11, 2003

Filed:

Jan 7, 2002

Appl. No.:

10/036462

Inventors:

Sung Kwon Kang - Chappaqua NY
Sampath Purushothaman - Yorktown Heights NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23532

US Classification:

257784, 257786, 257778, 257737, 257738, 257764, 257762, 257772, 257789, 257788, 257795, 257673

Abstract:

A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

US Patent:

6784088, Aug 31, 2004

Filed:

Jan 16, 2003

Appl. No.:

10/345288

Inventors:

Daniel C. Edelstein - White Plains NY
Sung Kwon Kang - Chappaqua NY
Maurice McGlashan-Powell - Yorktown Heights NY
Eugene J. OSullivan - Nyack NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

438612, 438613, 438614, 438637, 438638, 438666, 438678, 438679, 438686, 438687

Abstract:

A method to selectively cap a cooper BEOL terminal pad with a Cu/Sn/Au alloy. The method includes providing one or more Cu BEOL terminal pads and coating the pads with a Sn coating followed by coating the Sn with a Au coating. The coated pads are then annealed to form the Cu/Sn/Au capping alloy.

US Patent:

6805974, Oct 19, 2004

Filed:

Feb 15, 2002

Appl. No.:

10/078020

Inventors:

Won K. Choi - Mount Kisco NY
Charles C. Goldsmith - Poughkeepsie NY
Timothy A. Gosselin - Apalachin NY
Donald W. Henderson - Ithaca NY
Sung K. Kang - Chappaqua NY
Da-Yuan Shih - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 3526

US Classification:

428646, 428647, 428648, 420560, 420557, 420561, 257780, 257738, 22818022, 228563

Abstract:

A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4. 0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1. 5%.

US Patent:

7079393, Jul 18, 2006

Filed:

Nov 16, 2004

Appl. No.:

10/904555

Inventors:

Evan G. Colgan - Chestnut Ridge NY, US
Frank L. Pompeo - Redding CT, US
Glenn G. Daves - Fishkill CT, US
Hilton T. Toy - Hopewell Junction NY, US
Bruce K. Furman - Poughquag NY, US
David L. Edwards - Poughkeepsie NY, US
Michael A. Gaynes - Vestal NY, US
Mukta G. Farooq - Hopewell Junction NY, US
Sung K. Kang - Chappaqua NY, US
Steven P. Ostrander - Poughkeepsie NY, US
Jaimal M. Williamson - Wappingers Falls NY, US
Da-Yuan Shih - Poughkeepsie NY, US
Donald W. Henderson - Ithaca NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20

US Classification:

361699, 257714, 165 804, 174 151

Abstract:

A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

US Patent:

7115996, Oct 3, 2006

Filed:

May 25, 2004

Appl. No.:

10/852142

Inventors:

Daniel C. Edelstein - White Plains NY, US
Sung Kwon Kang - Chappaqua NY, US
Maurice McGlashan-Powell - Yorktown Heights NY, US
Eugene J. O'Sullivan - Nyack NY, US
George F. Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40

US Classification:

257762, 257773, 257774, 257775, 257E23106, 257E23161, 257E23163

Abstract:

A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed.

US Patent:

7329948, Feb 12, 2008

Filed:

Oct 15, 2004

Appl. No.:

10/966202

Inventors:

Sri M. Sri-Jayantha - Ossining NY, US
Gareth Hougham - Ossining NY, US
Sung Kang - Chappaqua NY, US
Lawrence Mok - Brewster NY, US
Hien Dang - Nanuet NY, US
Arun Sharma - New Rochelle NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/10
H01L 23/34

US Classification:

257707, 257E23087, 257706, 257719, 257720, 361704, 361705, 438122

Abstract:

A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.