Tuyen N Pham

US Patent:

20150364431, Dec 17, 2015

Filed:

Sep 26, 2014

Appl. No.:

14/497707

Inventors:

- San Jose CA, US
Ken Wang - Milpitas CA, US
Tian Tian - Milpitas CA, US
Mohammad Ayyash - San Jose CA, US
Tuyen Pham - San Jose CA, US
Brian Rush - Southlake TX, US

International Classification:

H01L 23/00
H01L 23/29
H01L 23/31
H01L 23/495

Abstract:

A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.