William R Brasch

US Patent:

20040253450, Dec 16, 2004

Filed:

Oct 29, 2003

Appl. No.:

10/696552

Inventors:

Masaru Seita - Kitaadachi-gun, JP
Hideki Tsuchida - Hasuda-shi, JP
Masaaki Imanari - Misato-shi, JP
Yoshihiro Sugita - Kitaadachi-gun, JP
Andre Egli - Richterswll, CH
William Brasch - Sarasota FL, US

Assignee:

Shipley Company, L.L.C. - Marlborough MA

International Classification:

B32B009/04
B05D001/18

US Classification:

428/411100, 427/430100

Abstract:

This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-tin catalyst on a resin substrate, and then treating said resin substrate having the catalyst deposited thereon with a formaldehyde-free electroless copper plating solution that contains copper ions and a reducing agent, wherein the need for an accelerating treatment of a catalyst after said catalyst depositing treatment is obviated. The productivity of a copper-resin composite material is dramatically enhanced by the process of the present invention, because a copper thin layer can be formed on the resin substrate in a short time, even if an accelerating treatment for a catalyst is not performed in a separate process.

US Patent:

48774502, Oct 31, 1989

Filed:

Feb 23, 1989

Appl. No.:

7/314537

Inventors:

William R. Brasch - Nesconset NY

Assignee:

LeaRonal, Inc. - Freeport NY

International Classification:

C23C 302
C23C 1600

US Classification:

106 126

Abstract:

This invention relates to a formaldehyde-free electroless copper plating solution, containing a solution soluble divalent copper compound in a concentration between about 1/2 and 2 g/l; a reducing agent for the copper compound in an amount of between about 1 and 3 g/l; a complexing and chelating agent mixture of between about 5 and 100 ml/l of an alkanol amine having at least one alkyl group with one to three carbon atoms and between about 1 and 10 g/l of an ethylene diamine compound of the formula ##STR1## wherein R is an alkyl moiety having between 1 and 3 carbon atoms and X is --OH or --COOH; the solution preferably having a pH between about 7 and 8. 5 and a temperature preferably between about 130. degree. and 150. degree. F. , with the complexing and chelating agent mixture being present to provide stability to the solution and to enable the solution to provide a uniform plating rate of copper upon a substrate which is immersed therein.

US Patent:

RE355135, May 20, 1997

Filed:

Apr 10, 1996

Appl. No.:

8/633271

Inventors:

Fred I. Nobel - Sands Point NY
William R. Brasch - Nesconset NY
Anthony J. Drago - East Islip NY

Assignee:

Learonal, Inc. - Freeport NY

International Classification:

C25D 338

US Classification:

205263

Abstract:

A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO. sub. 2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.

US Patent:

57500185, May 12, 1998

Filed:

Mar 18, 1997

Appl. No.:

8/819061

Inventors:

William R. Brasch - Nesconset NY

Assignee:

LeaRonal, Inc. - Freeport NY

International Classification:

C25D 338

US Classification:

205295

Abstract:

A substantially cyanide-free plating solution for depositing copper from the monovalent ionic state, which includes monovalent copper ion, a reducing agent capable of reducing divalent copper ions to monovalent copper ions, an alkali material in an amount sufficient to maintain the pH of the solution in the range of about 7 to about 10, and a complexing agent of an imide, such as succinimide, 3-methyl-3-ethyl succinimide, 3-methyl succinimide, 3-ethyl succinimide, 3,3,4,4-tetramethyl succinimide, or 3,3,4-trimethyl succinimide, or a hydantoin, such as dimethyl hydantoin. The substantially cyanide-free plating solutions may also include at least one of a conductivity salt, an additive to promote brightness, or an alloying metal. The reducing agent may be an alkali sulfite, alkali bisulfite, hydroxylamine, or hydrazine. The copper is typically provided in the form of CuCl, CuCl. sub. 2, CuSO. sub. 4, or Cu. sub.

US Patent:

47599529, Jul 26, 1988

Filed:

Aug 20, 1986

Appl. No.:

6/898073

Inventors:

William R. Brasch - Nesconset NY
Carlo Favini - Milan, IT

Assignee:

LeaRonal, Inc. - Freeport NY

International Classification:

B05D 512

US Classification:

427 98

Abstract:

The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

US Patent:

47613041, Aug 2, 1988

Filed:

Feb 24, 1987

Appl. No.:

7/017413

Inventors:

William R. Brasch - Nesconset NY
Carlo Favini - Milan, IT

Assignee:

LeaRonal, Inc. - Freeport NY

International Classification:

B05D 512

US Classification:

427 98

Abstract:

The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

US Patent:

55229727, Jun 4, 1996

Filed:

Jul 19, 1994

Appl. No.:

8/277339

Inventors:

Fred I. Nobel - Sands Point NY
William Brasch - Nesconset NY
Donald Thomson - Northport NY
Luis H. Garay - Rockville Centre NY

Assignee:

LeaRonal, Inc. - Freeport NY

International Classification:

C25B 100

US Classification:

205488

Abstract:

A method for preparing nickel hypophosphite by contacting a nickel anode with a solution of hypophosphite anions and applying a current through the anode to a counter-electrode in contact with the solution to anodically dissolve the nickel of the anode into the hypophosphite solution, thereby forming a nickel hypophosphite solution. A one-compartment electrolysis cell and a three-or-more-compartment electrodialysis cell embodying the method of the invention are described.

US Patent:

54805171, Jan 2, 1996

Filed:

Sep 16, 1994

Appl. No.:

8/307923

Inventors:

Fred I. Nobel - Sands Point NY
William Brasch - Nesconset NY
Donald Thomson - Northport NY
Luis H. Garay - Rockville Centre NY

Assignee:

LeaRonal Inc. - Freeport NY

International Classification:

C25B 122

US Classification:

204103

Abstract:

Methods for preparing hypophosphorous acid are disclosed comprising contacting an insoluble anode with an aqueous solution of hypophosphite anions and applying a current through the insoluble anode to a cathode in electrical contact with the aqueous solution to generate H+ ions in the aqueous solution thereby forming a hypophosphorous acid solution.