Timothy W Conrad

US Patent:

20110174525, Jul 21, 2011

Filed:

Jan 20, 2010

Appl. No.:

12/690297

Inventors:

Timothy R. Conrad - Kokomo IN, US
Theresa Ann Updike Thompson - Kokomo IN, US
Terry L. Warner - Sharpsville IN, US
Daniel E. Kettles - Russiaville IN, US
Phuc B. Dao - Westfield IN, US

Assignee:

DELPHI TECHNOLOGIES, INC. - Troy MI

International Classification:

H05K 1/18
B23K 31/02
H05K 1/09

US Classification:

174257, 228256, 174260

Abstract:

A method and an electronic assembly for attaching a component to a substrate, or printed circuit board, is recited. The printed circuit board comprises a solder-nonwettable surface and a bond pad being formed of a solder-wettable surface. The printed circuit board defines a through hole extending through the printed circuit board and the bond pad. A plate lining a first portion of the through hole in the printed circuit board is formed of a solder-wettable material. Solder paste is applied to the bond pad and into the through hole. A component including a terminal overlies the bond pad in an arrangement. Reflowing the solder paste forms a solder fillet that bonds the terminal to the bond pad. The solder fillet extends within the through hole attaching the component to the printed circuit board.