An optical transceiver for including an electrical connector with a serial interface for coupling with an external electrical cable or information system device, a fiber optic connector adapted for coupling with an external optical fiber, and an electro-optical subassembly for converting between an information containing electrical signal and a modulated optical signal corresponding to the electrical signal including a transmitter subassembly including at least first and second lasers operating at different wavelengths and modulated with respective first and second electrical signals for emitting first and second laser light beams, and an optical multiplexer for receiving the first and second beams and multiplexing the respective optical signals into a single multi-wavelength beam.
John Dallesasse - Geneva IL, US Joseph Scheibenreif - Oswego IL, US Bryan Noble - Oswego IL, US Thomas Whitehead - Chicago IL, US Paul Wachtel - Arlington Heights IL, US Bogdan Andrei - Lisle IL, US Dean Richardson - Wilmette IL, US Brett Lane - West Mont IL, US Anthony Moretti - Saint Charles IL, US David McCallum - West Chicago IL, US
Assignee:
Emcore Corporation - Albuquerque NM
International Classification:
H04B 10/24
US Classification:
398135
Abstract:
An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802. 3ae 10 Gigabit BASE LX4 physical layer.
Thomas Whitehead - Chicago IL, US Matthew Block - Maple Park IL, US John Mszal - Bolingbrook IL, US John Dallesasse - Geneva IL, US Dean Richardson - Wilmette IL, US Anthony Moretti - Saint Charles IL, US
Assignee:
Emcore Corporation - Albuquerque NM
International Classification:
H04B 10/00
US Classification:
398138, 398164
Abstract:
A hermetically sealed optical transmitter module for use in an optical transceiver converting and coupling an information-containing electrical signal with an optical fiber. A plurality of semiconductor lasers are provided on a common support in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal according to a standardized optical communications protocol, such as the IEEE 802. 3ae 10 Gigabit BASE LX4 physical layer.
John Dallesasse - Geneva IL, US Joseph Scheibenreif - Oswego IL, US Bryan Noble - Oswego IL, US Thomas Whitehead - Chicago IL, US Paul Wachtel - Arlington Heights IL, US Bogdan Andrei - Lisle IL, US Dean Richardson - Wilmette IL, US Brett Lane - Westmont IL, US Anthony Moretti - Saint Charles IL, US David McCallum - West Chicago IL, US
Assignee:
Emcore Corporation - Albuquerque NM
International Classification:
H04B 10/24 H04J 14/02
US Classification:
398135, 398139
Abstract:
An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802. 3ae 10 Gigabit BASE LX4 physical layer.
Xfi-Xaui Integrated Circuit For Use With 10Gbase-Lx4 Optical Transceivers
A single chip integrated circuit for use in an optical transceiver for converting and coupling an information containing electrical signal with an optical fiber having an XFI interface for coupling with an external electrical cable or information system device, and an XAUI interface for coupling with a laser transmitter subassembly including first, second, third and fourth lasers operating at different wavelengths and modulated by the respective four lane XAUI signals. The circuit includes an encoder for encoding the incoming XFI signal into four signals in the XAIU format, and a decoder coupled to the XAUI interface for receiving a four lane XAUI signal and converting it into a serial XFI signal coupled to the XFI interface.
Simple Fiducial Marking For Quality Verification Of High Density Circuit Board Connectors
A printed circuit board with a printed pattern of fiducial marks on a first side of the printed circuit board including a first indicia including a right triangle with its base parallel to a first edge of the board and an alignment mark adjacent thereto, and a second indicia including a right triangle with its base parallel to a second edge of the board opposite said first edge, and an alignment mark adjacent thereto.
Simple Fiducial Marking For Quality Verification Of High Density Circuit Board Connectors
A printed circuit board with a printed pattern of fiducial marks on a first side of the printed circuit board including a first indicia including a right triangle with its base parallel to a first edge of the board and an alignment mark adjacent thereto, and a second indicia including a right triangle with its base parallel to a second edge of the board opposite said first edge, and an alignment mark adjacent thereto.
Isbn (Books And Publications)
Five Years After: A Review of Health Care Research Management after Rothschild Including an Essay by Thomas P. Whitehead
Allstate
Senior Data Scientist
Coriant, Inc. Jan 2014 - Jan 2017
Staff Engineer
Emcore Corporation Jun 2000 - Sep 2006
Rf Design Engineer
Education:
Northwestern University 2006 - 2013
Doctorates, Doctor of Philosophy, Electrical Engineering
Washington University In St. Louis 1996 - 2000
Bachelors, Bachelor of Science In Electrical Engineering, Electrical Engineering
Skills:
Matlab Fiber Optics Electrical Engineering Nonlinear Optics Pcb Design Data Analysis Fourier Analysis Latex Semiconductors Dxdesigner Labview Electronics Circuit Design Characterization Testing Optics Research Python R Domino Data Modeling Data Science Pyspark Agile Machine Learning Mathematical Modeling C Microsoft Office
In Nintendo Life-related news, editor James Newton left us to join Nintendo of Europe, and was replaced by the tag-team of editorial director Damien McFerran and staff writer Thomas Whitehead, who would shortly become overall editor.