Thomas E Pritchett

US Patent:

20200278309, Sep 3, 2020

Filed:

Mar 1, 2019

Appl. No.:

16/290171

Inventors:

- St. Michael, BB
Kevin M. Gertiser - Carmel IN, US
Jack L. Glenn - Union Pier MI, US
Narendra J. Mane - Kokomo IN, US
Thomas E. Pritchett - Clarksburg MD, US
Soumyajit Routh - Kokomo IN, US
Kok Wee Yeo - Singapore, SG

International Classification:

G01N 25/18

Abstract:

A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.