Thomas C Verburgt

US Patent:

6826298, Nov 30, 2004

Filed:

Apr 29, 2000

Appl. No.:

09/562273

Inventors:

Jeffrey ODell - Deephaven MN
Thomas Verburgt - Eden Prairie MN
Mark Harless - New Hope MN
Cory Watkins - Ramsey MN

Assignee:

August Technology Corp. - Bloomington MN

International Classification:

G06K 900

US Classification:

382149, 25055939

Abstract:

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

US Patent:

6937753, Aug 30, 2005

Filed:

Apr 29, 2000

Appl. No.:

09/561570

Inventors:

Jeffrey O'Dell - Deephaven MN, US
Thomas Verburgt - Eden Prairie MN, US
Mark Harless - New Hope MN, US
Steve Herrmann - Chaska MN, US

Assignee:

August Technology Corp. - Bloomington MN

International Classification:

G06K009/00

US Classification:

382141, 382145, 382149, 348126, 348 86, 438 16

Abstract:

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

US Patent:

7729528, Jun 1, 2010

Filed:

Aug 10, 2004

Appl. No.:

10/915666

Inventors:

Jeffrey O'Dell - Deephaven MN, US
Thomas Verburgt - Eden Prairie MN, US
Mark Harless - New Hope MN, US
Cory Watkins - Ramsey MN, US

Assignee:

Rudolph Technologies, Inc. - Flanders NJ

International Classification:

G06K 9/00
G01N 21/86
G01V 8/00

US Classification:

382149, 25055939

Abstract:

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

US Patent:

20100239157, Sep 23, 2010

Filed:

May 28, 2010

Appl. No.:

12/789829

Inventors:

Jeffrey O'Dell - Deephaven MN, US
Thomas Verburgt - Eden Prairie MN, US
Mark Harless - New Hope MN, US
Cory Watkins - Ramsey MN, US

Assignee:

RUDOLPH TECHNOLOGIES, INC. - Flanders NJ

International Classification:

G06K 9/00

US Classification:

382145

Abstract:

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

US Patent:

20120087569, Apr 12, 2012

Filed:

Oct 14, 2011

Appl. No.:

13/273645

Inventors:

Jeffrey O'Dell - Deephaven MN, US
Thomas Verburgt - Eden Prairie MN, US
Mark Harless - New Hope MN, US
Cory Watkins - Ramsey MN, US

Assignee:

RUDOLPH TECHNOLOGIES, INC. - Flanders NJ

International Classification:

G06K 9/00

US Classification:

382149

Abstract:

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

US Patent:

63242982, Nov 27, 2001

Filed:

Jul 13, 1999

Appl. No.:

9/352564

Inventors:

Jeffrey O'Dell - Bloomington MN
Mark Harless - New Hope MN
Thomas Verburgt - Eden Prairie MN

Assignee:

August Technology Corp. - Bloomington MN

International Classification:

G06K 962

US Classification:

382149

Abstract:

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

US Patent:

20160223470, Aug 4, 2016

Filed:

Apr 7, 2016

Appl. No.:

15/093130

Inventors:

- Flanders NJ, US
Thomas Verburgt - Eden Prairie MN, US
Mark Harless - New Hope MN, US
Cory Watkins - Ramsey MN, US

International Classification:

G01N 21/95
G06T 7/00
H04N 5/225
G01N 21/88

Abstract:

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.