Cho Teh - Cupertino CA, US Tommaso Torelli - Berkeley CA, US Dominic David - Campbell CA, US Chiuman Yeung - Sunnyvale CA, US Michael Scott - Santa Cruz CA, US Lalita Balasubramanian - Fremont CA, US Lisheng Gao - Morgan Hill CA, US Tong Huang - San Jose CA, US Jianxin Zhang - Santa Clara CA, US Michal Kowalski - Santa Cruz CA, US Jonathan Oakley - Sunnyvale CA, US
International Classification:
G01N 21/00 H01J 3/14
US Classification:
356072000, 356237200, 25039600R
Abstract:
Various computer-implemented methods for classifying defects on a specimen are provided. One method includes assigning individual defects detected on the specimen to defect groups based on one or more characteristics of the individual defects. The method also includes displaying information about the defect groups to a user. In addition, the method includes allowing the user to assign a classification to each of the defect groups. Systems configured to classify defects on a specimen are also provided. One system includes program instructions executable on a processor for assigning individual defects detected on the specimen to defect groups based on one or more characteristics of the individual defects. The system also includes a user interface configured for displaying information about the defect groups to a user and allowing the user to assign a classification to each of the defect groups.
Selecting One Or More Parameters For Inspection Of A Wafer
Chris Lee - Fremont CA, US Lisheng Gao - Morgan Hill CA, US Tao Luo - Fremont CA, US Kenong Wu - Davis CA, US Tommaso Torelli - Berkeley CA, US Michael J. Van Riet - Sunnyvale CA, US Brian Duffy - San Jose CA, US
Assignee:
KLA-TENCOR CORPORATION - Milpitas CA
International Classification:
G06F 19/00 G01N 21/88
US Classification:
702 83
Abstract:
Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for inspection of a wafer are provided.
Automated Image-Based Process Monitoring And Control
- Milpitas CA, US Shabnam Ghadar - Milpitas CA, US Tommaso Torelli - Berkeley CA, US Bradley RIES - San Jose CA, US Mohan MAHADEVAN - Santa Clara CA, US Stilian Pandev - Santa Clara CA, US
International Classification:
G06T 7/00
Abstract:
Methods and devices are disclosed for automated detection of a status of wafer fabrication process based on images. The methods advantageously use segment masks to enhance the signal-to-noise ratio of the images. Metrics are then calculated for the segment mask variations in order to determine one or more combinations of segment masks and metrics that are predictive of a process non-compliance. A model can be generated as a result of the process. In another embodiment, a method uses a model to monitor a process for compliance.
Wafer And Lot Based Hierarchical Method Combining Customized Metrics With A Global Classification Methodology To Monitor Process Tool Condition At Extremely High Throughput
- Milpitas CA, US Tommaso Torelli - San Mateo CA, US Bradley Ries - San Jose CA, US Mohan Mahadevan - Livermore CA, US
Assignee:
KLA-Tencor Corporation - Milpitas CA
International Classification:
G05B 19/418 H01L 21/02
Abstract:
Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.