Tony Nghia Luong

US Patent:

6712670, Mar 30, 2004

Filed:

Dec 27, 2001

Appl. No.:

10/033671

Inventors:

Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
Andrew Siu - Union City CA
Tuan A. Nguyen - San Jose CA
Tony Luong - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 4900

US Classification:

451 11, 451 19, 451 24, 451307

Abstract:

An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

US Patent:

6761626, Jul 13, 2004

Filed:

Dec 20, 2001

Appl. No.:

10/037452

Inventors:

Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
David Wei - Fremont CA
Tony Luong - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 722

US Classification:

451303, 451307

Abstract:

An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

US Patent:

6896586, May 24, 2005

Filed:

Mar 29, 2002

Appl. No.:

10/112628

Inventors:

Xuyen Pham - Fremont CA, US
Tuan Nguyen - San Jose CA, US
Ren Zhou - Fremont CA, US
David Wei - Fremont CA, US
Linda Jiang - Milpitas CA, US
Joseph P. Simon - Newark CA, US
Tony Luong - San Jose CA, US
Sridharan Srivatsan - Sunnyvale CA, US
Anjun Jerry Jin - Milpitas CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B049/00

US Classification:

451 7, 451 8, 451 53

Abstract:

A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

US Patent:

6896600, May 24, 2005

Filed:

Mar 29, 2002

Appl. No.:

10/112421

Inventors:

Patrick P. H. Wu - Sunnyvale CA, US
Xuyen Pham - Fremont CA, US
Tony Luong - San Jose CA, US

Assignee:

LAM Research Corporation - Fremont CA

International Classification:

B24B057/00

US Classification:

451307, 451 60, 451446, 222420, 222568, 239550

Abstract:

A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a plurality of drip nozzles that are secured to the side of the liquid dispense manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A bend is defined within the drip nozzle passage such that droplets are directed downward toward a polishing surface. The nozzles are configured with respect to the manifold to provide an even flow rate of substantially uniform drops onto the polishing surface.

US Patent:

7018276, Mar 28, 2006

Filed:

Jun 25, 2004

Appl. No.:

10/876415

Inventors:

Anthony de la Llera - Union City CA, US
Xuyen Pham - Fremont CA, US
David Wei - Fremont CA, US
Tony Luong - San Jose CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 7/22
B24B 21/08

US Classification:

451303, 451307

Abstract:

An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

US Patent:

20040161939, Aug 19, 2004

Filed:

Feb 10, 2004

Appl. No.:

10/776477

Inventors:

Anthony Llera - Union City CA, US
Xuyen Pham - Fremont CA, US
Andrew Siu - Union City CA, US
Tuan Nguyen - San Jose CA, US
Tony Luong - San Jose CA, US

Assignee:

Lam Research Corporation

International Classification:

H01L021/302
H01L021/461

US Classification:

438/692000, 438/691000

Abstract:

An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

US Patent:

6666755, Dec 23, 2003

Filed:

Jun 26, 2002

Appl. No.:

10/184163

Inventors:

Travis R. Taylor - Fremont CA
Christian DiPietro - Sunnyvale CA
Stephen Jew - Santa Clara CA
Philip Ngoon - San Jose CA
Tony Luong - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

451 56, 451288, 451285, 451296, 451533

Abstract:

A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.