Tom Q Lin

US Patent:

20170145224, May 25, 2017

Filed:

Nov 23, 2016

Appl. No.:

15/360955

Inventors:

- Alameda CA, US
Erik Sauar - Oslo, NO
Dhea Suseno - Oakland CA, US
Jesse J. Hinricher - Pipestone MN, US
Jennifer Huang - Saratoga CA, US
Tom Yu-Tang Lin - Berkeley CA, US
Stephen T. Connor - San Francisco CA, US
Daniel J. Hellebusch - Oakland CA, US
Craig H. Peters - Belmont CA, US

International Classification:

C09D 5/24
C03C 8/18
C03C 8/16
H01L 31/0224

Abstract:

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

US Patent:

20170148933, May 25, 2017

Filed:

Nov 23, 2016

Appl. No.:

15/360944

Inventors:

- Alameda CA, US
Erik Sauar - Oslo, NO
Dhea Suseno - Oakland CA, US
Jesse J. Hinricher - Pipestone MN, US
Jennifer Huang - Saratoga CA, US
Tom Yu-Tang Lin - Berkeley CA, US
Stephen T. Connor - San Francisco CA, US
Daniel J. Hellebusch - Oakland CA, US
Craig H. Peters - Belmont CA, US

International Classification:

H01L 31/0224
B23K 35/02
H02S 40/34
B23K 35/36
B23K 35/28
H01L 31/02
B23K 1/00
B23K 35/30

Abstract:

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

US Patent:

20170148937, May 25, 2017

Filed:

Nov 23, 2016

Appl. No.:

15/360952

Inventors:

- Alameda CA, US
Erik Sauar - Oslo, NO
Dhea Suseno - Oakland CA, US
Jesse J. Hinricher - Pipestone MN, US
Jennifer Huang - Saratoga CA, US
Tom Yu-Tang Lin - Berkeley CA, US
Stephen T. Connor - San Francisco CA, US
Daniel J. Hellebusch - Oakland CA, US
Craig H. Peters - Belmont CA, US

International Classification:

H01L 31/0224
H01L 31/0203
H01L 31/049
H01L 31/02

Abstract:

Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

US Patent:

20170148944, May 25, 2017

Filed:

Nov 23, 2016

Appl. No.:

15/360959

Inventors:

- Alameda CA, US
Erik Sauar - Oslo, NO
Dhea Suseno - Oakland CA, US
Jesse J. Hinricher - Pipestone MN, US
Jennifer Huang - Saratoga CA, US
Tom Yu-Tang Lin - Berkeley CA, US
Stephen T. Connor - San Francisco CA, US
Daniel J. Hellebusch - Oakland CA, US
Craig H. Peters - Belmont CA, US

International Classification:

H01L 31/18
B05D 1/02
H01L 31/0224
B33Y 10/00

Abstract:

A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.