Terrence R O'Toole

US Patent:

58008586, Sep 1, 1998

Filed:

Sep 12, 1996

Appl. No.:

8/711894

Inventors:

Harry Randall Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin Goldberg - San Jose CA
Voya Rista Markovich - Endwell NY
Linda Matthew - Palo Alto CA
Donald G. McBride - Binghamton NY
Terrence Robert O'Toole - Webster NY
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 512

US Classification:

427 97

Abstract:

A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

US Patent:

55828582, Dec 10, 1996

Filed:

Jun 7, 1995

Appl. No.:

8/474985

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Seoul, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 510

US Classification:

427 96

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines.

US Patent:

53744543, Dec 20, 1994

Filed:

Feb 4, 1993

Appl. No.:

8/013652

Inventors:

Harry R. Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin J. Goldberg - Mahopac NY
Voya R. Markovich - Endwell NY
Linda C. Matthew - Peekskill NY
Donald G. McBride - Binghampton NY
Terrence R. O'Toole - Hopewell Junction NY
Stephen L. Tisdale - Vestal NY
Alfred Viehbeck - Stormville NY

Assignee:

International Business Machines Incorporated - Armonk NY

International Classification:

B05D 100

US Classification:

427306

Abstract:

A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

US Patent:

53105800, May 10, 1994

Filed:

Apr 27, 1992

Appl. No.:

7/874665

Inventors:

Eugene J. O'Sullivan - Upper Nyack NY
Terrence R. O'Toole - Webster NY
Judith M. Roldan - Ossining NY
Lubomyr T. Romankiw - Briarcliff Manor NY
Carlos J. Sambucetti - Croton-on-Hudson NY
Ravi Saraf - Briarcliff Manor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 206

US Classification:

427307

Abstract:

Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation.

US Patent:

53266439, Jul 5, 1994

Filed:

Oct 7, 1991

Appl. No.:

7/771929

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Cheongryang, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 900

US Classification:

4284722

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines.

US Patent:

55995829, Feb 4, 1997

Filed:

Jun 7, 1995

Appl. No.:

8/475412

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Seoul, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 510

US Classification:

4272071

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide.

US Patent:

58741542, Feb 23, 1999

Filed:

Sep 12, 1996

Appl. No.:

8/711865

Inventors:

Harry Randall Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin Goldberg - San Jose CA
Voya Rista Markovich - Endwell NY
Linda Matthew - Palo Alto CA
Donald G. McBride - Binghamton NY
Terrence Robert O'Toole - Webster NY
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 324
B32B 1508

US Classification:

428131

Abstract:

A structure including a halogenated polymeric-containing layer. At least a portion of a surface of the halogenated polymeric-containing layer is electrochemically reduced. An electrically conductive pattern is provided over at least a portion of the electrochemically reduced portion of the halogenated polymeric-containing layer.

US Patent:

57099065, Jan 20, 1998

Filed:

Jun 16, 1995

Appl. No.:

8/490930

Inventors:

Harry Randall Bickford - Ossining NY
Peter J. Duke - Endwell NY
Elizabeth Foster - Friendsville PA
Martin Goldberg - San Jose CA
Voya Rista Markovich - Endwell NY
Linda Matthew - Palo Alto CA
Donald G. McBride - Binghamton NY
Terrence Robert O'Toole - Webster NY
Stephen Leo Tisdale - Endwell NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 304

US Classification:

427306

Abstract:

A method of treating a halogenated polymeric-containing substrate including exposing at least portions of the halogenated polymeric-containing substrate to a composition containing a reducing agent and an aprotic solvent selected from the group consisting of nitriles, nitro compounds, amides, esters, carbonates, oxides, sulfo compounds and mixtures thereof. The solvent is free of ethers, amines, ammonia. The composition is prepared by reacting a metal with an organic compound selected from the group consisting of polyaryl compounds, aromatic carbonyl containing compounds, aromatic nitriles, and aromatic heterocyclic nitrogen containing compounds in a reaction solvent that does not react with the metal but permits reaction between the metal and the organic compound to thereby provide the reducing agent. The reducing agent is isolated from the reaction solvent to obtain a reaction product as a solid. The reaction product is added to the aprotic solvent.