Todd Robert Stegman - Cincinnati OH Matt Michael Leonard - Wheaton IL
Assignee:
Osborne Coinage Company - Cincinnati OH
International Classification:
B60Q 1100
US Classification:
340458, 340 80, 340642, 307 108
Abstract:
A monitor for a light circuit comprising a power source, a light being monitored, and a sense resistor. A first voltage amplifier circuit connected to the light circuit has a first output signal representing the voltage across the sense resistor. A second voltage amplifier circuit connected to the circuit has a second output signal representing the voltage across the sense resistor. A microprocessor is configured to receive the output signals from the first and second voltage measuring circuit and is programmed to calculate the current to the light based on the first and second digital output signals, compare the calculated current against a threshold current, and initiate a failure signal if the calculated current is less than the threshold current. A visual indicator activates if the microprocessor initiates a failure signal, whereby the activated indicator notifies that the light is not operating correctly. The calculated current is based on the first output signal if the light is a low current light, and the current is calculated is based on the second output signal if the light is a high current light.
Jeffrey Stegman - Cincinnati OH, US Todd Stegman - Cincinnati OH, US
International Classification:
G09F 3/02
US Classification:
040027500
Abstract:
An in-mold chip is provided that includes first and second labels, printed visible indicia, a protective coating and a thermoplastic polymer. The first and second labels are disposed adjacent each other about a common central axis, each label having a first surface and a second surface. The printed visible indicia is selectively applied to one or more portions of at least one of the first and second surfaces of the first and second labels. The protective coating is selectively applied to the surface of the first and second labels containing the printed visible indicia. The first and second labels are encased by the thermoplastic polymer during the in-mold process. A method for making an in-mold chip is also provided.