Trang Thu Thai

US Patent:

20220278439, Sep 1, 2022

Filed:

May 9, 2022

Appl. No.:

17/739880

Inventors:

- Santa Clara CA, US
Jonathan Jensen - Portland OR, US
Ozgur Inac - Portland OR, US
Trang Thai - Hillsboro OR, US
William J. Lambert - Chandler AZ, US
Benjamin Jann - Hillsboro OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01Q 1/24
H01Q 9/04
H01Q 1/22

Abstract:

Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

US Patent:

20230035608, Feb 2, 2023

Filed:

Oct 7, 2022

Appl. No.:

17/938768

Inventors:

- Santa Clara CA, US
Trang Thai - Hillsboro OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01Q 1/22
H01Q 9/04
H01Q 21/06
H01L 23/66

Abstract:

Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

US Patent:

20210344116, Nov 4, 2021

Filed:

Jul 13, 2021

Appl. No.:

17/373926

Inventors:

- Santa Clara CA, US
Trang Thai - Hillsboro OR, US
William James Lambert - Chandler AZ, US
Zhichao Zhang - Chandler AZ, US
Jiwei Sun - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01Q 9/04
H01Q 1/22
H01Q 1/08

Abstract:

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

US Patent:

20200403316, Dec 24, 2020

Filed:

Sep 8, 2020

Appl. No.:

17/014081

Inventors:

- Santa Clara CA, US
Trang Thai - Hillsboro OR, US
William James Lambert - Chandler AZ, US
Zhichao Zhang - Chandler AZ, US
Jiwei Sun - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01Q 9/04
H01Q 1/22
H01Q 1/08

Abstract:

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

US Patent:

20200227811, Jul 16, 2020

Filed:

Jan 16, 2019

Appl. No.:

16/249559

Inventors:

- Santa Clara CA, US
JONATHAN C. JENSEN - Portland OR, US
TRANG THAI - Hillsboro OR, US
OZGUR INAC - Hillsboro OR, US

Assignee:

INTEL CORPORATION - Santa Clara CA

International Classification:

H01Q 1/22
H01Q 5/364
H01Q 9/04

Abstract:

An RF transceiver device, for use in an RF system, includes a chip package comprising one or more circuit components, a signal cable, and an antenna block. The signal cable is configured to carry signals sent to the chip package or received from the chip package. The signal cable has a first surface and a second surface. The chip package is directly coupled to the first surface of the signal cable. The antenna block comprises one or more antennas and is directly coupled to the second surface of the signal cable. By directly coupling the chip package and antenna block to the signal cable, bulky connectors are no longer needed thus reducing the total footprint of the transceiver device and increasing signal fidelity. The arrangement may be integrated with, for example, a PCB or a communication system.

US Patent:

20200203834, Jun 25, 2020

Filed:

Sep 30, 2017

Appl. No.:

16/643722

Inventors:

- Santa Clara CA, US
Sidharth Dalmia - Portland OR, US
Trang Thai - Hillsboro OR, US
Josef Hagn - Munich, DE
Richard S. Perry - Portland OR, US
Jonathan C. Jensen - Portland OR, US
Raanan Sover - Haifa, IL

Assignee:

INTEL CORPORATION - Santa Clara CA

International Classification:

H01Q 9/04
H01Q 1/24
H01Q 13/06

Abstract:

Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

US Patent:

20190372198, Dec 5, 2019

Filed:

May 29, 2018

Appl. No.:

15/991295

Inventors:

- Santa Clara CA, US
Trang Thai - Hillsboro OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01Q 1/22
H01Q 9/04
H01Q 21/06
H01L 23/66

Abstract:

Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

US Patent:

20190372229, Dec 5, 2019

Filed:

Jun 5, 2018

Appl. No.:

16/000795

Inventors:

- Santa Clara CA, US
Trang Thai - Hillsboro OR, US
William James Lambert - Chandler AZ, US
Zhichao Zhang - Chandler AZ, US
Jiwei Sun - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01Q 9/04
H01Q 1/08
H01Q 1/22

Abstract:

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.