Thomas M Wieder

US Patent:

8030263, Oct 4, 2011

Filed:

Jun 20, 2005

Appl. No.:

11/155654

Inventors:

Matthew I. Egbe - West Norriton PA, US
Michael Walter Legenza - Bellingham MA, US
Thomas Michael Wieder - Emmaus PA, US
Jennifer May Rieker - Whitehall PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 7/50

US Classification:

510175, 510176, 134 13

Abstract:

A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium fluoride than no additional fluoride containing compound is added to the composition; optionally a quaternary ammonium compound; and optionally a corrosion inhibitor is disclosed herein that is capable of removing residues from an article such as photoresist and/or etching residue. Also disclosed herein is a method for removing residues from an article using the composition disclosed herein.

US Patent:

8518865, Aug 27, 2013

Filed:

Aug 19, 2010

Appl. No.:

12/859624

Inventors:

Madhukar Bhaskara Rao - Fogelsville PA, US
Gautam Banerjee - Chandler AZ, US
Thomas Michael Wieder - Emmaus PA, US
Yi-Chia Lee - Danshuei Jen Taipei, TW
Wen Dar Liu - Chupei, TW
Aiping Wu - Macungie PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 7/50
C11D 11/00

US Classification:

510175, 510176

Abstract:

The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.

US Patent:

20040234904, Nov 25, 2004

Filed:

May 23, 2003

Appl. No.:

10/443867

Inventors:

Jennifer Rieker - Bethlehem PA, US
Thomas Wieder - Emmaus PA, US
Dana Durham - Pittstown NJ, US

International Classification:

B08B003/14
B08B007/00

US Classification:

430/329000, 134/042000

Abstract:

Compositions containing certain amines and/or quaternary ammonium compounds, hydroxylamine, corrosion inhibitor, organic diluent and optionally water are capable of removing photoresist, photoresist byproducts and residue and etching residues from a substrate.

US Patent:

20070179072, Aug 2, 2007

Filed:

Jan 30, 2006

Appl. No.:

11/342414

Inventors:

Madhukar Rao - Fogelsville PA, US
Thomas Wieder - Emmaus PA, US
John Marsella - Allentown PA, US
Mark Listemann - Kutztown PA, US

International Classification:

C23G 1/00
C11D 7/32

US Classification:

510175000, 134002000

Abstract:

The present invention relates to an aqueous cleaning composition used to remove unwanted organic and inorganic residues and contaminants from semiconductor substrates. The cleaning composition comprises a urea derivative such as, for example, dimethyl urea, as the component that is principally responsible for removing organic residues from the substrate. A fluoride ion source is also included in the cleaning compositions of the present invention and is principally responsible for removing inorganic residues from the substrate. The cleaning compositions of the present invention have a low toxicity and are environmentally acceptable.

US Patent:

20110311921, Dec 22, 2011

Filed:

Aug 25, 2011

Appl. No.:

13/217994

Inventors:

Matthew I. Egbe - West Norriton PA, US
Michael Walter Legenza - Bellingham MA, US
Thomas Michael Wieder - Emmaus PA, US
Jennifer May Rieker - Whitehall PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

G03F 7/20
C11D 7/60

US Classification:

430323, 510175

Abstract:

A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium fluoride than no additional fluoride containing compound is added to the composition; optionally a quaternary ammonium compound; and optionally a corrosion inhibitor is disclosed herein that is capable of removing residues from an article such as photoresist and/or etching residue. Also disclosed herein is a method for removing residues from an article using the composition disclosed herein.

US Patent:

20130296215, Nov 7, 2013

Filed:

Jul 8, 2013

Appl. No.:

13/936656

Inventors:

Gautam BANERJEE - Latham NY, US
Thomas Michael Wieder - Emmaus PA, US
Yi-Chia LEE - Danshuei Jen Taipei, TW
Wen Dar LIU - Chupei City, TW
Aiping WU - Macungie PA, US

International Classification:

G03F 7/42

US Classification:

510176, 510175

Abstract:

The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line interconnect structures, as well as contaminations. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or the combination of the two; and at least 50% by weight of water.