Wei Li

US Patent:

20220310566, Sep 29, 2022

Filed:

Mar 26, 2021

Appl. No.:

17/214083

Inventors:

- Santa Clara CA, US
Wei LI - Chandler AZ, US
Santosh SHAW - Chandler AZ, US
Jingyi HUANG - Chandler AZ, US

International Classification:

H01L 25/075
H01L 33/62
G02B 6/42
G02B 6/12
H01L 33/58

Abstract:

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

US Patent:

20210391295, Dec 16, 2021

Filed:

Jun 16, 2020

Appl. No.:

16/902927

Inventors:

- Santa Clara CA, US
Nitin A. Deshpande - Chandler AZ, US
Mohit Bhatia - Chandler AZ, US
Sairam Agraharam - Chandler AZ, US
Edvin Cetegen - Chandler AZ, US
Anurag Tripathi - Gilbert AZ, US
Jan Krajniak - Mesa AZ, US
Manish Dubey - Chandler AZ, US
Jinhe Liu - Chandler AZ, US
Wei Li - Chandler AZ, US
Jingyi Huang - Chandler, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/00
H01L 23/538
H01L 23/498

Abstract:

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

US Patent:

20210343677, Nov 4, 2021

Filed:

Apr 29, 2020

Appl. No.:

16/862287

Inventors:

- Santa Clara CA, US
Taylor William Gaines - Chandler AZ, US
Edvin Cetegen - Chandler AZ, US
Wei Li - Chandler AZ, US
Hsin-Yu Li - Chandler AZ, US
Tony Dambrauskas - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/00
H01L 23/31
H01L 23/29

Abstract:

Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

US Patent:

20210249322, Aug 12, 2021

Filed:

Feb 11, 2020

Appl. No.:

16/788186

Inventors:

- Santa Clara CA, US
Vipul Mehta - Chandler AZ, US
Wei Li - Chandler AZ, US
Edvin Cetegen - Chandler AZ, US
Xavier Brun - Hillsboro OR, US
Yang Guo - Chandler AZ, US
Soud Choudhury - Chandler AZ, US
Shan Zhong - Chandler AZ, US
Christopher Rumer - Chander AZ, US
Nai-Yuan Liu - Chandler AZ, US
Ifeanyi Okafor - Chandler AZ, US
Hsin-Wei Wang - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/31
H01L 23/367
H01L 23/00

Abstract:

An integrated circuit assembly may be formed comprising an electronic substrate, a first and second integrated circuit device each having a first surface, a second surface, at least one side extending between the first and second surface, and an edge defined at an intersection of the second surface and the at least one side of each respective integrated circuit device, wherein the first surface of each integrated circuit device is electrically attached to the electronic substrate, an underfill material between the first surface of each integrated circuit device and the electronic substrate, and between the sides of the first and second integrated circuit devices, and at least one barrier structure adjacent at least one of the edge of first integrated circuit device and the edge of the second integrated circuit device, wherein the underfill material abuts the at least one barrier structure.

US Patent:

20200331897, Oct 22, 2020

Filed:

Feb 21, 2020

Appl. No.:

16/797744

Inventors:

- Omaha NE, US
- Fort Collins CO, US
Mary Jackson - Fort Collins CO, US
Wei Li - Fort Collins CO, US

Assignee:

Creighton University - Omaha NE
Colorado State University Research Foundation - Fort Collins CO

International Classification:

C07D 405/14
C07F 5/02
G01N 33/50

Abstract:

The present application provides detectable compounds useful for identifying compounds that bind (e.g., inhibit) MmpL3. Methods of identifying compounds that bind and/or inhibit MmpL3 are also provided.