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Tin-Lup Wong

from Chapel Hill, NC

Tin-Lup Wong Phones & Addresses

  • 207 Tremont Cir, Chapel Hill, NC 27516 • (919)9682551

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Tin-Lup Wong

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Us Patents

  • Electrical Grounding Schemes For Socketed Processor And Heatsink Assembly

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  • US Patent:
    6377474, Apr 23, 2002
  • Filed:
    Jan 13, 2000
  • Appl. No.:
    09/483796
  • Inventors:
    Bruce Roy Archambeault - Durham NC
    Joseph Curtis Diepenbrock - Raleigh NC
    Leonard Douglas Hobgood - Durham NC
    Joseph Anthony Holung - Wake Forest NC
    Tin-Lup Wong - Chapel Hill NC
  • Assignee:
    International Business Corporation - Armonk NY
  • International Classification:
    H05K 900
  • US Classification:
    361818, 361719, 439108, 439487, 439947
  • Abstract:
    A computer processor socket has a base with grounding and signal holes. Each hole contains a pin for electrical interconnection with a circuit board. The socket also contains a grounding device around its perimeter. The grounding device has a continuous ring of wiping members on its upper end. When a processor is mounted to the top of the socket, the wiping members extend slightly above the processor. The heatsink mounted on top of the processor engages the wiping members which are spring-biased against its lower surface. Since the wiping members extend completely around the perimeter of the socket, a continuous electrical ground interface is formed between the heatsink and the socket. The lower ends of the grounding device are electrically interconnected with the socket grounding pins which are grounded to the board.
  • Adaptable Heat Dissipation Device For A Personal Computer

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  • US Patent:
    6445580, Sep 3, 2002
  • Filed:
    Jun 9, 2000
  • Appl. No.:
    09/591011
  • Inventors:
    Mark E. Cohen - Cary NC
    Joseph Anthony Ho-lung - Wake Forest NC
    Vinod Kamath - Raleigh NC
    Tin-Lup Wong - Chapel Hill NC
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G06F 120
  • US Classification:
    361687, 361704, 622592
  • Abstract:
    A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.
  • Adaptable Heat Dissipation Device For A Personal Computer

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  • US Patent:
    6856921, Feb 15, 2005
  • Filed:
    Dec 10, 2003
  • Appl. No.:
    10/732157
  • Inventors:
    Mark E. Cohen - Cary NC, US
    Joseph Anthony Ho-Lung - Wake Forest NC, US
    Vinod Kamath - Raleigh NC, US
    Tin-Lup Wong - Chapel Hill NC, US
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G01R002/00
    G06F019/00
    G06F001/20
  • US Classification:
    702 60, 361687, 361700, 700295, 702132
  • Abstract:
    A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.
  • Personal Computer With A Biometric Sensor Having Improved Resistance To Environmental Distortions

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  • US Patent:
    6871242, Mar 22, 2005
  • Filed:
    Mar 31, 1999
  • Appl. No.:
    09/282862
  • Inventors:
    Joseph Anthony Ho-Lung - Wake Forest NC, US
    James Gordon McLean - Fuquay-Varina NC, US
    Tin-Lup Wong - Chapel Hill NC, US
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G06F013/00
    G06F003/06
    G06F003/18
  • US Classification:
    710 16, 710 36, 710 73, 345157, 382125, 713180
  • Abstract:
    The present invention is a personal computer system and method including a biometric sensor which is protected from environmental forces and which resists certain attacks by sensing whether a living person is providing the biometric identification. A second sensor provides an input as to whether the biometric input is from a living person, through the sensing of a life-indicative parameter such as an appropriate level of blood oxygen in the sensed item, and the sensors are covered by a removal cover which provides electrostatic discharge when the cover is opened.
  • Method And System For Collaborative Speech Recognition For Small-Area Network

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  • US Patent:
    6885989, Apr 26, 2005
  • Filed:
    Apr 2, 2001
  • Appl. No.:
    09/824126
  • Inventors:
    James Gordon McLean - Fuquay-Varina NC, US
    Daniel James Winarski - Tucson AZ, US
    Tin-Lup Wong - Chapel Hill NC, US
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G10L015/26
  • US Classification:
    704235, 704270, 704277
  • Abstract:
    The present invention provides a method and system for collaborative speech recognition in a network. The method includes: capturing speech as at least one audio stream by at least one capturing device; producing a plurality of text streams from the at least one audio stream by at least one recognition device; and determining a best recognized text stream from the plurality of text streams. The present invention allows multiple computing devices connecting to a network, such as a Small Area Network (SAN), to collaborate on a speech recognition task. The devices are able to share or exchange audio data and determine the best quality audio. The devices are also able to share text results from the speech recognition task and the best result from the speech recognition task. This increases the efficiency of the speech recognition process and the quality of the final text stream.
  • Translation And Substitution Of Transmitted Environmental Data

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  • US Patent:
    7016933, Mar 21, 2006
  • Filed:
    Sep 20, 2001
  • Appl. No.:
    09/957617
  • Inventors:
    David Wayne Glass - Georgetown KY, US
    James Gordon McLean - Fuquay-Varina NC, US
    Clifford Alan Pickover - Yorktown Heights NY, US
    Daniel James Winarski - Tucson AZ, US
    Tin-Lup Wong - Chapel Hill NC, US
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G06F 15/16
  • US Classification:
    709200, 709202
  • Abstract:
    A method, system and computer program product for generating an alternative form of transmitted environmental data, e. g. , scent information, air temperature settings, air humidity settings, triggering of infrared devices such as to create tactile warmth. Upon identifying one or more environmental data files in a received file, e. g. , HTML file, environmental data associated with the data files may be read and interpreted. If there are no environmental devices, e. g. , smell-generating device, configured to emit a response to the environmental data or if the environmental devices are disabled from emitting a response to the environmental data, then the environmental data may be translated into a form a computer may be capable of reproducing. The translated form may then be outputted in a variety of forms such as: pictorial data (e. g. , picture of a pine tree substituting a pine smell), graphical effects (e. g.
  • Overstress Indication

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  • US Patent:
    7086291, Aug 8, 2006
  • Filed:
    Apr 29, 2004
  • Appl. No.:
    10/835030
  • Inventors:
    Joseph Anthony Holung - Wake Forest NC, US
    Noboru Kodama - Kanagawa-ken, JP
    Tin-Lup Wong - Chapel Hill NC, US
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    G01B 11/16
  • US Classification:
    73762
  • Abstract:
    Devices and their subassemblies typically undergo stresses during manufacturing and testing processes and during general use. To provide visual indication of stress or strain levels endured, a preferred embodiment includes frangible material deposited on particular isolated areas of devices and/or their subassemblies. The frangible material, when applied according to one methodical embodiment, provides visible indication of overstrain as cracks in the frangible material deposits, and of non overstrain when cracks are not visible.
  • Frame For Notebook Computer

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  • US Patent:
    7417852, Aug 26, 2008
  • Filed:
    Jul 19, 2005
  • Appl. No.:
    11/184628
  • Inventors:
    Tin-Lup Wong - Chapel Hill NC, US
    Seita Horikoshi - Zama, JP
    Tetsuya Ohtani - Yokohama, JP
    Hiroaki Agata - Yokohama, JP
    Noboru Kodama - Yokahama, JP
  • Assignee:
    Lenovo (Singapore) Pte. Ltd. - Singapore
  • International Classification:
    G06F 1/16
  • US Classification:
    361683
  • Abstract:
    A unitary magnesium frame for a notebook computer includes a planar card support that isolates the planar card from external stresses applied to a base cover assembly that is engaged with the frame. A keyboard bezel assembly can cover the frame opposite to the base cover assembly. Various component-supporting structures of the frame are disclosed.

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