Susan B Gordon

US Patent:

20030157271, Aug 21, 2003

Filed:

Mar 20, 2003

Appl. No.:

10/391785

Inventors:

Michael Duignan - Washington DC, US
Susan Gordon - Washington DC, US
C. Christensen - Fairhaven MD, US

International Classification:

C23C014/30

US Classification:

427/596000

Abstract:

Pulse-position synchronized deposition of a material in miniature structure manufacturing processes is carried out in a fabrication tool including a material carrier element, a source of energy generating pulses of energy, a substrate, and a control unit operatively coupled to the source of energy, substrate, and the material carrier element. The control unit exposes a first area of the material carrier element to a first pulse of energy, pauses the exposure while initiating relative motion between the source of energy and the substrate at a predetermined first speed and relative motion between the material carrier element and the energy source at a predetermined second speed which is a function of the first speed, and slowing (or stopping) relative motion between the energy source, material carrier element, and the substrate, while exposing the unablated area of the material carrier element adjacent to previously ablated area to a second pulse of energy.

US Patent:

20050006335, Jan 13, 2005

Filed:

Jul 7, 2003

Appl. No.:

10/612904

Inventors:

Christopher Wargo - Highland Park NJ, US
Paul Kydd - Lawrenceville NJ, US
Scott Mathews - Germantown MD, US
Michael Duignan - Washington DC, US
Susan Gordon - Washington DC, US
Chengping Zhang - Rockville MD, US
Todd Kegresse - Catonsville MD, US

International Classification:

H01K003/10

US Classification:

216018000, 029852000, 216065000

Abstract:

A method of forming high resolution electronic circuits () on a substrate () is provided. The method includes the steps of laminating a dielectric layer () on a substrate (), laser drilling channels (and ) in the dielectric film () and the substrate (), and filling channels (and ) with a filler material (). Further, a release layer () is applied to dielectric film layer () and filler material (), the release layer () having an adhesive thereon. Release layer () is peeled or otherwise removed from substrate (), leaving filler material () formed and shaped on substrate (), thus producing a high resolution electronic circuit on substrate ().

US Patent:

20060118233, Jun 8, 2006

Filed:

Jan 5, 2006

Appl. No.:

11/325519

Inventors:

Christopher Wargo - Highland Park NJ, US
Scott Mathews - Germantown MD, US
Paul Kydd - Lawrenceville NJ, US
Todd Kegresse - Catonsville MD, US
Chengping Zhang - Rockville MD, US
Michael Duignan - Washington DC, US
Susan Gordon - Washington DC, US

International Classification:

B32B 37/00
B27G 11/02
B32B 38/10

US Classification:

156247000, 156272200, 156379600

Abstract:

A system and method for forming high resolution electronic circuits on a substrate is provided. The system () includes a substrate (), a source of radiant energy () and a focusing means (). The source of radiant energy () directs an energy beam () through the focusing means () in order to direct a focused energy beam () onto the surface of the substrate (). The focused energy beam () creates a plurality of channels () in the surface of the substrate (). A paste applicator () fills the channels () with an electrically conductive paste (). Once heated and cured, the electrically conductive paste () makes up the electrically conductive pathways of the electronic circuit.

US Patent:

20090123661, May 14, 2009

Filed:

Jan 6, 2009

Appl. No.:

12/318667

Inventors:

Christopher Wargo - Highland Park NJ, US
Scott Mathews - Germantown MD, US
Paul Kydd - Lawrenceville NJ, US
Todd A. Kegresse - Catonsville MD, US
Chengping Zhang - Rockville MD, US
Michael Duignan - Washington DC, US
Susan Gordon - Washington DC, US

International Classification:

H05K 3/00
B05D 3/06

US Classification:

427555, 427 986

Abstract:

A system and method for forming high resolution electronic circuits on a substrate is provided. The system () includes a substrate (), a source of radiant energy () and a focusing means (). The source of radiant energy () directs an energy beam () through the focusing means () in order to direct a focused energy beam () onto the surface of the substrate (). The focused energy beam () creates a plurality of channels () in the surface of the substrate (). A paste applicator () fills the channels () with an electrically conductive paste (). Once heated and cured, the electrically conductive paste () makes up the electrically conductive pathways of the electronic circuit.