Timothy Lee Sharp

US Patent:

57315477, Mar 24, 1998

Filed:

Feb 20, 1996

Appl. No.:

8/603629

Inventors:

Mark Daniel Derwin - Binghamton NY
Daniel Peter Labzentis - Endicott NY
Jonathan David Reid - Johnson City NY
Timothy Lee Sharp - Berkshire NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 109

US Classification:

174251

Abstract:

A circuitized substrate having conductive circuitry thereon and a barrier located adjacent at least portions of the circuitry to serve as an effective constraint for liquid material (e. g. , encapsulant) applied to cover and protect the circuitry. The barrier can be formed concurrently with circuitry formation and formed of materials (e. g. , copper, nickel, gold) similar to those used for the circuitry. The barrier is of two-part construction and of a particular shape wherein one part affords a greater surface tension than the other such that the material may actually lie on one part while being prevented from engagement with the other. Providing such dual (or "progressive") surface tensions successfully constrains the liquid material at least until solidification thereof occurs.

US Patent:

59320478, Aug 3, 1999

Filed:

May 22, 1995

Appl. No.:

8/446357

Inventors:

William Louis Brodsky - Binghamton NY
James Daniel Herard - Vestal NY
Thomas George Macek - Endicott NY
Timothy Lee Sharp - Berkshire NY
George Joseph Shovlowsky - Owego NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 330

US Classification:

156150

Abstract:

A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e. g. , copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e. g. , when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

US Patent:

54689171, Nov 21, 1995

Filed:

Feb 23, 1994

Appl. No.:

8/217141

Inventors:

William L. Brodsky - Binghamton NY
James D. Herard - Vestal NY
Thomas G. Macek - Endicott NY
Timothy L. Sharp - Berkshire NY
George J. Shovlowsky - Owego NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 114

US Classification:

174255

Abstract:

A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e. g. , copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e. g. , when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

US Patent:

57033315, Dec 30, 1997

Filed:

Jul 11, 1995

Appl. No.:

8/500716

Inventors:

William Louis Brodsky - Binghamton NY
James Daniel Herard - Vestal NY
Thomas George Macek - Endicott NY
Timothy Lee Sharp - Berkshire NY
George Joseph Shovlowsky - Owego NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 114

US Classification:

174254

Abstract:

A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e. g. , copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e. g. , when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.