Tracy L Bell

US Patent:

6376280, Apr 23, 2002

Filed:

Oct 8, 1999

Appl. No.:

09/415284

Inventors:

Richard C. Ruby - Menlo Park CA
Tracy E. Bell - Campbell CA
Frank S. Geefay - Cupertino CA
Yogesh M. Desai - San Jose CA

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01L 2144

US Classification:

438118, 438110, 438455, 438612

Abstract:

A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.

US Patent:

6429511, Aug 6, 2002

Filed:

Oct 1, 2001

Appl. No.:

09/969432

Inventors:

Richard C. Ruby - Menlo Park CA
Tracy E. Bell - Campbell CA
Frank S. Geefay - Cupertino CA
Yogesh M. Desai - San Jose CA

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01L 2348

US Classification:

257704, 257685, 257686, 257723, 257777

Abstract:

A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.

US Patent:

6265246, Jul 24, 2001

Filed:

Jul 23, 1999

Appl. No.:

9/359844

Inventors:

Richard C. Ruby - Menlo Park CA
Tracy E. Bell - Campbell CA
Frank S. Geefay - Cupertino CA
Yogesh M. Desai - San Jose CA

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438113

Abstract:

A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist, semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.

US Patent:

62286757, May 8, 2001

Filed:

Jul 23, 1999

Appl. No.:

9/360859

Inventors:

Richard C. Ruby - Menlo Park CA
Tracy E. Bell - Campbell CA
Frank S. Geefay - Cupertino CA
Yogesh M. Desai - San Jose CA

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01L 2144

US Classification:

438106

Abstract:

A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer is processed to form wells of a predetermined depth in the cap wafer. A conductive material is made integral with the walls of the wells in the cap wafer. The cap wafer has contacts and a peripheral gasket formed thereon where the contacts are capable of being aligned with the bonding pads on the base wafer, and the gasket matches the peripheral pad on the base wafer. The cap wafer is then placed over the base wafer so as to bond the contact and gasket to the pads and form a hermetically sealed volume within the peripheral gasket. The cap wafer is thinned to form a "microcap". The microcap is thinned below the predetermined depth until the semiconductor dopant is exposed to become conductive vias through the cap wafer to outside the hermetically sealed volume.