Thomas E Pettit

US Patent:

6425804, Jul 30, 2002

Filed:

Mar 21, 2000

Appl. No.:

09/532102

Inventors:

Thomas E. Pettit - Corvallis OR
James Denning Smith - Albany OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B24C 304

US Classification:

451 38, 451 75, 451 99

Abstract:

A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.

US Patent:

6435950, Aug 20, 2002

Filed:

Dec 17, 2001

Appl. No.:

10/024059

Inventors:

Thomas E. Pettit - Corvallis OR
James Denning Smith - Albany OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B24B 100

US Classification:

451 60

Abstract:

A method of delivering abrasive particulate material under pressure from a storage container adapted to contain the abrasive particulate material therein includes communicating an inlet valve with an inlet opening of the storage container and supplying a first gas, regulated to a first predetermined pressure, to the inlet valve. The first gas is released through the inlet valve and into the storage container, and a quantity of the abrasive particulate material is discharged through an outlet opening of the storage container to an output junction. In addition a second gas, regulated to a second predetermined pressure, is supplied to the output junction. As such, a pressurized supply of the abrasive particulate material is formed and delivered through the output junction.

US Patent:

6623335, Sep 23, 2003

Filed:

Dec 17, 2001

Appl. No.:

10/023064

Inventors:

Thomas E. Pettit - Corvallis OR
James Denning Smith - Albany OR

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B24C 304

US Classification:

451 28, 451 41, 451 75, 451 99, 251121

Abstract:

A method of forming an ink fill slot in a silicon substrate of an ink-jet printhead includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to form the ink fill slot in the silicon substrate.

US Patent:

6623338, Sep 23, 2003

Filed:

Dec 17, 2001

Appl. No.:

10/023784

Inventors:

Thomas E. Pettit - Corvallis OR
James Denning Smith - Albany OR

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B24C 304

US Classification:

451 41, 451 28, 451 75, 451 99, 451446, 251121

Abstract:

A method of abrading a portion of a silicon substrate includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to abrade the portion of the silicon substrate.

US Patent:

6648732, Nov 18, 2003

Filed:

Jan 30, 2001

Appl. No.:

09/772752

Inventors:

Mark H. MacKenzie - Corvallis OR
Thomas E Pettit - Corvallis OR
Victorio A. Chavarria - Corvallis OR
Steven P Storm - Corvallis OR
Allen H Smith - Corvallis OR

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B24C 104

US Classification:

451 38, 451 29

Abstract:

A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide.

US Patent:

6834946, Dec 28, 2004

Filed:

Jan 28, 2002

Appl. No.:

10/059688

Inventors:

James C. McKinnell - Salem OR
Thomas E. Pettit - Corvallis OR
Raymond James Ehlers Jr. - Corvallis OR
Eric S. Dod - Corvallis OR
Roberta Stinson - Albany OR

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2175

US Classification:

347 86

Abstract:

An ink jet cartridge is provided comprising an outlet port, an ink containing region, and a wick substantially surrounding a portion of the ink containing region, the wick being configured such that ink flows to the outlet port. Preferably, the wick is configured such that ink flows to the outlet port irrespective of an orientation of the ink jet cartridge.

US Patent:

6945634, Sep 20, 2005

Filed:

Oct 3, 2003

Appl. No.:

10/679097

Inventors:

Mark H. MacKenzie - Corvallis OR, US
Thomas E Pettit - Corvallis OR, US
Victorio A. Chavarria - Corvallis OR, US
Steven P Storm - Corvallis OR, US
Allen H Smith - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J002/05

US Classification:

347 63

Abstract:

A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide.

US Patent:

7594328, Sep 29, 2009

Filed:

Feb 28, 2005

Appl. No.:

11/069421

Inventors:

Mark H. MacKenzie - Corvallis OR, US
Thomas E. Pettit - Corvallis OR, US
Victorio A. Chavarria - Corvallis OR, US
Steven P Storm - Corvallis OR, US
Allen H Smith - Corvallis OR, US
Tony Cruz-Uribe - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B23P 17/00
B41J 2/045

US Classification:

298901, 29611, 29830, 29831, 29832, 347 71

Abstract:

A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.