Tracy F Reynolds

US Patent:

6357275, Mar 19, 2002

Filed:

Nov 21, 2000

Appl. No.:

09/721028

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Eagle ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B21D 2202

US Classification:

72414, 29827

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6454153, Sep 24, 2002

Filed:

Mar 2, 2001

Appl. No.:

09/797725

Inventors:

Michael Bettinger - Eagle ID
Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 3704

US Classification:

228 45, 228 151

Abstract:

The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip. The apparatus further comprises a pressing tool movably mounted relative to the substrate, and which has a deflecting surface configured to press the wires into a slit of the substrate when the pressing tool is moved toward the substrate.

US Patent:

6474532, Nov 5, 2002

Filed:

Mar 2, 2001

Appl. No.:

09/797790

Inventors:

Michael Bettinger - Eagle ID
Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B23K 106

US Classification:

2281101, 2281735

Abstract:

The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip. The apparatus further comprises a pressing tool movably mounted relative to the substrate, and which has a deflecting surface configured to press the wires into a slit of the substrate when the pressing tool is moved toward the substrate.

US Patent:

6504257, Jan 7, 2003

Filed:

Nov 21, 2000

Appl. No.:

09/718597

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Eagle ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 2940

US Classification:

257782, 257786, 257666

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6509205, Jan 21, 2003

Filed:

Apr 3, 2001

Appl. No.:

09/825656

Inventors:

Ronald W. Ellis - Boise ID
Tracy Reynolds - Boise ID
Michael Bettinger - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 2144

US Classification:

438106, 438611

Abstract:

The present invention is directed toward an apparatus and method for providing mechanically pre-formed conductive leads. In one embodiment of the invention, an apparatus includes a forming chuck engageable with a first surface of a conductive sheet, and a receiving chuck engageable with a second surface of the conductive sheet opposite from the forming chuck. The forming chuck has a raised forming portion alignable with one or more lead members formed in the conductive sheet, and the receiving chuck has a receiving portion alignable with the forming portion and shaped to closely conform to at least part of the forming portion. The conductive sheet is compressed between the forming chuck and the receiving chuck to mechanically pre-form the one or more lead members into one or more pre-formed conductive leads. In one embodiment, the raised forming portion includes a ridge having a polygonal cross-sectional shape and the receiving portion comprises a channel. Alternately, the raised forming portion includes a partially-pyramidal block and the receiving portion comprises a pocket.

US Patent:

6836003, Dec 28, 2004

Filed:

Mar 28, 2001

Appl. No.:

09/819874

Inventors:

David J. Corisis - Meridian ID
Tracy Reynolds - Boise ID
Michael Slaughter - Boise ID
Daniel Cram - Boise ID
Leland R. Nevill - Boise ID
Jerrold L. King - Morgan Hill CA

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 23495

US Classification:

257666

Abstract:

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

US Patent:

6858453, Feb 22, 2005

Filed:

Oct 12, 1999

Appl. No.:

09/416368

Inventors:

David J. Corisis - Meridian ID, US
Tracy Reynolds - Boise ID, US
Michael Slaughter - Boise ID, US
Daniel Cram - Boise ID, US
Leland R. Nevill - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

G01R031/26
H01L021/66
H01L021/00
H01L021/44
H01L021/48

US Classification:

438 15, 438106, 438112, 438123, 438127

Abstract:

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

US Patent:

6882034, Apr 19, 2005

Filed:

Aug 29, 2001

Appl. No.:

09/942183

Inventors:

David J. Corisis - Meridian ID, US
Jerry M. Brooks - Caldwell ID, US
Matt E. Schwab - Boise ID, US
Tracy V. Reynolds - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L023/495

US Classification:

257668, 257685, 257784, 257786, 257691

Abstract:

A routing element for use with a multichip module includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths that those provided by a multichip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.