Timothy Patrick Webb

US Patent:

6770565, Aug 3, 2004

Filed:

Jan 8, 2002

Appl. No.:

10/043561

Inventors:

Donald J. K. Olgado - Palo Alto CA
Avi Tepman - Cupertino CA
Dmitry Lubomirsky - Cupertino CA
Timothy R. Webb - San Mateo CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

H01L 2302

US Classification:

438706, 438745

Abstract:

A method of planarizing a metal conductive layer on a substrate is provided. In one embodiment, a substrate having a metal conductive layer disposed on a top surface of the substrate is provided on a substrate support. The substrate support is rotated and the top surface of the substrate is contacted with a liquid etching composition. The metal conductive layer is then exposed to an etchant gas in order to planarize the top surface of the metal conductive layer. Also provided is an apparatus for etching a metal conductive layer on a substrate. The apparatus comprises a container, a substrate support disposed in the container, a rotation actuator attached to the substrate support, and a fluid delivery assembly disposed in the container.

US Patent:

7025862, Apr 11, 2006

Filed:

Oct 22, 2002

Appl. No.:

10/278527

Inventors:

Harald Herchen - Los Altos CA, US
Henan Hao - Fremont CA, US
Celina M. Esteban - Redwood City CA, US
Timothy R. Webb - San Mateo CA, US
Son N. Trinh - Cupertino CA, US

Assignee:

Applied Materials - Santa Clara CA

International Classification:

C25B 9/00

US Classification:

20429706, 20429708, 20429709, 2042971, 204199, 204213, 204224 R, 29825, 29874, 29729, 29745

Abstract:

An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.

US Patent:

20040069651, Apr 15, 2004

Filed:

Oct 15, 2002

Appl. No.:

10/273044

Inventors:

Harald Herchen - Los Altos CA, US
Henan Hao - Fremont CA, US
Timothy Webb - San Mateo CA, US
Quyen Pham - Sunnyvale CA, US
Son Trinh - Cupertino CA, US
Deenesh Padhi - Santa Clara CA, US

Assignee:

Applied Materials, Inc.

International Classification:

C25D005/34

US Classification:

205/205000, 204/242000

Abstract:

Method and apparatus for electrodepositing a metal onto a substrate. An oxide treatment process is performed on a substrate prior to making electrical contact between a seed layer of the substrate and a conductive contact element which provides a current. In one embodiment, the pressure at the interface between the seed layer and the conductive contact element is controlled to avoid detrimentally affecting a material(s) of the substrate.

US Patent:

20060175201, Aug 10, 2006

Filed:

Feb 7, 2005

Appl. No.:

11/052443

Inventors:

Hooman Hafezi - Redwood City CA, US
Joseph Behnke - Sunnyvale CA, US
Aron Rosenfeld - Palo Alto CA, US
Timothy Webb - San Mateo CA, US
Joseph Yahalom - Haifa, IL
Christopher McGuirk - San Jose CA, US

International Classification:

C25D 5/18

US Classification:

205102000

Abstract:

A method for immersing a substrate into a plating solution. In one embodiment, the method includes applying a first waveform to the substrate as the substrate is being immersed into the plating solution, stopping the application of the first waveform to the substrate as soon as the substrate is fully immersed inside the plating solution, and applying a second waveform to the substrate prior to the substrate being situated into a plating position.

US Patent:

20130238111, Sep 12, 2013

Filed:

Mar 12, 2013

Appl. No.:

13/797944

Inventors:

Simon R. LANCASTER-LAROCQUE - Gloucester, CA
Erik D. SUOMI - Palo Alto CA, US
Timothy Richard WEBB - Portland OR, US
Kyung Y. KIM - Portland OR, US
Cameron W. SCHNUR - Portland OR, US
Bruce W. BALL - Ann Arbor MI, US
Carl CAI - Beaverton OR, US

Assignee:

APPLE INC. - Cupertino CA

International Classification:

G05B 19/418

US Classification:

700110

Abstract:

A method, system, and apparatus for intelligent application of a finishing process a surface of a housing is described. In one embodiment, at least a portion of the surface of the housing is imaged. In one embodiment, the image can be rendered using an optical imager such as a standard or high definition camera. In one embodiment, multiple cameras can be used to assist in defining location, size, and depth of surface defects. In one embodiment, an optical imaging device can be used to image surface defects under wet conditions where the surface of the housing is covered with a layer of slurry.

US Patent:

60907177, Jul 18, 2000

Filed:

Mar 26, 1996

Appl. No.:

8/622657

Inventors:

Stephen F. Powell - Woodside CA
Jeffrey V. Musser - Boise ID
Robert Guerra - Fremont CA
Timothy R. Webb - San Francisco CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H01L 21302

US Classification:

438710

Abstract:

A method in a plasma processing chamber for etching through a selected portion of a metallization layer of a wafer's layer stack. The method includes the step of etching at least partially through the metallization layer of the layer stack with an etchant source gas that consists essentially of chlorine and nitrogen. In another embodiment, the metallization layer comprises aluminum, and the flow ratio of the chlorine to the nitrogen ranges from about 1:1 to about 10:1. More preferably, the flow ratio of the chlorine to the nitrogen ranges from about 1:1 to about 4:1 and preferably ranges from about 1:1 to about 2:1.