Tu Tam Vu

age ~68

from Cupertino, CA

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Also known as:

Tu T Vu
Tu Lan Vu
Tu Tuan Vu
Tuan Tam Vu
Tuan T Vu
Yu T Vu
Tuan Tam Te Vu
Vu Tu Tam
Tam Vu Tu
Tam Vu

Connected to:

Tu Vu Phones & Addresses

Cupertino, CA
2328 Ben Hur Ct, San Jose, CA 95124 • (408)3717606
1377 Acadia Ave, Milpitas, CA 95035 • (408)9463170
Kenvir, KY
Fairborn, OH

Real Estate Brokers

Tu Vu, Anaheim Hlls Anaheim Agent

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Work:

Century 21 Superstars
(714)2443856 (Phone)
License #01276335

About:

I am a member of The Multiple Listing Service and Pacific West Association of Realtors and I am an eight year real estate professional in both residential and commercial real estate. I am dedicated to providing excellent service and unparalleled communication to my customers. I am a knowledgeable and experienced professional who deals with real estate transactions on a day-to-day basis in all areas of Orange, Los Angeles, Riverside, and San Bernardino Counties. I have established a work ethic of honesty, integrity and trust. I focus on making my clients' priorities as my own, and providing the best experience possible for each and every one of my clients by striving to fully understand my clients' wants and needs even before any contracts are signed. My energy and efforts are the results of my hard work and dedication to my practice and I take initiative to grow and diversify my skills in an ever-changing market by continuously staying abreast with the market conditions and keeping current with today's technology. Being a residential and commercial real estate professional over time has provided me with the skills, knowledge, experience and expertise that enable me to negotiate for my clients and close deals. I also work with other top professionals within the industry, such as escrow officers, title representatives and insurance companies. These other professionals are part of my team that I work with to ensure that my clients get the full benefits throughout the whole transaction. This has made me became a trusted member among my colleagues and a trusted member of the community. I have one clear mission in mind, and that is to provide exceptional service to my clients. This translates to hard work, commitment, compassion, attention to detail, closed transactions and a desire to go beyond the scope of my clients’ expectations.

Us Patents

Flipped Die Stacks With Multiple Rows Of Leadframe Interconnects
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US Patent:

20170179081, Jun 22, 2017
Filed:

Nov 22, 2016
Appl. No.:

15/358380
Inventors:

- San Jose CA, US
Belgacem Haba - Saratoga CA, US
Tu Tam Vu - San Jose CA, US
Rajesh Katkar - San Jose CA, US
International Classification:

H01L 25/065
H01L 23/495
Abstract:

Stacked microelectronic packages comprise microelectronic elements each having a contact-bearing front surface and edge surfaces extending away therefrom, and a dielectric encapsulation region contacting an edge surface. The encapsulation defines first and second major surfaces of the package and a remote surface between the major surfaces. Package contacts at the remote surface include a first set of contacts at positions closer to the first major surface than a second set of contacts, which instead are at positions closer to the second major surface. The packages are configured such that major surfaces of each package can be oriented in a nonparallel direction with the major surface of a substrate, the package contacts electrically coupled to corresponding contacts at the substrate surface. The package stacking and orientation can provide increased packing density.

Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
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US Patent:

20170170031, Jun 15, 2017
Filed:

Feb 27, 2017
Appl. No.:

15/443371
Inventors:

- San Jose CA, US
Rajesh Katkar - San Jose CA, US
Long Huynh - Santa Clara CA, US
Laura Wills Mirkarimi - Sunol CA, US
Bongsub Lee - Mountain View CA, US
Gabriel Z. Guevara - San Jose CA, US
Tu Tam Vu - San Jose CA, US
Kyong-Mo Bang - Fremont CA, US
Akash Agrawal - San Jose CA, US
Assignee:

Invensas Corporation - San Jose CA
International Classification:

H01L 21/56
H01L 21/683
H01L 21/768
H01L 25/00
H01L 21/304
H01L 23/29
H01L 25/065
H01L 21/02
H01L 23/00
Abstract:

Fan-out wafer-level packaging (WLP) using metal foil lamination is provided. An example wafer-level package incorporates a metal foil, such as copper (Cu), to relocate bonding pads in lieu of a conventional deposited or plated RDL. A polymer such as an epoxy layer adheres the metal foil to the package creating conductive contacts between the metal foil and metal pillars of a die. The metal foil may be patterned at different stages of a fabrication process. An example wafer-level package with metal foil provides relatively inexpensive electroplating-free traces that replace expensive RDL processes. Example techniques can reduce interfacial stress at fan-out areas to enhance package reliability, and enable smaller chips to be used. The metal foil provides improved fidelity of high frequency signals. The metal foil can be bonded to metallic pillar bumps before molding, resulting in less impact on the mold material.

Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
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US Patent:

20170103957, Apr 13, 2017
Filed:

Oct 7, 2015
Appl. No.:

14/877205
Inventors:

- San Jose CA, US
Rajesh Katkar - San Jose CA, US
Long Huynh - Santa Clara CA, US
Laura Wills Mirkarimi - Sunol CA, US
Bongsub Lee - Mountain View CA, US
Gabriel Z. Guevara - San Jose CA, US
Tu Tam Vu - San Jose CA, US
Kyong-Mo Bang - Fremont CA, US
Akash Agrawal - San Jose CA, US
Assignee:

Invensas Corporation - San Jose CA
International Classification:

H01L 23/00
H01L 21/683
H01L 23/29
H01L 21/56
H01L 21/304
H01L 23/538
H01L 21/02
H01L 21/768
Abstract:

Fan-out wafer-level packaging (WLP) using metal foil lamination is provided. An example wafer-level package incorporates a metal foil, such as copper (Cu), to relocate bonding pads in lieu of a conventional deposited or plated RDL. A polymer such as an epoxy layer adheres the metal foil to the package creating conductive contacts between the metal foil and metal pillars of a die. The metal foil may be patterned at different stages of a fabrication process. An example wafer-level package with metal foil provides relatively inexpensive electroplating-free traces that replace expensive RDL processes. Example techniques can reduce interfacial stress at fan-out areas to enhance package reliability, and enable smaller chips to be used. The metal foil provides improved fidelity of high frequency signals. The metal foil can be bonded to metallic pillar bumps before molding, resulting in less impact on the mold material.

Wafer-Level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
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US Patent:

20170069591, Mar 9, 2017
Filed:

Nov 21, 2016
Appl. No.:

15/357553
Inventors:

- San Jose CA, US
Tu Tam Vu - San Jose CA, US
Bongsub Lee - Mountain View CA, US
Kyong-Mo Bang - Fremont CA, US
Xuan Li - Santa Clara CA, US
Long Huynh - Santa Clara CA, US
Gabriel Z. Guevara - San Jose CA, US
Akash Agrawal - San Jose CA, US
Willmar Subido - San Jose CA, US
Laura Wills Mirkarimi - Sunol CA, US
Assignee:

Invensas Corporation - San Jose CA
International Classification:

H01L 23/00
H01L 25/065
H01L 21/78
H01L 25/10
H01L 23/31
H01L 21/56
Abstract:

An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Wafer-Level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
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US Patent:

20160322326, Nov 3, 2016
Filed:

Apr 30, 2015
Appl. No.:

14/701049
Inventors:

- San Jose CA, US
Tu Tam VU - San Jose CA, US
Bongsub LEE - Mountain View CA, US
Kyong-Mo BANG - Fremont CA, US
Xuan LI - Santa Clara CA, US
Long HUYNH - Santa Clara CA, US
Gabriel Z. GUEVARA - San Jose CA, US
Akash AGRAWAL - San Jose CA, US
Willmar SUBIDO - Garland TX, US
Laura Wills MIRKARIMI - Sunol CA, US
Assignee:

INVENSAS CORPORATION - San Jose CA
International Classification:

H01L 23/00
H01L 21/78
H01L 21/56
H01L 23/31
H01L 25/065
Abstract:

An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Name / Title

Company / Classification

Phones & Addresses

Tu Tuan (Adam) Vu
President

Envy Flooring Inc
Floor Coverings & Installation. Floor Laying. Refinishing & Resurfacing

5087 Prince Albert St, Vancouver, BC V5W 3C1
(604)7716879, (604)3243689

Tu Vu
Administrator

Advanced Analog.com
Regulation and Administration of Communicatio...

2270 Martin Ave, San Martin, CA 95046
Website: advancedanalog.com

Tu Tuan Vu
President

Envy Flooring Inc
Floor Coverings & Installation · Floor Laying · Refinishing & Resurfacing

(604)7716879, (604)3243689

Tu Vu
Principal

Tu D Vu
Business Services at Non-Commercial Site

2826 Glauser Dr, San Jose, CA 95133

License Records

Tu Ngoc Vu

License #:

MBR2229 - Expired

Category:

Barber Examiners

Issued Date:

Nov 8, 2004

Expiration Date:

Dec 31, 2016

Type:

Registered Barber

Tu Vu

License #:

E125927 - Active

Category:

Emergency medical services

Issued Date:

Oct 31, 2016

Expiration Date:

Mar 31, 2018

Type:

Sacramento County EMS Agency

Resumes

Bim Project Lead

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Location:

San Francisco, CA

Industry:

Construction

Work:

Southland Industries
Bim Project Lead
Rosendin Electric Sep 2008 - Mar 2017
Bim Manager, Corporate
Rosendin Electric Mar 2006 - Aug 2008
Bim Detailer

Skills:

Construction Management
Contractors
Project Estimation
Submittals
Construction
Autocad
Contract Management
Value Engineering
Pre Construction
Building Information Modeling
Renovation
Subcontracting
Leadership In Energy and Environmental Design
Change Orders
Process Scheduler
Bim
Construction Safety

Realtor

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Industry:

Real Estate

Work:

Green Equity
Realtor

Skills:

First Time Home Buyers
Reo
Buyer Representation
Relocation
Sellers
Short Sales
Single Family Homes
Real Estate Transactions
Residential Homes

Tu Vu

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Location:

San Francisco, CA

Industry:

Semiconductors

Work:

Xperi Corporation Nov 2013 - Dec 2017
Package and Mechanical Engineer
Broadcom Nov 2011 - Oct 2013
Principal Package Engineer
Idt - Integrated Device Technology, Inc. Jul 1990 - Nov 2010
Package Engineer Manager

Education:

University of Dayton

Skills:

Ic
Semiconductors
Semiconductor Industry
Manufacturing
Characterization
Engineering
Product Development
Product Engineering

Senior Rf Technician

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Location:

San Francisco, CA

Industry:

Wireless

Work:

Te Connectivity
Senior Rf Technician
Anritsu Feb 2011 - Apr 2011
Microwave Technician
Itt 1989 - 2010
Senior Rf and Systems Test Technician
Planar Microwave 1987 - 1989
Lead Senior Microwave Technician
Trw Microwave 1985 - 1987
Engineering Technician

Education:

Lakeshore Technical College

Skills:

Testing
Rf
Systems Engineering
Electronics
Troubleshooting
Receiver System Testing
Diagnostic Testing
Microwave
System Testing
Dod
Test Equipment
Iso
Engineering Management
Engineering

Tu Vu

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Tu Vu

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Laboratory Technician

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Work:

Laboratory Technician

Tu Vu

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Googleplus

Tu Vu

Work:

Trường MN Hồng Thái - GV (2005)

About:

Tutu tốt nghiệp trường CĐSP MGTW1 năm 2005, TN ĐHSP HN1 năm 2008, luôn yêu và mãi nhớ về gia đình 205a6 khu KT Xá nhà A trường CĐSPMG TƯ 1.

Tagline:

Tu Tu

Bragging Rights:

1 chồng và 2công chúa

Tu Vu

Work:

First National Bank of Wyoming

Education:

University of Wyoming

Tu Vu

Relationship:

Married

Tu Vu

Myspace

Tu Vu

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Gender:

Male

Birthday:

1937

Tu Vu

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Locality:

Arlington, Texas

Gender:

Male

Birthday:

1943

Tu Vu

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Locality:

Sacramento

Gender:

Male

Birthday:

1922

Tu Vu

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Gender:

Female

Birthday:

1950

tu vu

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Locality:

-1, Iceland

Gender:

Male

Birthday:

1942

Tu Vu

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Locality:

California

Gender:

Male

Birthday:

1940

Facebook

Tu Vu

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Tu Vu

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Tu Anh Vu

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Tu Anh Vu

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Tu Khuyen Vu

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Tu Tat Vu

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Tu Anh Vu

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Tu Vu

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Classmates

Tu Vu

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Schools:

Wakefield Forest Elementary School Fairfax VA 1985-1991

Tu Vu

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Schools:

georgia state univ Atlanta GA 1991-1995

Community:

Lorraine Williams, Tangelia King, Derrick Lumpkin

Tu Vu

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Schools:

McKenzie Junior High School Affton MO 1988-1992

Community:

Kevin Mceneny, Bill Clevlen, Tim Neilson, Patrick Stallings

Luan-vu Tu | Lake Braddoc...

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Wakefield Forest Elementa...

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Graduates:

Tu Vu (1985-1991),
Alisa Anderson (1972-1976),
Megan Nelson (1989-1996),
Kent Villavicencio (1992-1999)

McKenzie Junior High Scho...

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Graduates:

Zia Khan (1982-1986),
Maria Shkodriani (1979-1983),
Chris Siekerman (1983-1987),
Tu Vu (1988-1992),
Alvin Darden (1983-1986),
Ebony Pampkin (1992-1996)