Thomas E Morris

US Patent:

20170047232, Feb 16, 2017

Filed:

Aug 15, 2016

Appl. No.:

15/236586

Inventors:

- Greensboro NC, US
Frank Juskey - Apopka FL, US
Thomas Scott Morris - Lewisville NC, US
Charles E. Carpenter - Orlando FL, US
Robert Hartmann - Apopka FL, US

International Classification:

H01L 21/56
H01L 23/29
H01L 23/31
H01L 25/065
H01L 25/00

Abstract:

The present disclosure relates to a packaging process using a low pressure encapsulant. According to an exemplary process, an assembly including a substrate, a surface mounted device (SMD) mounted on the substrate, and a space between the SMD and the substrate is provided. The SMD has a sealed cavity biased towards the substrate. A sheet mold compound is laid over the SMD and the assembly is heated such that the sheet mold compound transitions to a liquid phase to form a molten mold compound. Next, the assembly is subjected to a vacuum that creates a negative atmosphere allowing the molten mold compound to flow towards the top surface of the substrate and about the SMD. The molten mold compound is then pressed towards the substrate at a low pressure (

Address:

3285 Delaney Rd, Winnemucca, NV 89445

Phone:

(775)6254242

VIN:

1D7KS28C97J510189

Make:

DODGE

Model:

RAM PICKUP 2500

Year:

2007