Tapan G Desai from Oakland Gardens, NY, age 47

Medicine Doctors

Tapan A. Desai

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Specialties:

Pulmonary Disease

Work:

Franciscan Physician NetworkFranciscan Medical Specialists-Pulmonary Allergy & Asthma
761 45 Ave STE 108, Munster, IN 46321
(219)9225416 (phone), (219)9223745 (fax)

Education:

Medical School
Univ of the West Indies, Fac of Med, St Augustine, Trinidad
Graduated: 2002

Procedures:

Pulmonary Function Tests

Conditions:

Acute Upper Respiratory Tract Infections
Bacterial Pneumonia
Emphysema
Insomnia
Obstructive Sleep Apnea

Languages:

English

Description:

Dr. Desai graduated from the Univ of the West Indies, Fac of Med, St Augustine, Trinidad in 2002. He works in Munster, IN and specializes in Pulmonary Disease. Dr. Desai is affiliated with Community Hospital, Franciscan Healthcare Munster, Franciscan St Margaret Health and Franciscan St Margaret Health-Dyer.

License Records

Tapan A Desai

Phone:

(786)8598725

License #:

114221 - Expired

Category:

Health Care

Issued Date:

Sep 19, 2012

Effective Date:

Feb 1, 2017

Expiration Date:

Jan 31, 2017

Type:

Medical Doctor

Resumes

Lead Engineer At Advanced Cooling Technologies

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Position:

Lead Engineer at Advanced Cooling Technologies

Location:

Lancaster, Pennsylvania Area

Industry:

Research

Work:

Advanced Cooling Technologies - Lancaster, Pennsylvania Area since Jan 2012
Lead Engineer
Advanced Cooling Technologies - Lancaster, Pennsylvania Jun 2009 - Dec 2011
R & D Engineer
Idaho National Laboratory Jun 2006 - May 2009
Research Associate
Argonne National Laboratory Dec 2005 - May 2006
Postdoctoral Researcher

Education:

Rensselaer Polytechnic Institute 2001 - 2005
Ph.D., Materials Science and Engineering

Skills:

Materials Science
R&D
Science
Thermal
Design of Experiments
Simulations
Materials
Nanomaterials

Honor & Awards:

ACT Innovator in Action Award for Q4 of 2012

Tapan Desai

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Location:

United States

Us Patents

Semiconductor Having Integrally-Formed Enhanced Thermal Management
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US Patent:

20130147050, Jun 13, 2013
Filed:

Dec 12, 2011
Appl. No.:

13/316906
Inventors:

Tapan Desai - Sinking Spring PA, US
Assignee:

ADVANCED COOLING TECHNOLOGIES, INC. - Lancaster PA
International Classification:

H01L 23/488
H01L 21/50
US Classification:

257773, 438106, 257E21499, 257E23023
Abstract:

A semiconductor structure and method of manufacturing that has integrally-formed enhanced thermal management. During operation of a semiconductor device, electron flow between the source and the drain creates localized heat generation. A containment gap is formed by selectively removing a portion of the back side of the semiconductor device substrate directly adjacent to a localized heat generation area. A thermal management material is filled in the containment gap. This thermal management material enhances the thermal management of the semiconductor device by thermally coupling the localized heat generation area to a heat sink. The thermal management material may be a Phase Change Material (PCM) having a heat of fusion effective for absorbing heat generated in the localized heat generation area by the operation of the semiconductor device for reducing a peak operating temperature of the semiconductor device.