Thomas H Osterheld

US Patent:

6361405, Mar 26, 2002

Filed:

Apr 6, 2000

Appl. No.:

09/544734

Inventors:

Jeffrey D. David - Sunnyvale CA
Benjamin A. Bonner - San Mateo CA
Thomas H. Osterheld - Mountain View CA
Sidney Huey - Milpitas CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 100

US Classification:

451 41, 451 44

Abstract:

A utility wafer, more specifically, an utility wafer for simulating a workpiece in a semiconductor processing system. The utility wafer includes a first side, a second side and a peripheral edge wherein one or both edges of the peripheral edge are relieved to remove the otherwise sharp edge. In one embodiment, the peripheral edge is polished. The utility wafer is resistant to chipping, stress cracking and breakage when undergoing chemical mechanical planarization.

US Patent:

6435942, Aug 20, 2002

Filed:

Feb 11, 2000

Appl. No.:

09/502379

Inventors:

Raymond R Jin - San Jose CA
Jeffrey Drue David - Sunnyvale CA
Fred C Redeker - Fremont CA
Thomas H Osterheld - Mountain View CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 4900

US Classification:

451 8, 451 37, 451 41, 451 57, 451 59

Abstract:

A substrate is chemical mechanical polished first with a single layer hard polishing pad and a high-selectivity slurry until a first endpoint is reached, and then with a soft polishing pad and a low-selectivity slurry until a second endpoint is reached. Dishing is reduced when low-selectivity slurry is used at the second polishing step. Low Within-Wafer-Non-Uniformity is achieved by using a single layer hard pad at low pressure at the first polishing step.

US Patent:

6520847, Feb 18, 2003

Filed:

Oct 29, 2001

Appl. No.:

10/040108

Inventors:

Thomas H. Osterheld - Mountain View CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24D 1100

US Classification:

451527, 529550

Abstract:

A polishing pad with a layer that provides a polishing surface. The layer has a thickness between about 0. 06 and 0. 12 inches, and a plurality of substantially circular grooves having a depth between about 0. 02 and 0. 05 inches are formed in the polishing surface.

US Patent:

6561381, May 13, 2003

Filed:

Nov 20, 2000

Appl. No.:

09/717720

Inventors:

Thomas H. Osterheld - Mountain View CA
Benjamin A. Bonner - San Mateo CA
Michael W. Richter - Sunnyvale CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B67B 700

US Classification:

222 1, 222 58, 222 61, 222335, 222399

Abstract:

Liquid material is precisely dispensed to a semiconductor processing tool utilizing closed loop control. In one embodiment, CMP slurry material of known density is supplied from a reservoir/mixing vessel to a dispense module. The dispense module also receives a flow of an inert gas through a gas supply valve. Positive pressure arising within the dispense module due to the inert gas flow causes an outflow of slurry from the dispense module to the CMP platen. The rate of flow of the slurry to the CMP platen over time is determined by monitoring the change (decline) in weight of the filled dispense module. In a similar manner, variation in the rate of flow of slurry over time may be detected by monitoring variation in changes in weight of the filled dispense module over time. A regulator structure in electronic communication with the dispense module and with the gas supply valve receives first signals at different time points indicating the weight change of the dispense module. In response, the regulator structure communicates a second signal to the gas supply valve, reflecting an appropriate change in the rate of flow of CMP slurry material to the platen.

US Patent:

6572446, Jun 3, 2003

Filed:

Sep 18, 2000

Appl. No.:

09/664603

Inventors:

Thomas H. Osterheld - Mountain View CA
Manoocher Birang - Los Gatos CA
Robert D. Tolles - Santa Jose CA
Steven Zuniga - Soquel CA
Charles C. Garretson - Palo Alto CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

B24B 5100

US Classification:

451 24, 451 56, 451443, 451444

Abstract:

A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.

US Patent:

6616513, Sep 9, 2003

Filed:

Apr 5, 2001

Appl. No.:

09/826419

Inventors:

Thomas H. Osterheld - Mountain View CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 100

US Classification:

451 56, 451287, 451527

Abstract:

A method and apparatus for measuring wear of the thickness of a chemical mechanical polishing pad are provided. The apparatus includes a chemical mechanical polishing pad having a plurality of reliefs in a main polishing surface for determining wear of the pad. In one aspect, the pad reliefs comprise through-holes in the pad or extend partially through a thickness of the pad. The method for measuring wear of the thickness of a chemical mechanical polishing pad includes providing a plurality of reliefs in a main polishing surface of the pad and measuring a distance from the main polishing surface to a bottom surface of each of a plurality of the reliefs.

US Patent:

6645061, Nov 11, 2003

Filed:

Nov 16, 1999

Appl. No.:

09/441633

Inventors:

Doyle E. Bennett - Santa Clara CA
Thomas H. Osterheld - Mountain View CA
Fred C. Redeker - Fremont CA
Ginetto Addiego - Berkeley CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24D 1100

US Classification:

451527, 451550

Abstract:

A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

US Patent:

6699115, Mar 2, 2004

Filed:

Dec 27, 2002

Appl. No.:

10/330876

Inventors:

Thomas H Osterheld - Mountain View CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

B24D 1100

US Classification:

451527, 529550, 451 41

Abstract:

A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.