- San Jose CA, US Ken Wang - Milpitas CA, US Tian Tian - Milpitas CA, US Mohammad Ayyash - San Jose CA, US Tuyen Pham - San Jose CA, US Brian Rush - Southlake TX, US
International Classification:
H01L 23/00 H01L 23/29 H01L 23/31 H01L 23/495
Abstract:
A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.
Elaine Morrison (1978-1981), Susan Sitton (1970-1977), James Radcliffe (1967-1968), Jeff Rubin (1980-1980), Tuyen Pham (1987-1991), Michael Gottlieb (1961-1966)