Timothy C Boyle

age ~72

from Redwood City, CA

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Also known as:

Timothy Christopher Boyle
Tim C Boyle
William C Deschler
William R Deschler
Willia R Deschler
Robert W Deschler

Phone and address:: 110 Finger Ave, Redwood City, CA 94062

Connected to:

Timothy Boyle Phones & Addresses

110 Finger Ave, Redwood City, CA 94062
10960 Jay St, Westminster, CO 80020 • (720)2009498
8306 Lehigh Ave, Denver, CO 80237 • (720)2009498
2501 Grove St, Denver, CO 80211
Belmont, CA
San Carlos, CA
Dallas, TX
Berkeley, CA
Menlo Park, CA

Lawyers & Attorneys

Timothy Boyle - Lawyer

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Office:

Peter J. Ludwig

Specialties:

General Practice

ISLN:

900796461

Admitted:

1992

University:

University of Wisconsin-Madison, B.A., 1989

Law School:

Hamline University, J.D., 1992

Timothy Boyle - Lawyer

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ISLN:

923254574

Admitted:

2007

Law School:

University of Miami School of Law, JD - Juris Doctor

License Records

Timothy J Boyle

License #:

150 - Expired

Category:

Emergency Medical Care

Issued Date:

Dec 31, 1997

Effective Date:

Feb 6, 2004

Expiration Date:

Dec 31, 2003

Type:

First Responder

Timothy J Boyle

License #:

6945 - Expired

Category:

Water Operator

Issued Date:

Sep 13, 2004

Effective Date:

Sep 13, 2004

Type:

Grade V Water Operator

Timothy J Boyle

License #:

985 - Expired

Category:

Nursing Home Administration

Issued Date:

May 1, 1976

Effective Date:

Dec 3, 2012

Expiration Date:

Dec 31, 2012

Type:

Nursing Home Administrator

Name / Title

Company / Classification

Phones & Addresses

Timothy P. Boyle
Director

Widmer Brothers Brewing Company

Timothy Boyle
Managing

Homegrown Habitats, LLC

Timothy R. Boyle

thebodyworks
Massage Therapy · Reflexology · Aromatherapy

2179 46 Ave, San Francisco, CA 94116
(415)7106241

Timothy P. Boyle
President

MOUNTAIN HARDWEAR, INC
Men's & Boy's Clothing Merchant Whols

14375 NW Science Park Dr, Portland, OR 97229
4911 Central Ave, Richmond, CA 94804
(510)5583000, (510)5596709

Timothy E. Boyle
President

COGENERATION CAPITAL CORPORATION

44 Montgomery St, San Francisco, CA 94104

Us Patents

Testing Circuits On Substrates
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US Patent:

6771060, Aug 3, 2004
Filed:

Oct 22, 2001
Appl. No.:

10/035482
Inventors:

Timothy J. Boyle - Cupertino CA
Wayne E. Richter - San Jose CA
Ladd T. Johnson - Scotts Valley CA
Lawrence A. Tom - Sunnyvale CA
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R 3126
US Classification:

3241581, 324754
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Testing Circuits On Substrate
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US Patent:

6781394, Aug 24, 2004
Filed:

Oct 22, 2001
Appl. No.:

10/035457
Inventors:

Timothy J. Boyle - Cupertino CA
Wayne E. Richter - San Jose CA
Ladd T. Johnson - Scotts Valley CA
Lawrence A. Tom - Sunnyvale CA
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R 3102
US Classification:

324758, 3241581
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Testing Circuits On Substrates
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US Patent:

6861859, Mar 1, 2005
Filed:

Oct 22, 2001
Appl. No.:

10/035508
Inventors:

Timothy J. Boyle - Cupertino CA, US
Wayne E. Richter - San Jose CA, US
Ladd T. Johnson - Scotts Valley CA, US
Lawrence A. Tom - Sunnyvale CA, US
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R031/02
G01R031/26
US Classification:

324760, 324765
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contracts, and the substrate is removed from the test chuck.

Testing Circuits On Substrates
view source
US Patent:

7002337, Feb 21, 2006
Filed:

Jul 27, 2004
Appl. No.:

10/900899
Inventors:

Timothy J. Boyle - Cupertino CA, US
Wayne E. Richter - San Jose CA, US
Ladd T. Johnson - Scotts Valley CA, US
Lawrence A. Tom - Sunnyvale CA, US
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R 31/26
US Classification:

3241581, 324754
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Testing Circuits On Substrates
view source
US Patent:

7098649, Aug 29, 2006
Filed:

Jun 17, 2004
Appl. No.:

10/871630
Inventors:

Timothy J. Boyle - Cupertino CA, US
Wayne E. Richter - San Jose CA, US
Ladd T. Johnson - Scotts Valley CA, US
Lawrence A. Tom - Sunnyvale CA, US
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R 31/02
G01R 31/28
US Classification:

3241581, 324765
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Testing Circuits On Substrates
view source
US Patent:

7180284, Feb 20, 2007
Filed:

Oct 4, 2005
Appl. No.:

11/244334
Inventors:

Timothy J. Boyle - Cupertino CA, US
Wayne E. Richter - San Jose CA, US
Ladd T. Johnson - Scotts Valley CA, US
Lawrence A. Tom - Sunnyvale CA, US
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R 31/26
G01R 31/02
US Classification:

3241581, 324754, 324765
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Testing Circuits On Substrate
view source
US Patent:

7259548, Aug 21, 2007
Filed:

Jan 7, 2005
Appl. No.:

11/033349
Inventors:

Timothy J. Boyle - Cupertino CA, US
Wayne E. Richter - San Jose CA, US
Ladd T. Johnson - Scotts Valley CA, US
Lawrence A. Tom - Sunnyvale CA, US
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R 31/02
G01R 31/28
US Classification:

3241581, 324765
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Testing Circuits On Substrate
view source
US Patent:

7453260, Nov 18, 2008
Filed:

Jul 24, 2006
Appl. No.:

11/492509
Inventors:

Timothy J. Boyle - Cupertino CA, US
Wayne E. Richter - San Jose CA, US
Ladd T. Johnson - Scotts Valley CA, US
Lawrence A. Tom - Sunnyvale CA, US
Assignee:

Electroglas, Inc. - San Jose CA
International Classification:

G01R 31/02
G01R 31/28
US Classification:

3241581, 324765
Abstract:

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.

Resumes

Oracle Applications Consultant And Project Manager

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Location:

San Francisco Bay Area

Industry:

Computer Software

Timothy Boyle Fresno, CA

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Work:

Pride Transport

Mar 2009 to 2000 Pride Transport
Tracy, CA
May 2011 to Apr 2012
Local driver Royal Express
Phoenix, AZ
Jul 2008 to Mar 2009 Cornerstone Staffing Solutions
Livermore, CA
Jan 2008 to Apr 2008

Medicine Doctors

Timothy R. Boyle

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Specialties:

Otolaryngology, Plastic Surgery within the Head & Neck

Work:

Marshfield ClinicMarshfield Clinic Marshfield Center
1000 N Oak Ave, Marshfield, WI 54449
(715)3875511 (phone), (715)3875754 (fax)

Marshfield ClinicMarshfield Clinic Wisconsin Rapids Center
220 24 St S, Wisconsin Rapids, WI 54494
(715)4248600 (phone), (715)4248346 (fax)

Education:

Medical School
University of Iowa Carver College of Medicine
Graduated: 1989

Procedures:

Rhinoplasty
Sinus Surgery
Tonsillectomy or Adenoidectomy
Tracheostomy

Conditions:

Acute Upper Respiratory Tract Infections
Allergic Rhinitis
Chronic Sinusitis
Deviated Nasal Septum
Hearing Loss

Languages:

English

Description:

Dr. Boyle graduated from the University of Iowa Carver College of Medicine in 1989. He works in Wisconsin Rapids, WI and 1 other location and specializes in Otolaryngology and Plastic Surgery within the Head & Neck. Dr. Boyle is affiliated with Ministry Saint Michaels Hospital and Ministry St Josephs Hospital.