Blessing Physician Services 927 Broadway St Suite 302, Quincy, IL 62301
Blessing Hospital - 11th Street Broadway At 11Th Street And 14Th Street, Quincy, IL 62305
Education:
Medical School American University of Beirut / Faculty of Medicine Medical School Berkshire Med Center Medical School University Iowa Hosps and Clinics
Dr. Hafez graduated from the American University of Beirut, Faculty of Medicine, Beirut, Lebanon in 1972. He works in Quincy, IL and specializes in Neurology. Dr. Hafez is affiliated with Blessing Hospital.
Walid Hafez, Quincy IL
Work:
Blessing Physician Services
927 Broadway St, Quincy, IL 62301 Midwest Family Medical Care
630 Locust St, Carthage, IL 62321
American Board of Psychiatry and Neurology Certification in Neurology (Psychiatry and Neurology) American Board of Psychiatry and Neurology Sub-certificate in Sleep Medicine (Psychiatry and Neurology)
In 2003, Milton Feng and his graduate students Walid Hafez and Jie-Wei Lai broke the record for the world's fastest transistor. Their device, made of indium ...
Walid M. Hafez - Portland OR, US Chia-Hong Jan - Portland OR, US Chetan Prasad - Hillsboro OR, US Sangwoo Pae - Beaverton OR, US Zhanping Chen - Portland OR, US Anisur Rahman - Hillsboro OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/82
US Classification:
438132, 438131, 438215, 438281, 257E21592
Abstract:
A programmable anti-fuse element includes a substrate (), an N-well () in the substrate, an electrically insulating layer () over the N-well, and a gate electrode () over the electrically insulating layer. The gate electrode has n-type doping so that the N-well is able to substantially contain within its boundaries a current generated following a programming event of the programmable anti-fuse element. In the same or another embodiment, a twice-programmable fuse element () includes a metal gate fuse () and an oxide anti-fuse () such as the programmable anti-fuse element just described.
Penetrating Implant For Forming A Semiconductor Device
Giuseppe Curello - Portland OR, US Ian R. Post - Portland OR, US Nick Lindert - Beaverton OR, US Walid M. Hafez - Portland OR, US Chia-Hong Jan - Portland OR, US Mark T. Bohr - Aloha OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 29/66 H01L 21/02
US Classification:
257402, 257 48, 257607, 257E29109, 257E29255
Abstract:
A semiconductor device and method to form a semiconductor device is described. The semiconductor includes a gate stack disposed on a substrate. Tip regions are disposed in the substrate on either side of the gate stack. Halo regions are disposed in the substrate adjacent the tip regions. A threshold voltage implant region is disposed in the substrate directly below the gate stack. The concentration of dopant impurity atoms of a particular conductivity type is approximately the same in both the threshold voltage implant region as in the halo regions. The method includes a dopant impurity implant technique having sufficient strength to penetrate a gate stack.
Memory Cell Using Bti Effects In High-K Metal Gate Mos
Techniques and circuitry are disclosed for implementing non-volatile storage that exploit bias temperature instability (BTI) effects of high-k/metal-gate n-type or p-type metal oxide semiconductor (NMOS or PMOS) transistors. A programmed bitcell of, for example, a memory or programmable logic circuit exhibits a threshold voltage shift resulting from an applied programming bias used to program bitcells. In some cases, applying a first programming bias causes the device to have a first state, and applying a second programming bias causes the device to have a second state that is different than the first state. Programmed bitcells can be erased by applying an opposite polarity stress, and re-programmed through multiple cycles. The bitcell configuration can be used in conjunction with column/row select circuitry and/or readout circuitry, in accordance with some embodiments.
High-Voltage Transistor Architectures, Processes Of Forming Same, And Systems Containing Same
Walid M. Hafez - Portland OR, US Chia-Hong Jan - Portland OR, US Anisur Rahman - Hillsboro OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 29/76
US Classification:
257337, 257E2159, 257E2706, 257408
Abstract:
An apparatus includes a first device with a metal gate and a drain well that experiences a series resistance that drops a drain contact voltage from 10 V to 4-6 V at a junction between the drain well and a channel under the gate. The apparatus includes an interlayer dielectric layer (ILD0) disposed above and on the drain well and a salicide drain contact in the drain well. The apparatus also includes a subsequent device that is located in a region different from the first device that operates at a voltage lower than the first device.
Methods Of Forming Secured Metal Gate Antifuse Structures
Xianghong Tong - Hillsboro OR, US Zhanping Chen - Hillsboro OR, US Walid M. Hafez - Portland OR, US Zhiyong Ma - Hillsboro OR, US Sarvesh H. Kulkarni - Hillsboro OR, US Kevin X. Zhang - Portland OR, US Matthew B. Pedersen - Beaverton OR, US Kevin D. Johnson - Hillsboro OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 27/11 H01L 21/02 H01L 23/52
US Classification:
257379, 257408, 257529, 257530
Abstract:
Methods of forming and using a microelectronic structure are described. Embodiments include forming a diode between a metal fuse gate and a PMOS device, wherein the diode is disposed between a contact of the metal fuse gate and a contact of the PMOS device, and wherein the diode couples the contact of the metal fuse gate to the contact of the PMOS device.
Milton Feng - Champaign IL, US Nick Holonyak - Urbana IL, US Walid Hafez - Champaign IL, US
International Classification:
H01L031/0328
US Classification:
257198000
Abstract:
A method for producing controllable light emission from a semiconductor device includes the following steps: providing a heterojunction bipolar transistor device that includes collector, base, and emitter regions; and applying electrical signals across terminals coupled with the collector, base, and emitter regions to cause light emission by radiative recombination in the base region. In a disclosed embodiment, the step of applying electrical signals includes applying a collector-to-emitter voltage and modulating light output by applying a modulating base current.
Nick Lindert - Beaverton OR, US Walid Mac Hafez - Portland OR, US
International Classification:
H01L 29/778 H01L 21/335
US Classification:
257190, 438164, 257E21403, 257E29246
Abstract:
A semiconductor device comprises a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate, wherein the semiconductor body comprises a silicon alloy core having a top surface and laterally opposite sidewalls formed on a silicon fin structure, and a silicon shell layer formed on the top surface and the laterally opposite sidewalls of the silicon alloy core, wherein the silicon alloy core imparts a strain on the silicon shell layer. The semiconductor device further comprises a gate dielectric layer formed on the top surface and the laterally opposite sidewalls of the semiconductor body and a gate electrode formed on the gate dielectric layer.
Penetrating Implant For Forming A Semiconductor Device
Giuseppe Curello - Portland OR, US Ian R. Post - Portland OR, US Nick Lindert - Beaverton OR, US Walid M. Hafez - Portland OR, US Chia-Hong Jan - Portland OR, US Mark T. Bohr - Aloha OR, US
A semiconductor device and method to form a semiconductor device is described. The semiconductor includes a gate stack disposed on a substrate. Tip regions are disposed in the substrate on either side of the gate stack. Halo regions are disposed in the substrate adjacent the tip regions. A threshold voltage implant region is disposed in the substrate directly below the gate stack. The concentration of dopant impurity atoms of a particular conductivity type is approximately the same in both the threshold voltage implant region as in the halo regions. The method includes a dopant impurity implant technique having sufficient strength to penetrate a gate stack.
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