Vernon M Brown

US Patent:

44133081, Nov 1, 1983

Filed:

Aug 31, 1981

Appl. No.:

6/297862

Inventors:

Vernon L. Brown - Boulder CO

Assignee:

Bell Telephone Laboratories, Incorporated - Murray Hill NJ

International Classification:

H05K 114

US Classification:

361398

Abstract:

A mounting arrangement for an integrated circuit leadless chip carrier (13) for providing compliance to prevent solder joint failures due to stress and differential thermal expansion. A supporting substrate board (10, 20, 30) has bonded to one surface a flexible sheet (11) carrying printed wiring (12) to which the carrier (13) is electrically connected by means of solder pedestals (19). At each of the latter connections the board (10, 20, 30) presents recesses (15, 22, 31a, 33a) over which the sheet (11) is freely suspended to provide free sheet portions (18) which absorb the stress and differential expansion to protect the solder connections.

US Patent:

41793226, Dec 18, 1979

Filed:

Mar 28, 1978

Appl. No.:

5/891038

Inventors:

Vernon L. Brown - Boulder CO
Wade H. Greenwood - Northglenn CO
Gary L. Griffith - Arvada CO

Assignee:

Bell Telephone Laboratories, Incorporated - Murray Hill NJ

International Classification:

H01R 900
B65H 8100

US Classification:

156192

Abstract:

Apparatus and a method are disclosed for making bondable finger contacts (101) for application to printed circuit boards. The finger contacts are formed from a thin strip (102) of electrically conductive material. Following the application of a thin layer of contact metal (201) to the contact area, a strip of adhesive tape (109) is applied to the plated side of the contacts to protect the contacts, to interconnect and support them during subsequent handling, and to provide a compliant surface which aids in the application of the contacts to a circuit board. On an opposite side of the contacts there is applied a thermally curable adhesive (301) which, when brought into pressure contact with the circuit board and a moderate amount of heat is applied, will fasten the contacts to the board.

US Patent:

42160510, Aug 5, 1980

Filed:

Jul 11, 1979

Appl. No.:

6/056534

Inventors:

Vernon L. Brown - Boulder CO
Wade H. Greenwood - Northglenn CO
Gary L. Griffith - Arvada CO

Assignee:

Bell Telephone Laboratories, Incorporated - Murray Hill NJ

International Classification:

B32B 3100
B31F 500
B65C 1104

US Classification:

156499

Abstract:

Apparatus is disclosed for making bondable finger contacts (101) for application to printed circuit boards. The finger contacts are formed from a thin strip (102) of electrically conductive material. Following the application of a thin layer of contact metal (201) to the contact area, a strip of adhesive tape (109) is applied to the plated side of the contacts to protect the contacts, to interconnect and support them during subsequent handling, and to provide a compliant surface which aids in the application of the contacts to a circuit board. On an opposite side of the contacts there is applied a thermally curable adhesive (301) which, when brought into pressure contact with the circuit board and a moderate amount of heat is applied, will fasten the contacts to the board.

US Patent:

39965147, Dec 7, 1976

Filed:

Nov 21, 1975

Appl. No.:

5/634254

Inventors:

Vernon Letchworth Brown - Boulder CO
Leo Carrillo - Denver CO
Nawal Kishore Sharma - Broomfield CO

Assignee:

Bell Telephone Laboratories, Incorporated - Murray Hill NJ

International Classification:

G01R 2702

US Classification:

324 62

Abstract:

Measurement of the contact resistance between printed circuit patterns on a circuit board and contacts within a circuit board connector is facilitated by apparatus for gaining access to the measurement points without disruption of the electrical connections between the circuit board and the connector. The apparatus includes an electrically insulated handle to which is affixed a pair of finger probes and a pair of length-adjustable pogo probes. The finger probes engage a conductor finger on the circuit board and make electrical contact therewith. Correspondingly, the pogo probes engage a contact within the connector and make electrical contact with it. Application of a known constant current through one finger and one pogo probe and measurement of the voltage appearing between the other finger and pogo probe yields the contact resistance between the conductor finger and the connector contact without disruption of the electrical connection therebetween.