Thomas D Weir

US Patent:

6447270, Sep 10, 2002

Filed:

Sep 16, 1999

Appl. No.:

09/397359

Inventors:

Robert A. Schmidt - Lapeer MI
Bruce A. Smetana - Colton WA
Thomas T. Weir - Pullman WA

Assignee:

Walbro Corporation - Cass City MI
Isothermal Systems Research, Inc. - Clarkston WA

International Classification:

F04B 1700

US Classification:

417366, 165804

Abstract:

A liquid pump with a brushless motor constructed to be received within a liquid reservoir of a cooling system to deliver liquid coolant under pressure to a manifold assembly through which the coolant is discharged onto various electronic components to cool them. The pump has a pumping assembly, a rotor, a stator and an electronic control circuit which controls the operation of the pump and each of which is immersed in liquid coolant in the pump housing to cool them as the coolant flows through the pump. Further, because each component within the pump can be exposed to the liquid in the pump, no sealed enclosures are needed for the pump as a whole or for any component therein and the pump can be received directly in the reservoir.

US Patent:

7159414, Jan 9, 2007

Filed:

Feb 24, 2004

Appl. No.:

10/786243

Inventors:

Charles L Tilton - Colton WA, US
Thomas D Weir - Pullman WA, US
Paul A Knight - Spokane WA, US

Assignee:

Isothermal Systems Research Inc. - Liberty Lake WA

International Classification:

F28D 5/00

US Classification:

62304, 622592

Abstract:

The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.

US Patent:

7717162, May 18, 2010

Filed:

Dec 22, 2005

Appl. No.:

11/275307

Inventors:

Charles L. Tilton - Colton WA, US
Donald Tilton - Colton WA, US
Thomas D Weir - Pullman WA, US
Randall T. Palmer - Liberty Lake WA, US

Assignee:

Isothermal Systems Research, Inc. - Liberty Lake WA

International Classification:

F28D 15/02

US Classification:

16510431, 165 804

Abstract:

A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.

US Patent:

7779896, Aug 24, 2010

Filed:

Nov 21, 2007

Appl. No.:

11/944244

Inventors:

Charles L Tilton - Colton WA, US
Donald Tilton - Colton WA, US
Thomas D Weir - Pullman WA, US
Randall T. Palmer - Liberty Lake WA, US

Assignee:

Parker-Hannifin Corporation - Cleveland OH

International Classification:

F28D 15/02

US Classification:

16510431, 165 804

Abstract:

A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.

US Patent:

7992626, Aug 9, 2011

Filed:

Sep 15, 2006

Appl. No.:

11/532421

Inventors:

Charles L. Tilton - Liberty Lake WA, US
Donald E. Tilton - Liberty Lake WA, US
Thomas D. Weir - Pullman WA, US
John D. Schwarzkopf - Pullman WA, US

Assignee:

Parker-Hannifin Corporation - Cleveland OH

International Classification:

H05K 7/20

US Classification:

165 804, 16510426, 165907, 361699, 361700, 361 25, 361 26

Abstract:

A combination spray and cold plate thermal management system for effectively thermally managing a heat producing device during startup. The combination spray and cold plate thermal management system includes a spray unit thermally managing a heat producing device and a coolant reservoir thermally connected to the heat producing device. The coolant reservoir includes a porous media with coolant channels for storing a volume of the waste coolant after spraying of coolant has terminated. The coolant reservoir is fluidly connected to the spray chamber within the spray unit to receive the waste coolant.

US Patent:

20050183844, Aug 25, 2005

Filed:

Feb 24, 2004

Appl. No.:

10/786452

Inventors:

Charles Tilton - Colton WA, US
Donald Tilton - Colton WA, US
Thomas Weir - Pullman WA, US
Tahir Cader - Liberty Lake WA, US
Paul Knight - Spokane WA, US

Assignee:

Isothermal Systems Research - Liberty Lake WA

International Classification:

F28F007/00

US Classification:

165080400

Abstract:

The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the chip that generate large heat fluxes, typically referred to as the core, the liquid coolant is dispensed as a continuous atomized droplet pattern. The atomized pattern creates a high heat flux evaporative cooling thin-film over the one or more core areas. Rather than optimize the atomized pattern and flow based upon complete thin-film vaporization, the present invention optimizes the atomized pattern for maximum heat removal rates. Any excess, non-vaporized, fluid flowing outward from the hotspot is used to cool the lower heat flux (non-core) areas of the component through the creation of a thick coolant film thereon.

US Patent:

20170073593, Mar 16, 2017

Filed:

Sep 12, 2016

Appl. No.:

15/262910

Inventors:

- Spokane WA, US
Thomas D. Weir - Pullman WA, US
Jacob M. Culley - Spokane WA, US
Sarah E. Love - Spokane WA, US
Daniel A. Howard - Cheney WA, US

International Classification:

C10J 3/72
C01B 3/02

Abstract:

A gasifier system for reducing the particle size of non-gas byproducts of the gasification process. The gasifier system generally includes a grinder that permits uninterrupted syngas flow during gasification of biomass that contains high amounts of silica and/or salts. The described system and method incorporates a grinder that breaks apart the resultant non-gas byproducts into finer particles that may be flushed out of a gasifier using the syngas stream. The particles may then be easily separated from the gas stream in a separator and collected in a char or waste bin for removal/disposal.

US Patent:

20160068770, Mar 10, 2016

Filed:

Sep 4, 2015

Appl. No.:

14/846146

Inventors:

- SPOKANE WA, US
THOMAS D. WEIR - PULLMAN WA, US
DANIEL A. HOWARD - CHENEY WA, US

International Classification:

C10J 3/50
B65G 65/02
C10J 3/72
C10J 3/48
C10J 3/46

Abstract:

Apparatuses, systems, staging hoppers, and methods for controlling continuous feed of feedstock into a gasifier are described. An example method staging feedstock in a staging hopper of a gasification system, and activating a stirrer to provide the feedstock to from the staging hopper to a gasifier of the gasification system. The gasifier is configured to gasify the feedstock to produce syngas.