Thomas J Dennes

US Patent:

20150196685, Jul 16, 2015

Filed:

Mar 19, 2015

Appl. No.:

14/662925

Inventors:

- Princeton NJ, US
Thomas J. Dennes - Parkesburg PA, US

International Classification:

A61L 27/30
A61L 27/18
C23C 18/12

Abstract:

Polymer substrates including adhesion layers for activating the surface of the substrate are provided, thereby allowing the substrate to react with organic, inorganic, metallic and/or organometallic materials. The surface of the polymer substrate is coated with a metal oxide layer that is subjected to conditions adequate to form an oxide adhesion layer. Combining deposition techniques for formation of functionalized polymer surfaces with photolithographic techniques enables spatial control of RGD presentation at the polymer surfaces are achieved with sub-cellular resolution. Surface patterning enables control of cell adhesion location at the surface of the polymer and influences cell shape. Metallization of polymers as described herein provides a means to prepare metal-based electrical circuitry on a variety of flexible substrates.