Timothy K O'Neil from New Milford, CT, age 67

Name / Title

Company / Classification

Phones & Addresses

Timothy O'neil
Owner

GREEN-THUMB LAWNS
Landscaper

1113 Roxbury Rd, Southbury, CT 06488
(203)2643535, (203)2640384

Timothy O'neil
Principal

Timothy M & Tricia S O'Neil
Business Services at Non-Commercial Site

54 Tryon Ave, East Providence, RI 02916

Timothy J O'neil
Partner

THE O'NEIL FAMILY LIMITED PARTNERSHIP

Lawyers & Attorneys

Timothy O'Neil - Lawyer

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Office:

Timothy K. O'Neil, Esq.

Specialties:

Real Estate Law

ISLN:

901682572

Admitted:

1990

University:

Miami University, B.S., 1985

Law School:

Northwestern University, J.D., 1990

Timothy O'Neil - Lawyer

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Office:

Foote, Mielke, Chavez and O'Neil, LLC

Specialties:

Wrongful Death
Workers' Injury and Compensation
Automobile Accidents
Business Torts

ISLN:

901384773

Admitted:

1985

University:

St. Norbert College, B.A., 1978

Law School:

Northern Illinois University, J.D., 1985

Resumes

Telecommunications Specialist

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Industry:

Defense & Space

Work:

Disa
Telecommunications Specialist

Timothy O'neil

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Skills:

Business Development

Timothy O'neil

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Timothy O'neil

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Timothy O'neil

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Us Patents

Bonding Silicon Silicon Carbide To Glass Ceramics
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US Patent:

7678458, Mar 16, 2010
Filed:

Jan 24, 2007
Appl. No.:

11/626747
Inventors:

Matthew Lipson - Stamford CT, US
Robert D. Harned - Redding CT, US
Geoffrey O'Connor - Easton CT, US
Timothy O'Neil - New Milford CT, US
Assignee:

ASML Holding N.V. - Veldhoven
International Classification:

G21K 5/00
B32B 3/20
B32B 17/06
B32B 15/00
B32B 13/04
B32B 9/04
B32B 9/00
US Classification:

428428, 378 34, 378208, 428188, 428432, 428446, 428453, 428698
Abstract:

A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Bonding Silicon Silicon Carbide To Glass Ceramics
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US Patent:

8168017, May 1, 2012
Filed:

Feb 4, 2010
Appl. No.:

12/700049
Inventors:

Matthew Lipson - Stamford CT, US
Robert D. Harned - Redding CT, US
Geoffrey O'Connor - Easton CT, US
Timothy O'Neil - New Milford CT, US
Assignee:

ASML Holding N.V. - Veldhoven
International Classification:

B29C 65/00
B05D 1/36
C03B 29/00
C09J 5/00
US Classification:

156 60, 4272071, 156 8911, 156297, 156305
Abstract:

A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.