Wei Jin Li

US Patent:

20230074583, Mar 9, 2023

Filed:

Nov 7, 2022

Appl. No.:

17/982217

Inventors:

- Wilmington DE, US
John Donald Summers - Hapel Hill NC, US
Nora Sabina Radu - Landenburg PA, US
Chai Kit Ngai - Chadds ford PA, US
Wayne Atkinson - New Castle, DE
Wei Li - Middletown DE, US
Jonathan Timothy Maeyer - Haddonfield NJ, US

International Classification:

C08G 73/10
C08J 5/18
G02B 1/04
G02F 1/1333

Abstract:

Disclosed is a polyimide film that exhibits: an in-plane coefficient of thermal expansion (CTE) that is less than 75 ppm/ C. between 50 C. and 250 C.; a glass transition temperature (T) that is greater than 250 C. for the polyimide film cured at 260 C. in air; a 1% TGA weight loss temperature that is greater than 450 C.; a tensile modulus that is between 1.5 GPa and 5.0 GPa; an elongation to break that is greater than 20%; an optical retardation at 550 nm that is less than 100 nm for a 10-μm film; a birefringence at 633 nm that is less than 0.002; a haze that is less than 1.0%; a b* that is less than 3; a yellowness index that is less than 5; and an average transmittance between 380 nm and 780 nm that is greater than 88%.

US Patent:

20200216614, Jul 9, 2020

Filed:

Sep 11, 2018

Appl. No.:

16/648183

Inventors:

- Wilmington DE, US
John Donald Summers - Chapel Hill NC, US
Nora Sabina Radu - Landenberg PA, US
Chai Kit Ngai - Wilmington DE, US
Wayne Atkinson - New Castle DE, US
Wei Li - Middletown DE, US
Jonathan Timothy Maeyer - Haddonfield NJ, US

International Classification:

C08G 73/10
C08J 5/18
G02B 1/04
G02F 1/1333

Abstract:

Disclosed is a polyimide film generated from a solution containing a polyamic acid in a high-boiling, aprotic solvent; wherein the polyamic acid comprises one or more tetracarboxylic acid components and one or more diamine components; and wherein at least one of the tetracarboxylic acid components is a quadrivalent organic group derived from a bent dianhydride or an aromatic dianhydride comprising —O—, —CO—, —NHCO—, —S—, —SO—, —CO—O—, or —CR— links, or a direct chemical bond between aromatic rings; and wherein at least one of the diamine components is a divalent organic group derived from a bent diamine or an aromatic diamine comprising the same links, or a direct chemical bond between aromatic rings; and wherein R is the same or different at each occurrence and is selected from the group consisting of H, F, alkyl, and fluoroalkyl.

US Patent:

20200172675, Jun 4, 2020

Filed:

Aug 8, 2018

Appl. No.:

16/637897

Inventors:

- Wilmington DE, US
John Donald Summers - Chapel Hill NC, US
Brian C. Auman - Avondale PA, US
Wayne Atkinson - New Castle DE, US
Wei Li - Middletown DE, US
Chai Kit Ngai - Wilmington DE, US

International Classification:

C08G 73/10
C08J 5/18
H01L 27/32
H01L 51/00
H01L 51/52

Abstract:

Disclosed is a solution containing a polyamic acid in a high-boiling, aprotic solvent; wherein the polyamic acid contains two or more tetracarboxylic acid components and one or more diamine components; and wherein at least one of the tetracarboxylic acid components is a quadrivalent organic group derived from an aliphatic dianhydride. Polyimide films made from the solutions are also disclosed, as are their methods of production and uses in electronic devices.